Abstract: A keyswitch structure includes a base, a keycap, a lift mechanism and a light-emitting part. The lift mechanism includes a first support, a second support, and a spring structure. The first support and the second support are connected to and between the base and the keycap, so that the keycap can move relative to the base in a vertical direction. The spring structure is a single structural part and is connected to the first support and the second support and drives the first support and the second support to lift the keycap in the vertical direction. The lift mechanism as a whole defines a central space that extends through the whole lift mechanism in the vertical direction. The spring structure does not enter the central space. The light-emitting part is disposed on the base corresponding to the central zone, and emits light to illuminate the keycap.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.

Abstract: A keyswitch structure includes a casing, a first support, a second support, and a pressing stem. The casing forms an accommodating space and an opening communicating with the accommodating space. The first and second supports are disposed in the accommodating space and are directly and rotatably connected with the casing; the supports are also pivotally connected with each other. The pressing stem extends into the accommodating space to be rotatably connected with the first and second supports and protrudes from the casing through the opening. The pressing stem is movable parallel to a vertical direction relative to the casing through the first and second supports. A motion of the pressing stem in the vertical direction has a top dead center and a bottom dead center. When the pressing stem is at the top dead center and the bottom dead center, it does not touch the casing in the vertical direction.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A keyswitch structure includes a keycap support mechanism and a keycap that is supported by the keycap support mechanism in a vertical direction. The keycap support mechanism includes a base and two supports. The base has two sliding slots. Each sliding slot has an opening in a horizontal direction and an obstruction block at the opening. The horizontal direction is perpendicular to the vertical direction. Each support has a sliding portion and a linkage portion. The sliding portions slide parallel to the horizontal direction in the sliding slots correspondingly. The obstruction block prevents the corresponding sliding portion from disengaging from the corresponding sliding slot. The two linkage portions push against each other in line contact, so that the two supports are mutually driven through the two linkage portions.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A transition structure disposed in a package is disclosed. The transition structure comprises a first ground lead and a second ground lead; and a signal lead, disposed between the first ground lead and the second ground lead, wherein the first ground lead and the second ground lead have an exterior edge and an interior edge, the signal lead is coupled to a metal line formed on a printed circuit board (PCB) and a signal terminal of the die within the package; wherein an exterior gap formed between the first ground lead and the second ground lead at the exterior edge is wider than an interior gap formed between the first ground lead and the second ground lead at the interior edge.

Abstract: A transition structure disposed in a package is disclosed. The transition structure comprises a first ground lead and a second ground lead; and a signal lead, disposed between the first ground lead and the second ground lead, wherein the first ground lead and the second ground lead have an exterior edge and an interior edge, the signal lead is coupled to a metal line formed on a printed circuit board (PCB) and a signal terminal of the die within the package; wherein an exterior gap formed between the first ground lead and the second ground lead at the exterior edge is wider than an interior gap formed between the first ground lead and the second ground lead at the interior edge.

Abstract: The present invention provides an automatic detecting device for radio frequency environment used to detect radio frequency noise. The device uses an antenna to receive radio frequency noise and the radio frequency noise is passing a radio frequency comparator and transformed into a voltage signal. Then, the voltage signal passes through an amplifier and is amplified to be an output voltage. If the output voltage exceeds a threshold voltage, it drives a post stage circuit to warn when the radio frequency noise is beyond a normal value.

Abstract: The invention relates to a device interface board for testing chips, which is cooperatively installed with one of a plurality of probe cards. Each of the plurality of probe cards is provided with a specified wiring area and a first public signal area, the specified wiring area being electrically connected with the first public signal area. The first public signal area of each of the plurality of probe cards is located in a same particular area, and the specified wiring area of each of the plurality of probe cards is electrically connected with a testing jig and is different depending on a different testing jig.

Abstract: The present invention provides an automatic detecting device for radio frequency environment used to detect radio frequency noise. The device uses an antenna to receive radio frequency noise and the radio frequency noise is passing a radio frequency comparator and transformed into a voltage signal. Then, the voltage signal passes through an amplifier and is amplified to be an output voltage. If the output voltage exceeds a threshold voltage, it drives a post stage circuit to warn when the radio frequency noise is beyond a normal value.

Abstract: A device and method for investigating the IC (integrated circuit) testing environment is disclosed herein. The investigative device comprises a loadboard, a socket and an antenna. The loadboard is disposed in the bottom of the investigative device. The socket is disposed over the loadboard. The socket is used to fasten the element under test (such as IC) and the element under test is electrically connected to the loadboard. The antenna is also disposed in a position over the loadboard and closed to the socket. The purpose to dispose the antenna is to receive the wireless signal and monitor the testing environment if there is too much noise around the testing environment to jam the IC testing.

Abstract: The invention relates to a device interface board for testing chips, which is cooperatively installed with one of a plurality of probe cards. Each of the plurality of probe cards is provided with a specified wiring area and a first public signal area, the specified wiring area being electrically connected with the first public signal area. The first public signal area of each of the plurality of probe cards is located in a same particular area, and the specified wiring area of each of the plurality of probe cards is electrically connected with a testing jig and is different depending on a different testing jig.