Abstract: An image sensor chip with depth information is provided. The image sensor chip includes an SPAD array, a time-to-digital converter module, a storage circuit, and a data processing circuit. The SPAD array includes a plurality of image sensor units, and each of the image sensor units includes a plurality of SPAD units and a decision circuit, wherein each of the SPAD units outputs a photon detection result within a scan period, and the decision circuit generates an image-sensing signal based on the photon detection results. The time-to-digital converter module generates a plurality of first time data in response to the image-sensing signals. The storage circuit stores the first time data temporarily. The data processing unit reads the first time data from the storage circuit and generates a plurality of second time data in response to the first time data.

Abstract: A device includes an integrated circuit die attached to a substrate; a lid attached to the integrated circuit die; a sealant on the lid; a spacer structure attached to the substrate adjacent the integrated circuit die; and a cooling cover attached to the spacer structure, wherein the cooling cover extends over the lid, wherein the cooling cover attached to the lid by the sealant. In an embodiment, the device includes a ring structure on the substrate, wherein the ring structure is between the spacer structure and the integrated circuit die.

Abstract: A method includes forming a first sealing layer at a first edge region of a first wafer; and bonding the first wafer to a second wafer to form a wafer stack. At a time after the bonding, the first sealing layer is between the first edge region of the first wafer and a second edge region of the second wafer, with the first edge region and the second edge region comprising bevels. An edge trimming process is then performed on the wafer stack. After the edge trimming process, the second edge region of the second wafer is at least partially removed, and a portion of the first sealing layer is left as a part of the wafer stack. An interconnect structure is formed as a part of the second wafer. The interconnect structure includes redistribution lines electrically connected to integrated circuit devices in the second wafer.

Abstract: A connection structure of a semiconductor device is provided in the present invention. The connection structure includes an interlayer dielectric, a top metal structure, and a passivation layer. The interlayer dielectric is disposed on a substrate. The top metal structure is disposed on the interlayer dielectric. The top metal structure includes a bottom portion and a top portion disposed on the bottom portion. The bottom portion includes a first sidewall, and the top portion includes a second sidewall. A slope of the first sidewall is larger than a slope of the second sidewall. The passivation layer is conformally disposed on the second sidewall, the first sidewall, and a top surface of the interlayer dielectric.

Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.

Abstract: A photographing module includes a lens assembly, a reflection element, an image sensor, and lens element, reflection element and image sensor driving modules. An axial voice coil motor of the lens element driving module moves the lens assembly along a lens optical axis. A rotating connection part and a curved recess structure are disposed between a holder and a carrier movable relative to the holder. A lateral voice coil motor of the reflection element driving module drives the carrier carrying the reflection element to rotate around an axis passing through the rotating connection part. A plurality of rollable elements are located between and in contact with the fixed member and the movable plate. A lateral voice coil motor of the image sensor driving module drives the movable plate carrying the image sensor to move based on a dynamic axis orthogonal to the lens optical axis.

Abstract: A preparation method of a cathode material for a secondary battery is provided. First, a lithium metal phosphate material and a first conductive carbon are provided. The lithium metal phosphate material is made of a plurality of secondary particles. Each of the secondary particles is formed by the aggregation of a plurality of primary particles. An interparticle space is formed between the plurality of primary particles. Next, the lithium metal phosphate material and the first conductive carbon are mixed by a mechanical method, and a composite material is prepared. The first conductive carbon is uniformly arranged in the interparticle space. After that, a second conductive carbon, a binder and a solvent are provided. Finally, the composite material, the second conductive carbon, the binder and the solvent are mixed, and a cathode material for preparing a positive plate is prepared.

