Abstract: The disclosure provides waveguide structure, circuit board and manufacturing method of the circuit board. The waveguide structure includes dielectric layer, first and second metal layers, first conductive through vias and second conductive through via. The first and second metal layers are disposed on two opposite sides of dielectric layer, respectively. The first metal layer has bottom surface, top surface and notches. The notches penetrate through bottom surface and top surface. The notches together form connecting area in a symmetric polygonal shape. The first metal layer is configured to be connected to the antenna in the connecting area. The first and second conductive through vias are disposed in the dielectric layer and electrically connect the first metal layer and the second metal layer. The first conductive through vias are arranged around the connecting area. The second conductive through via is located in at least one gap between adjacent notches.

Abstract: A circuit board device for transmitting signals at a frequency of 50 GHz to 300 GHz is provided. The circuit board device includes an insulating portion, first and second interlayer conduction structures passing through the insulating portion, a first reference layer, and a second reference layer. The first interlayer conduction structure defines a signal path and includes a first pillar including first end portions and a first central section. The first thickness of the first end portions is greater than the second thickness of the first central section. The first and second reference layers are located on top and bottom surfaces of the insulating portion and surround the first interlayer conduction structure. Two opposite second end surfaces of the second interlayer conduction structure are respectively connected to the first reference layer and the second reference layer to define a ground path surrounding the signal path.

Abstract: A circuit board device for transmitting signals at a frequency of 50 GHz to 300 GHz is provided. The circuit board device includes an insulating portion, first and second interlayer conduction structures passing through the insulating portion, a first reference layer, and a second reference layer. The first interlayer conduction structure defines a signal path and includes a first pillar including first end portions and a first central section. The first thickness of the first end portions is greater than the second thickness of the first central section. The first and second reference layers are located on top and bottom surfaces of the insulating portion and surround the first interlayer conduction structure. Two opposite second end surfaces of the second interlayer conduction structure are respectively connected to the first reference layer and the second reference layer to define a ground path surrounding the signal path.