Patents by Inventor Chen Yi Gao

Chen Yi Gao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bond and redistribution layer process
    Patent number: 7781870
    Abstract: A semiconductor device comprises a copper redistribution line, a copper inductor and aluminum wire bond pads and the integration of the resulting device with an integrated circuit on a single chip, resulting in the decreased size of the chip.
    Type: Grant
    Filed: June 2, 2009
    Date of Patent: August 24, 2010
    Assignee: California Micro Devices
    Inventors: Mitchell M. Hamamoto, Chen Yi Gao, Tan Kim Hwee
  • WIRE BOND AND REDISTRIBUTION LAYER PROCESS
    Publication number: 20090236690
    Abstract: A semiconductor device comprises a copper redistribution line, a copper inductor and aluminum wire bond pads and the integration of the resulting device with an integrated circuit on a single chip, resulting in the decreased size of the chip.
    Type: Application
    Filed: June 2, 2009
    Publication date: September 24, 2009
    Applicant: California Micro Devices
    Inventors: Mitchell M. Hamamoto, Chen Yi Gao, Tan Kim Hwee