Patents by Inventor Chen-Yi Tsai
Chen-Yi Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136280Abstract: A method includes forming a dielectric layer over a contact pad of a device, forming a first polymer layer over the dielectric layer, forming a first conductive line and a first portion of a second conductive line over the first polymer layer, patterning a photoresist to form an opening over the first portion of the second conductive feature, wherein after patterning the photoresist the first conductive line remains covered by photoresist, forming a second portion of the second conductive line in the opening, wherein the second portion of the second conductive line physically contacts the first portion of the second conductive line, and forming a second polymer layer extending completely over the first conductive line and the second portion of the second conductive line.Type: ApplicationFiled: January 2, 2024Publication date: April 25, 2024Inventors: Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hsin-Yu Pan, Hao-Yi Tsai, Sen-Kuei Hsu
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Publication number: 20240131538Abstract: An annular airflow regulating apparatus includes a cup-shaped element and an adjustment element. The cup-shaped element has a bowl and a bottom, integrated to form a first chamber. The bottom has a tapered channel parallel to an axis and penetrating through the bottom. A ring-shaped groove is disposed between the tapered channel and the bottom. The ring-shaped groove has an annular plane perpendicular to the axis. The adjustment element, having a tapered portion and second holes, is movably disposed in the cup-shaped element. The tapered portion protrudes into the tapered channel A tapered annular gap is formed between the tapered portion and the tapered channel. When the adjustment element is moved with respect to the cup-shaped element, a width of the tapered annular gap is varied, and thereupon a flow rate and velocity of the process gas would be varied accordingly.Type: ApplicationFiled: December 8, 2022Publication date: April 25, 2024Inventors: CHEN-CHUNG DU, Ming-Jyh Chang, Chang-Yi Chen, Ming-Hau Tsai, Ko-Chieh chao, Yi-Wei Lin
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Patent number: 11953740Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.Type: GrantFiled: May 14, 2021Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
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Patent number: 11956972Abstract: A semiconductor memory device includes a substrate having a memory area and a logic circuit area thereon, a first interlayer dielectric layer on the substrate, and a second interlayer dielectric layer on the substrate. An embedded memory cell structure is disposed within the memory area between the first interlayer dielectric layer and the second interlayer dielectric layer. The second interlayer dielectric layer includes a first portion covering the embedded memory cell structure within the memory area and a second portion covering the logic circuit area. A top surface of the first portion is coplanar with a top surface of the second portion.Type: GrantFiled: April 13, 2021Date of Patent: April 9, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Si-Han Tsai, Ching-Hua Hsu, Chen-Yi Weng, Po-Kai Hsu
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Patent number: 11948862Abstract: Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.Type: GrantFiled: March 1, 2021Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Hua Yu, Chih-Hua Chen, Hao-Yi Tsai, Yu-Feng Chen
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Patent number: 11947173Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.Type: GrantFiled: May 5, 2023Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
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Publication number: 20240099154Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.Type: ApplicationFiled: November 21, 2023Publication date: March 21, 2024Applicant: UNITED MICROELECTRONICS CORPInventors: Hui-Lin Wang, Si-Han Tsai, Dong-Ming Wu, Chen-Yi Weng, Ching-Hua Hsu, Ju-Chun Fan, Yi-Yu Lin, Che-Wei Chang, Po-Kai Hsu, Jing-Yin Jhang
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Publication number: 20240088050Abstract: A semiconductor device includes a die, an encapsulant over a front-side surface of the die, a redistribution structure on the encapsulant, a thermal module coupled to the back-side surface of the die, and a bolt extending through the redistribution structure and the thermal module. The die includes a chamfered corner. The bolt is adjacent to the chamfered corner.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Inventors: Chen-Hua Yu, Wei-Kang Hsieh, Shih-Wei Chen, Tin-Hao Kuo, Hao-Yi Tsai