Abstract: An optical image stabilization driver device includes an image sensor, a fixed carrier, a circuit element, an elastic element and a driving element. The circuit element includes a fixed part disposed on the fixed carrier, a movable part and an electrical transmission part. The image sensor is disposed on the movable part. The electrical transmission part has conductive routes electrically connected to the movable part and the fixed part. The elastic element includes a first frame part corresponding to the fixed part, a second frame part corresponding to the movable part and an elastic connection part connected to the first frame part and the second frame part and providing the image sensor with a freedom of movement in a plane. The driving element is configured to drive the image sensor to move relative the fixed carrier in the plane.

Abstract: A reflection module capable of image stabilization includes a reflecting element, a rotatable holder, a fixed base, a spherical supporting structure, an auxiliary supporting structure and an image stabilizing actuator. The reflecting element having a reflecting surface for folding optical path of incident light is disposed on the rotatable holder. The fixed base is connected to the rotatable holder via an elastic element. The spherical supporting structure is disposed between the rotatable holder and the fixed base. The auxiliary supporting structure disposed on at least one of the rotatable holder and the fixed base and corresponds to the spherical supporting structure. At least part of the image stabilizing actuator is disposed on the rotatable holder for driving the rotatable holder to rotate by taking the spherical supporting structure as rotation center. The spherical supporting structure is a ball having at least three contact points with the auxiliary supporting structure.

Abstract: An electronic device including a first body, a second body, a pivoting shaft, a driving module, and a light source is provided. The first body includes a first casing and a second casing movably disposed on the first casing. The second body has a pivoting part and a light reflecting part located at the pivoting part. The pivoting shaft is connected to the pivoting part. The second body is pivoted to the first body through the pivoting shaft. The pivoting shaft, the driving module, and the light source are disposed in the first body. The driving module is connected to the pivoting shaft and contacts the second casing. When the second body rotates relative to the first body, the pivoting shaft drives the driving module to push the second casing to lift to form a light emitting slit between the second casing and the pivoting part.

Abstract: A photographing module includes a lens assembly, a reflection element, an image sensor, and lens element, reflection element and image sensor driving modules. An axial voice coil motor of the lens element driving module moves the lens assembly along a lens optical axis. A rotating connection part and a curved recess structure are disposed between a holder and a carrier movable relative to the holder. A lateral voice coil motor of the reflection element driving module drives the carrier carrying the reflection element to rotate around an axis passing through the rotating connection part. A plurality of rollable elements are located between and in contact with the fixed member and the movable plate. A lateral voice coil motor of the image sensor driving module drives the movable plate carrying the image sensor to move based on a dynamic axis orthogonal to the lens optical axis.

Abstract: An imaging lens system includes a plastic lens element, a lens barrel and a light-absorbing layer. The plastic lens element is accommodated in the lens barrel and has an outer annular surface. The lens barrel includes a plate portion and a lateral wall portion. An optical axis of the imaging lens system passes through a light-passable hole of the plate portion. The lateral wall portion is connected to the plate portion and extends along a direction substantially parallel to the optical axis. The light-absorbing layer has an inner surface and an outer surface. The inner surface faces and is fixed on the outer annular surface of the plastic lens element. The outer surface is located opposite to the inner surface and in physical contact with the lateral portion of the lens barrel.

Abstract: An optical image stabilizer includes an electric circuit member, an image sensor, a driving member and a pressing member. The electric circuit member includes a fixed part, a movable part and a connection part. The fixed part surrounds the movable part. The connection part is connected to the fixed part and the movable part, and the movable part is movable through the connection part. The image sensor is electrically connected to the electric circuit member and disposed on the movable part. The driving member and the pressing member are coupled to the movable part to respectively move and keep the movable part. The connection part includes wire structures connected to and located between the fixed part and the movable part. The wire structures with pliability are connected to the movable part with no physical support. The wire structures each includes a circuit layer and an insulation layer stacked together.

