Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: Provided are a package structure having stacked semiconductor dies with wavy sidewalls and a method of forming the same. The package structure includes: a first die and a second die bonded together; a first encapsulant laterally encapsulating the first die; and a second encapsulant laterally encapsulating the second die, wherein a second interface of the second die in contact with the second encapsulant is a wavy interface in a cross-sectional plane.

Abstract: A light emitting diode includes a substrate, a plurality of pillar structures, a filler structure, a transparent conductive layer, a first electrode, and a second electrode. These pillar structures are formed on the substrate. Each of the pillar structures includes a first type semiconductor layer, an active layer, and a second type semiconductor layer. The first type semiconductor layers are formed on the substrate. The pillar structures are electrically connected with each other through the first type semiconductor layers. The filler structure is formed between the pillar structures. The filler structure and the second type semiconductor layers of the pillar structures are covered with the transparent conductive layer. The first electrode is in contact with the transparent conductive layer. The second electrode is in contact with the first type semiconductor layer.

Abstract: A light emitting diode includes a substrate, a plurality of pillar structures, a filler structure, a transparent conductive layer, a first electrode, and a second electrode. These pillar structures are formed on the substrate. Each of the pillar structures includes a first type semiconductor layer, an active layer, and a second type semiconductor layer. The first type semiconductor layers are formed on the substrate. The pillar structures are electrically connected with each other through the first type semiconductor layers. The filler structure is formed between the pillar structures. The filler structure and the second type semiconductor layers of the pillar structures are covered with the transparent conductive layer. The first electrode is in contact with the transparent conductive layer. The second electrode is in contact with the first type semiconductor layer.

Abstract: A color noise suppressing system, which has a converter, a saturation compute device, a maximum compute device, and a chroma suppressor. The converter converts a YUV image signal into an RGB image signal. The saturation compute device is connected to the converter for computing a saturation from the RGB image signal and converting the saturation into a first gain. The maximum compute device is connected to the converter for computing a maximum from the RGB image signal and converting the maximum into a second gain. The chroma suppressor is connected to the saturation compute device and the maximum compute device for performing chroma suppression on the YUV image signal according to the first and second gains.

Abstract: A memory card connector for mounting on a printed circuit board to electrically connect with a memory card, includes an insulative housing being generally a flat cuboid with a lower wall and three side walls thereby defining a receiving space with an opening end. A plurality of receiving grooves is defined in the lower wall. A plurality of terminals is received in the receiving grooves of the housing. Each terminal has a contact portion, an interferential portion and a soldering portion. The soldering portion is located at the opening end of the housing. The contact portion is away from the opening end of the housing and slightly projects from the receiving groove. A shielding plate is covered on the housing. The shielding plate and the lower wall receiving the contact portions of the terminals cooperatively define an insertion slot.