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Patent number: 11923349Abstract: A semiconductor structure includes a die and a first connector. The first connector is disposed on the die. The first connector includes a first connecting housing, a first connecting element and a first connecting portion. The first connecting element is electrically connected to the die and disposed at a first side of the first connecting housing. The first connecting portion is disposed at a second side different from the first side of the first connecting housing, wherein the first connecting portion is one of a hole and a protrusion with respect to a surface of the second side of the first connecting housing.Type: GrantFiled: June 30, 2022Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Hui Lai, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo
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Patent number: 11917923Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.Type: GrantFiled: April 28, 2021Date of Patent: February 27, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Ching-Hua Hsu, Si-Han Tsai, Shun-Yu Huang, Chen-Yi Weng, Ju-Chun Fan, Che-Wei Chang, Yi-Yu Lin, Po-Kai Hsu, Jing-Yin Jhang, Ya-Jyuan Hung
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Patent number: 11237309Abstract: A lens including a filter, an aperture stop, and a lens set sequentially arranged along a first direction is provided. The filter includes a central region and a peripheral region. The central region has a first light transmission band for a wavelength range of a visible light and a second light transmission band for a wavelength range of an infrared light. The peripheral region surrounds the central region. The peripheral region has a third light transmission band for the wavelength range of the infrared light and is substantially opaque to the visible light, and an area of one portion of the central region surrounded by the peripheral region is tapered toward the first direction.Type: GrantFiled: November 14, 2019Date of Patent: February 1, 2022Assignee: Rays Optics Inc.Inventors: Chen-Cheng Lee, Chen-Yi Tsai, Shin-Jen Wang, Kuo-Hsiang Hung, Chih-Ling Lin, Meng-Wei Lin, Yu-Chia Lu
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Publication number: 20200249379Abstract: A lens including a filter, an aperture stop, and a lens set sequentially arranged along a first direction is provided. The filter includes a central region and a peripheral region. The central region has a first light transmission band for a wavelength range of a visible light and a second light transmission band for a wavelength range of an infrared light. The peripheral region surrounds the central region. The peripheral region has a third light transmission band for the wavelength range of the infrared light and is substantially opaque to the visible light, and an area of one portion of the central region surrounded by the peripheral region is tapered toward the first direction.Type: ApplicationFiled: November 14, 2019Publication date: August 6, 2020Applicant: Rays Optics Inc.Inventors: Chen-Cheng Lee, Chen-Yi Tsai, Shin-Jen Wang, Kuo-Hsiang Hung, Chih-Ling Lin, Meng-Wei Lin, Yu-Chia Lu
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Patent number: 10634866Abstract: A lens including a lens barrel and five lens elements is provided. A relation between the amount of field curvature variation Sa1 of a system caused by a thickness tolerance of a lens element in the lens and an amount of field curvature variation Sa2 of the system caused by a change of a gap between the lens element and an adjacent lens element thereof is described as follows. Sa2 is twice or less of Sa1. Sa2 and Sa1 are both positive values or both negative values to render a better field curvature performance of the lens. A manufacturing method of the lens is also provided.Type: GrantFiled: July 19, 2018Date of Patent: April 28, 2020Assignee: Rays Optics Inc.Inventors: Chen-Yi Tsai, Chen-Cheng Lee
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Publication number: 20190346652Abstract: A lens including a lens barrel and five lens elements is provided. A relation between the amount of field curvature variation Sa1 of a system caused by a thickness tolerance of a lens element in the lens and an amount of field curvature variation Sa2 of the system caused by a change of a gap between the lens element and an adjacent lens element thereof is described as follows. Sa2 is twice or less of Sa1. Sa2 and Sa1 are both positive values or both negative values to render a better field curvature performance of the lens. A manufacturing method of the lens is also provided.Type: ApplicationFiled: July 19, 2018Publication date: November 14, 2019Applicant: Rays Optics Inc.Inventors: Chen-Yi Tsai, Chen-Cheng Lee