Patents by Inventor Chen-Yin Tai

Chen-Yin Tai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packages with thermal-enhanced conformal shielding and related methods
    Patent number: 9984983
    Abstract: The semiconductor package includes a substrate, a die, a first metal layer, a second metal layer and an optional seed layer. The package body at least partially encapsulates the die on the substrate. The seed layer is disposed on the package body and the first metal layer is disposed on the seed layer. The second metal layer is disposed on the first metal layer and the lateral surface of the substrate. The first metal layer and the second metal layer form an outer metal cap that provides thermal dissipation and electromagnetic interference (EMI) shielding.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: May 29, 2018
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi-Sheng Chung, Kuo-Hsien Liao, Jin-Feng Yang, Chen-Yin Tai, Yung-I Yeh
  • SEMICONDUCTOR PACKAGES WITH THERMAL-ENHANCED CONFORMAL SHIELDING AND RELATED METHODS
    Publication number: 20170012007
    Abstract: The semiconductor package includes a substrate, a die, a first metal layer, a second metal layer and an optional seed layer. The package body at least partially encapsulates the die on the substrate. The seed layer is disposed on the package body and the first metal layer is disposed on the seed layer. The second metal layer is disposed on the first metal layer and the lateral surface of the substrate. The first metal layer and the second metal layer form an outer metal cap that provides thermal dissipation and electromagnetic interference (EMI) shielding.
    Type: Application
    Filed: September 21, 2016
    Publication date: January 12, 2017
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi-Sheng Chung, Kuo-Hsien Liao, Jin-Feng Yang, Chen-Yin Tai, Yung-I Yeh
  • Semiconductor packages with thermal-enhanced conformal shielding and related methods
    Patent number: 9484313
    Abstract: The semiconductor package includes a substrate, a die, a first metal layer, a second metal layer and an optional seed layer. The package body at least partially encapsulates the die on the substrate. The seed layer is disposed on the package body and the first metal layer is disposed on the seed layer. The second metal layer is disposed on the first metal layer and the lateral surface of the substrate. The first metal layer and the second metal layer form an outer metal cap that provides thermal dissipation and electromagnetic interference (EMI) shielding.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: November 1, 2016
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi-Sheng Chung, Kuo-Hsien Liao, Jin-Feng Yang, Chen-Yin Tai, Yung-I Yeh
  • SEMICONDUCTOR PACKAGES WITH THERMAL-ENHANCED CONFORMAL SHIELDING AND RELATED METHODS
    Publication number: 20140239464
    Abstract: The semiconductor package includes a substrate, a die, a first metal layer, a second metal layer and an optional seed layer. The package body at least partially encapsulates the die on the substrate. The seed layer is disposed on the package body and the first metal layer is disposed on the seed layer. The second metal layer is disposed on the first metal layer and the lateral surface of the substrate. The first metal layer and the second metal layer form an outer metal cap that provides thermal dissipation and electromagnetic interference (EMI) shielding.
    Type: Application
    Filed: February 27, 2013
    Publication date: August 28, 2014
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi-Sheng Chung, Kuo-Hsien Liao, Jin-Feng Yang, Chen-Yin Tai, Yung-I Yeh