Abstract: Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly may include a substrate, a plurality of electrical contacts disposed on an outer surface of the substrate, a solder resist disposed on the outer surface of the substrate and including an opening defined by a plurality of edges and exposing the plurality of electrical contacts, and an alpha particle shield disposed proximate to at least one edge, of the plurality of edges.

Abstract: A semiconductor device assembly is provided. The semiconductor device assembly can include a substrate and one or more semiconductor dies. The semiconductor device assembly can further include a thermally conductive material (e.g., carbon nanotubes, graphene) capable of dissipating heat from the semiconductor device assembly. In doing so, a thermally regulated semiconductor device can be assembled.

Abstract: Stacked semiconductor devices, and related systems and methods, are disclosed herein. In some embodiments, the stacked semiconductor device includes a package substrate and a die stack carried by the package substrate. The die stack can include at least a first semiconductor die carried by the package substrate, a second semiconductor die carried by the first semiconductor die. The first semiconductor die can have an upper surface and a first bond pad carried by the upper surface that includes a curvilinear concave depression formed in an uppermost surface of the first bond pad. The second semiconductor die has a lower surface and a second bond pad carried by the lower surface. The die stack can also include solder structure electrically coupling the first and second bond pads and at least partially filling the curvilinear concave depression formed in the uppermost surface of the first bond pad.

Abstract: A semiconductor package having a fillet is provided. The semiconductor package includes a trace disposed within a solder mask that has a top surface. A first die is over the solder mask and mechanically couples with the trace. A first adhesive is between the trace and the first die where sides of the first die and the first adhesive define a die edge. The semiconductor package includes a fillet adjacent the die edge and a second die above the first die. The semiconductor package also includes a second adhesive having a bottom surface where the second adhesive is between the first die and the second die. The solder mask top surface, the first die surface, and the second adhesive bottom surface define a cavity where the fillet is within the cavity at the die edge.

Abstract: The disclosure provides a forming method of a halogen-free flame-retardant material. The method includes the followings. A twin-screw extruder including a first zone and a second zone is used. A mixture in the first zone is mixed, melted and heated to form a molten mixture. The mixture includes a halogen-free flame retardant, a wear-resistant modifier, a thermoplastic elastomer, and an antioxidant. In addition, a silane-modified nano-silica aqueous suspension is introduced into the second zone to mix the silane-modified nano-silica aqueous suspension with the molten mixture from the first zone. The first zone and the second zone are continuously connected regions.

Abstract: The present disclosure provides a toughened resin composition, which includes: (A) a toughened and modified compound, which includes a styrene maleic anhydride compound, an anhydride grafted olefin polymer, and a diisocyanate compound; (B) a thermosetting polymer; and (C) a toughening resin; wherein, in the toughened and modified compound, the diisocyanate compound forms a polyimide bond with the styrene maleic anhydride compound and the anhydride grafted olefin polymer, respectively. The present disclosure has high toughness and excellent mechanical properties; thus, it may have a wide range of applications in the fields of electronics, aerospace and the like.

Abstract: The disclosure provides a forming method of a halogen-free flame-retardant material. The method includes the followings. A twin-screw extruder including a first zone and a second zone is used. A mixture in the first zone is mixed, melted and heated to form a molten mixture. The mixture includes a halogen-free flame retardant, a wear-resistant modifier, a thermoplastic elastomer, and an antioxidant. In addition, a silane-modified nano-silica aqueous suspension is introduced into the second zone to mix the silane-modified nano-silica aqueous suspension with the molten mixture from the first zone. The first zone and the second zone are continuously connected regions.

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

Abstract: Provided are systems, methods, and media for multiphase graph partitioning for malware entity detection. An example method includes receiving an input string associated with the malware entity. A determination is made as to whether the input string includes a symbolic word, a non-symbolic word, a symbolic phrase, or a non-symbolic phrase. A branching graph is formed based on a combination of the input string and a plurality of stored strings that are each associated with the malware entity to determine whether the input string is a valid detection name of the malware entity, in which the branching graph is formed by at least performing a first graph partitioning stage and a second graph partitioning stage. The input string is then labeled based on the formed branching graph and then outputted to a malware detection engine.

Abstract: A method, computer system, and a computer program product for crawling and extracting main content from a web page is provided. The present invention may include retrieving a HTML document associated with a web page. The present invention may then include identifying at least one entry point located in the retrieved HTML document by utilizing a self-adaptive entry point locator. The present invention may also include extracting a main content article associated with the retrieved HTML document based on the identified at least one entry point. The present invention may further include presenting the extracted main content associated with the retrieved HTML document to the user.

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

Abstract: A method, computer program product, and computing system device for receiving, on a computing device, a plurality of webpages. At least one webpage may be filtered from the plurality of webpages into at least one set of webpages using a decision tree algorithm. At least one remaining webpage may be filtered from the plurality of webpages into the at least one set of webpages using a supported vector machine (SVM) algorithm.

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

Abstract: A method, computer program product, and computing system device for receiving, on a computing device, a plurality of webpages. At least one webpage may be filtered from the plurality of webpages into at least one set of webpages using a decision tree algorithm. At least one remaining webpage may be filtered from the plurality of webpages into the at least one set of webpages using a supported vector machine (SVM) algorithm.

Abstract: Provided are systems, methods, and media for multiphase graph partitioning for malware entity detection. An example method includes receiving an input string associated with the malware entity. A determination is made as to whether the input string includes a symbolic word, a non-symbolic word, a symbolic phrase, or a non-symbolic phrase. A branching graph is formed based on a combination of the input string and a plurality of stored strings that are each associated with the malware entity to determine whether the input string is a valid detection name of the malware entity, in which the branching graph is formed by at least performing a first graph partitioning stage and a second graph partitioning stage. The input string is then labeled based on the formed branching graph and then outputted to a malware detection engine.

Abstract: A method, computer system, and a computer program product for crawling and extracting main content from a web page is provided. The present invention may include retrieving a HTML document associated with a web page. The present invention may then include identifying at least one entry point located in the retrieved HTML document by utilizing a self-adaptive entry point locator. The present invention may also include extracting a main content article associated with the retrieved HTML document based on the identified at least one entry point. The present invention may further include presenting the extracted main content associated with the retrieved HTML document to the user.

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

Abstract: Provided is a substrate structure, including: a substrate body having a conductive contact; an insulating layer formed on the substrate body with the conductive contact exposed therefrom; and an insulating protection layer formed on a portion of a surface of the insulating layer, and having a plurality of openings corresponding to the conductive contact, wherein at least one of the openings is disposed at an outer periphery of the conductive contact. Accordingly, the insulating protection layer uses the openings to dissipate and disperse residual stresses in a manufacturing process of high operating temperatures.

Abstract: A substrate structure is provided, including a substrate body having a conductive pad, an insulation layer formed on the substrate body and exposing the conductive pad, a conductive pillar disposed on the conductive pad, and a metal pad disposed on the insulation layer and electrically connected to the conductive pillar. A conductive component can be coupled to the metal pad. During a high-temperature process, the conductive pillar and the metal pad disperse the remaining stress generated due to heat, thereby preventing the conductive component from being cracked.

Abstract: Provided is a substrate structure, including: a substrate body having a conductive contact; an insulating layer formed on the substrate body with the conductive contact exposed therefrom; and an insulating protection layer formed on a portion of a surface of the insulating layer, and having a plurality of openings corresponding to the conductive contact, wherein at least one of the openings is disposed at an outer periphery of the conductive contact. Accordingly, the insulating protection layer uses the openings to dissipate and disperse residual stresses in a manufacturing process of high operating temperatures.