Abstract: A preparation method of a cathode material for a secondary battery is provided. First, a lithium metal phosphate material and a first conductive carbon are provided. The lithium metal phosphate material is made of a plurality of secondary particles. Each of the secondary particles is formed by the aggregation of a plurality of primary particles. An interparticle space is formed between the plurality of primary particles. Next, the lithium metal phosphate material and the first conductive carbon are mixed by a mechanical method, and a composite material is prepared. The first conductive carbon is uniformly arranged in the interparticle space. After that, a second conductive carbon, a binder and a solvent are provided. Finally, the composite material, the second conductive carbon, the binder and the solvent are mixed, and a cathode material for preparing a positive plate is prepared.

Abstract: A camera module includes an imaging lens assembly and an image sensor. The imaging lens assembly includes a plastic optical element with a light-blocking layer disposed on its transparent surface. The plastic optical element includes an optical effective area, and a peripheral region of the light-blocking layer forms a specific shape around the optical effective area so as to define an aperture region. The peripheral region includes a main portion and a compensation portion. The main portion is physically contacted with the transparent surface. The compensation portion is disposed on an edge of the main portion adjacent to the optical effective area, and an optical density of the compensation portion is lower than an optical density of the main portion. The image sensor is disposed on an image side of the imaging lens assembly for defining a maximum image height and further defining a relative illumination.

Abstract: A driving module includes a base, a first shiftable plate, a second shiftable plate and a carrier. A plurality of first rolling members are disposed between the first shiftable plate and the carrier, so that the first shiftable plate is movable relative to the base along a first direction. A plurality of second rolling members are disposed between the second shiftable plate and the first shiftable plate, so that the second shiftable plate is movable relative to the first shiftable plate along a second direction, and the second direction is orthogonal to the first direction. A plurality of third rolling members are disposed between the carrier and the second shiftable plate, so that the carrier is movable relative to the second shiftable plate along a third direction, and the third direction is orthogonal to the first direction and the second direction.

Abstract: An imaging lens system includes a plastic lens element, a lens barrel and a light-absorbing layer. The plastic lens element is accommodated in the lens barrel and has an outer annular surface. The lens barrel includes a plate portion and a lateral wall portion. An optical axis of the imaging lens system passes through a light-passable hole of the plate portion. The lateral wall portion is connected to the plate portion and extends along a direction substantially parallel to the optical axis. The light-absorbing layer has an inner surface and an outer surface. The inner surface faces and is fixed on the outer annular surface of the plastic lens element. The outer surface is located opposite to the inner surface and in physical contact with the lateral portion of the lens barrel.

Abstract: This disclosure provides a lens assembly that has an optical path and includes a lens element and a light-blocking membrane layer. The lens element has an optical portion, and the optical path passes through the optical portion. The light-blocking membrane layer is coated on the lens element and adjacent to the optical portion. The light-blocking membrane layer has a distal side and a proximal side that is located closer to the optical portion than the distal side. The proximal side includes two extension structures and a recessed structure. Each of the extension structures extends along a direction away from the distal side, and the extension structures are not overlapped with each other in a direction in parallel with the optical path. The recessed structure is connected to the extension structures and recessed along a direction towards the distal side.

Abstract: An imaging lens system includes a plastic lens element, a lens barrel and a light-absorbing coating layer. The plastic lens element is accommodated in the lens barrel and has an outer annular surface. The lens barrel includes a plate portion and a lateral wall portion. An optical axis of the imaging lens system passes through a light-passable hole of the plate portion. The lateral wall portion is connected to the plate portion and extends along a direction substantially parallel to the optical axis. The light-absorbing coating layer has an inner surface and an outer surface. The inner surface faces and is fixed on the outer annular surface of the plastic lens element. The outer surface is located opposite to the inner surface and in physical contact with the lateral portion of the lens barrel.

Abstract: The present disclosure proposes a contact lens package. The contact lens package includes a first substrate, a contact lens, and a guard ring. The contact lens is disposed on the first substrate. The guard ring is disposed on the first substrate and surrounds the contact lens, wherein the guard ring is fixed on a side surface of the first substrate. The contact lens and the guard ring are surrounded and sealed in the first substrate.