Abstract: A light-emitting device, including: a semiconductor stack generating a first light; and a filter formed on the semiconductor stack, including a first surface facing the semiconductor stack and a second surface opposite to the first surface; and a transparent conductive layer formed on the semiconductor stack; wherein: the filter includes a plurality of first dielectric layers with a first refractive index and a plurality of second dielectric layers with a second refractive index alternately stacked, a portion of the first light is transmitted by the filter and extracted from the second surface, the light-emitting device has a beam angle in a range of 50 degrees to 110 degrees, and the filter comprises a light transmittance of more than 90% with respect to light incident at an incident angle in a range less than 10 degrees.

Abstract: An IC device includes a first anti-fuse structure including a first dielectric layer between a first gate conductor and an active area, a second anti-fuse structure including a second dielectric layer between a second gate conductor and the active area, and a first pair of conductive segments electrically connected to the first and second gate conductors and aligned along a row direction perpendicular to a column direction of the first and second gate conductors. The active area is included in a plurality of active areas, the first pair of conductive segments is included in a plurality of pairs of conductive segments, and adjacent pairs of conductive segments of the plurality of pairs of conductive segments are separated by a total of two active areas of the plurality of active areas.

Abstract: An integrated circuit package and a method of forming the same are provided. The method includes attaching an integrated circuit die to a first substrate. A dummy die is formed. The dummy die is attached to the first substrate adjacent the integrated circuit die. An encapsulant is formed over the first substrate and surrounding the dummy die and the integrated circuit die. The encapsulant, the dummy die and the integrated circuit die are planarized, a topmost surface of the encapsulant being substantially level with a topmost surface of the dummy die and a topmost surface of the integrated circuit die. An interior portion of the dummy die is removed. A remaining portion of the dummy die forms an annular structure.

Abstract: An anti-fuse array includes first through fourth adjacent anti-fuse bit columns, the anti-fuse bits of the first and second anti-fuse bit columns including portions of active areas of a first active area column, and the anti-fuse bits of the third and fourth anti-fuse bit columns including portions of active areas of a second active area column. Each row of a first set of conductive segment rows includes first and second conductive segments positioned between adjacent active areas of the first active area column and a third conductive segment positioned between adjacent active areas of the second active area column. Each row of a second set of conductive segments alternating with the first set of conductive segment rows includes a fourth conductive segment positioned between adjacent active areas of the first active area column and fifth and sixth conductive segments positioned between adjacent active areas of the second active area column.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A method of making an object including a coating unit having antibacterial and antiviral activity includes (a) providing an untreated object; (b) spraying a primer material onto a surface of the untreated object so as to form a primer coating layer, thereby obtaining a primed object; (c) baking the primed object obtained in step (b) to dry the primer coating layer, thereby obtaining a baked object; (d) spraying a varnish material onto a surface of the baked object obtained in step (c) so as to form a varnish coating layer on the primer coating layer, thereby obtaining a varnished object; and (e) baking the varnished object obtained in step (d) to dry the varnish coating layer, thereby forming a coating unit having the primer coating layer and the varnish coating layer on the surface of the object. An object including an untreated object and a coating unit is also provided.

Abstract: A method for manufacturing light-shielded cameras includes forming a plurality of camera dies by dicing a camera wafer stack including (a) an image sensor wafer having a plurality of image sensors, (b) a cover glass bonded to the image sensor wafer, and (c) a lens wafer bonded to the cover glass and having a plurality of lenses, to form a plurality of camera dies. The method further includes, prior to the step of dicing, (i) from a first side of the image sensor wafer facing away from the cover glass and at least partly covered by an opaque layer, pre-cutting a sensor-cover wafer stack that includes the image sensor wafer and the cover glass, and (ii) depositing an opaque material in the pre-cuts. The method also includes, after the step of dicing, applying an opaque coating to second-side surfaces, of the camera dies, formed by the step of dicing.

Abstract: A method for manufacturing light-shielded cameras includes forming a plurality of camera dies by dicing a camera wafer stack including (a) an image sensor wafer having a plurality of image sensors, (b) a cover glass bonded to the image sensor wafer, and (c) a lens wafer bonded to the cover glass and having a plurality of lenses, to form a plurality of camera dies. The method further includes, prior to the step of dicing, (i) from a first side of the image sensor wafer facing away from the cover glass and at least partly covered by an opaque layer, pre-cutting a sensor-cover wafer stack that includes the image sensor wafer and the cover glass, and (ii) depositing an opaque material in the pre-cuts. The method also includes, after the step of dicing, applying an opaque coating to second-side surfaces, of the camera dies, formed by the step of dicing.

Abstract: A ventilation apparatus includes a main body, an air entry and an air exit respectively arranged on two sides of the main body, a filter arranged behind the air entry, and a pressure sensor module located between the filter and the air exit, which senses pressure caused by air flowing inside the main body through the air entry and the filter. The pressure sensor module firstly senses pressure related data when the apparatus begins to start for initial data, and senses pressure related data continuously after the apparatus starts for working data, and transmits these data externally. An analysis monitor device computes a reference pressure offset value and a working pressure offset value according to the initial data and the working data, and compares the two pressure offset values for determining whether the filter needs to be replaced.

Abstract: A hybrid air conditioning apparatus includes a first air conditioning device and a second air conditioning device. The first air conditioning device is a cooling and heating air conditioner, and the second air conditioning device communicates with the first air conditioning device. Air modulated by the second air conditioning device is sent to the first air conditioning device for cooling and heating air adjustment. Accordingly, the air discharged from the first air conditioning device has enhanced quality and all kinds of properties in the air are provided uniformly.

Abstract: A hybrid air conditioning apparatus includes a first air conditioning device and a second air conditioning device. The first air conditioning device is a cooling and heating air conditioner, and the second air conditioning device communicates with the first air conditioning device. Air modulated by the second air conditioning device is sent to the first air conditioning device for cooling and heating air adjustment. Accordingly, the air discharged from the first air conditioning device has enhanced quality and all kinds of properties in the air are provided uniformly.

Abstract: A ventilation apparatus includes a main body, an air entry and an air exit respectively arranged on two sides of the main body, a filter arranged behind the air entry, and a pressure sensor module located between the filter and the air exit, which senses pressure caused by air flowing inside the main body through the air entry and the filter. The pressure sensor module firstly senses pressure related data when the apparatus begins to start for initial data, and senses pressure related data continuously after the apparatus starts for working data, and transmits these data externally. An analysis monitor device computes a reference pressure offset value and a working pressure offset value according to the initial data and the working data, and compares the two pressure offset values for determining whether the filter needs to be replaced.