Patents by Inventor CHEN-YI TAI

CHEN-YI TAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240385370
    Abstract: An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.
    Type: Application
    Filed: July 29, 2024
    Publication date: November 21, 2024
    Inventors: Chih-Hsuan Tai, Chung-Ming Weng, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20240264423
    Abstract: A high throughput lensless imaging method and system thereof are provided. The system mainly includes a light source, an optical panel, and an optical image sensing module. The optical panel corresponds to the light source and includes an optical pinhole that corresponds to the light source such that the light generated by the light source passes through the optical pinhole. The sensing unit is electrically connected to a computing unit that is used to compute after receiving the optical diffraction signal transmitted by the sensing unit, so as to perform the computation and reconstruction of an image.
    Type: Application
    Filed: April 18, 2024
    Publication date: August 8, 2024
    Applicant: NATIONAL CENTRAL UNIVERSITY
    Inventors: CHEN HAN HUANG, CHUN SAN TAI, TING YI LIN
  • Patent number: 10926292
    Abstract: A frame includes a substrate, a first priming paint layer, a second priming paint layer, a non-conductive vacuum metallized priming paint layer, and a non-conductive vacuum metallized coating layer. The substrate is made by die casting technology of metal powder. The substrate, the first priming paint layer, the second priming paint layer, the non-conductive vacuum metallized priming paint layer, and the non-conductive vacuum metallized coating layer are stacked in the order written. The disclosure also provides a surface treatment method for the frame.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: February 23, 2021
    Assignees: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: Chwan-Hwa Chiang, Chen-Yi Tai, Fei-Long Xiao, Jun Guan
  • Publication number: 20200122194
    Abstract: A frame includes a substrate, a first priming paint layer, a second priming paint layer, a non-conductive vacuum metallized priming paint layer, and a non-conductive vacuum metallized coating layer. The substrate is made by die casting technology of metal powder. The substrate, the first priming paint layer, the second priming paint layer, the non-conductive vacuum metallized priming paint layer, and the non-conductive vacuum metallized coating layer are stacked in the order written. The disclosure also provides a surface treatment method for the frame.
    Type: Application
    Filed: March 6, 2019
    Publication date: April 23, 2020
    Inventors: CHWAN-HWA CHIANG, CHEN-YI TAI, FEI-LONG XIAO, JUN GUAN
  • Publication number: 20200021324
    Abstract: A shell for at least one electronic device which is very resilient for everyday purposes and which in addition can restore itself after severe deformations by being heated includes at least one frame, the frame being made in one or more parts out of memory metal. The disclosure also provides a method for manufacturing the shell.
    Type: Application
    Filed: December 29, 2018
    Publication date: January 16, 2020
    Inventors: CHWAN-HWA CHIANG, CHEN-YI TAI, ZENG-MAO ZHENG
  • Publication number: 20190366603
    Abstract: A composite material includes a metal substrate, and a plastic member formed on a surface of the metal substrate. A material of the metal substrate is titanium or titanium alloys, and an acid treatment leaves nano-holes and protrusions on the surface of the metal substrate. The composite material further includes a combining layer between the metal substrate and the plastic member. The nano-holes are partially filled with the combining layer, the protrusions are partially surrounded by the combining layer. The disclosure further provides a method for making such composite material.
    Type: Application
    Filed: October 31, 2018
    Publication date: December 5, 2019
    Inventors: CHWAN-HWA CHIANG, CHEN-YI TAI, ZENG-MAO ZHENG
  • Publication number: 20190368052
    Abstract: A composite toughened against chipping during machining and other operations includes a substrate and a coating layer includes a substrate and a coating layer. The substrate is titanium or titanium alloys. Nano-holes are formed on a surface of the substrate. The coating layer completely fills in the nano-holes and completely covers the surface of the substrate where the nano-holes are not formed. The disclosure further provides a method for making such composite.
    Type: Application
    Filed: November 27, 2018
    Publication date: December 5, 2019
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: CHWAN-HWA CHIANG, CHEN-YI TAI, ZENG-MAO ZHENG
  • Publication number: 20190366588
    Abstract: A composite object with more complete and stronger adhesion between the constituent parts includes a substrate and a plastic member formed on a surface of the substrate. The substrate can be made of memory metal. Nano-holes are formed on the surface of the substrate. The composite further includes a combining layer. The combining layer is positioned between the substrate and the plastic member. The nano-holes are at least partially filled with the combining layer, unfilled holes being filled with the plastic constituent in the molten state. The disclosure further provides a method for manufacturing the composite.
    Type: Application
    Filed: February 25, 2019
    Publication date: December 5, 2019
    Inventors: CHWAN-HWA CHIANG, CHEN-YI TAI, ZENG-MAO ZHENG
  • Patent number: 9639118
    Abstract: A housing includes a main portion and at least one insulating portion. The main portion includes two portions, an inner surface and an outer surface opposite to the inner surface. The inner surface defines at least one groove. The outer surface defines at least one gap that is coupled to the at least one groove. The at least one insulating portion is corresponding to the at least one groove and each insulating portion is filled in one groove. The two portions of the main portion are positioned at two sides of the at least one gap and the two portions are insulated by the at least one gap and the at least one insulating portion.
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: May 2, 2017
    Assignees: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: Chwan-Hwa Chiang, Chieh-Hsiang Wang, Bao-Shen Zhang, Chen-Yi Tai
  • Publication number: 20160344090
    Abstract: A housing used in an electronic device having an antenna, the housing includes a base and a non-conductive film. The base defines a slot corresponding to the antenna and forms a surface enclosing the slot. The non-conductive film is formed on a surface of the base, the non-conductive film is configured to be coupled to the antenna and insulated the antenna from the base. An electronic device employing the housing and a manufacture method of the housing are also provided.
    Type: Application
    Filed: October 22, 2015
    Publication date: November 24, 2016
    Inventors: CHWAN-HWA CHIANG, CHIEH-HSIANG WANG, BAO-SHEN ZHANG, CHEN-YI TAI
  • Publication number: 20160327981
    Abstract: A housing includes a main portion and at least one insulating portion. The main portion includes two portions, an inner surface and an outer surface opposite to the inner surface. The inner surface defines at least one groove. The outer surface defines at least one gap that is coupled to the at least one groove. The at least one insulating portion is corresponding to the at least one groove and each insulating portion is filled in one groove. The two portions of the main portion are positioned at two sides of the at least one gap and the two portions are insulated by the at least one gap and the at least one insulating portion.
    Type: Application
    Filed: August 14, 2015
    Publication date: November 10, 2016
    Inventors: CHWAN-HWA CHIANG, CHIEH-HSIANG WANG, BAO-SHEN ZHANG, CHEN-YI TAI