Abstract: Features relating to a vaporizer body are provided. The vaporizer body may include an outer shell that includes an inner region defined by an outer shell sidewall. A support structure is configured to fit within the inner region of the outer shell. The support structure includes a storage region defined by a top support structure, a bottom support structure, a bottom cap, and a gasket. An integrated board assembly is configured to fit within the storage region of the support structure. The integrated board assembly may include a printed circuit board assembly formed of multiple layers that form a rigid structure and that include an inner, flexible layer. A first antenna is integrated at a proximal end of the flexible layer, and a second antenna is integrated at a distal end of the flexible layer.

Abstract: A compound of formula (I), wherein R1R2R3 are defined in the disclosure. The compound of formula (I) is used as a catalyst for lactide polymerization to reduce the temperature and the time of the polymerization reaction, thereby producing polylactic acid (PLA) having high molecular weight. The present invention also provides a method of preparing the compound of formula (1) and a method of synthesizing polylactic acid that is catalyzed by the compound of formula (1).

Abstract: A vaporizer device may include a pressure sensor and an ambient pressure sensor. The pressure sensor may be configured to measure a first pressure in an air flow path in the vaporizer device. The ambient pressure sensor may be configured to measure a second pressure corresponding to an atmospheric pressure. The vaporizer device may further include a controller. The controller may be configured to transition the vaporizer device to a first standby mode when the first pressure is equal to or greater than the second pressure for a first threshold quantity of time. While the vaporizer device is in the first standby mode, the controller may be further configured to transition the vaporizer device to a second standby mode when the second pressure is a threshold quantity greater than the first pressure and no motion event is detected for a second threshold quantity of time.

Abstract: A vaporizer device may include a controller and a heater control circuitry. The controller may generate, based at least on a temperature of a heating coil in a cartridge coupled with the vaporizer device, an output signal for controlling a discharge of a battery of the vaporizer device. The battery may be discharged to the heating coil to increase the temperature of the heating coil and cause a vaporization of a vaporizable material contained in the cartridge. The heater control circuitry may determine the temperature of the heating coil. The heater control circuitry may further control, based on the output signal from the controller, the discharge of the battery to the heating coil. The heater control circuitry may be powered by a voltage rail coupled to a voltage regulator configured to regulate an output voltage of the battery.

Abstract: Features relating to a cartridge for use with a vaporizer body are provided. The cartridge mates with the vaporizer body in a cartridge receptacle. The cartridge may include a cartridge body defining a reservoir configured to contain vaporizable material; a mouthpiece coupled to a proximal end region of the cartridge body; at least one proximal absorbent pad wedged within an internal volume of the mouthpiece; a mouthpiece seal with sealing ribs; a cannula defining a vaporization chamber extending through the cartridge body; a resistive heating element; a porous wick configured to draw the vaporizable material in the reservoir towards the vaporization chamber; an internal sealing gasket positioned in a distal end region of the cartridge body; a lower support structure positioned in the distal end region of the cartridge body; and at least one distal absorbent pad configured to wedge within a recess located in the lower support structure.

Abstract: Features relating to a cartridge for use with a vaporizer body are provided. The cartridge mates with the vaporizer body in a cartridge receptacle. The cartridge may include a cartridge body defining a reservoir configured to contain vaporizable material; a mouthpiece coupled to a proximal end region of the cartridge body; at least one proximal absorbent pad wedged within an internal volume of the mouthpiece; a mouthpiece seal with sealing ribs; a cannula defining a vaporization chamber extending through the cartridge body; a resistive heating element; a porous wick configured to draw the vaporizable material in the reservoir towards the vaporization chamber; an internal sealing gasket positioned in a distal end region of the cartridge body; a lower support structure positioned in the distal end region of the cartridge body; and at least one distal absorbent pad configured to wedge within a recess located in the lower support structure.

Abstract: A vaporizer device may include a controller and a heater control circuitry. The controller may generate, based at least on a temperature of a heating coil in a cartridge coupled with the vaporizer device, an output signal for controlling a discharge of a battery of the vaporizer device. The battery may be discharged to the heating coil to increase the temperature of the heating coil and cause a vaporization of a vaporizable material contained in the cartridge. The heater control circuitry may determine the temperature of the heating coil. The heater control circuitry may further control, based on the output signal from the controller, the discharge of the battery to the heating coil. The heater control circuitry may be powered by a voltage rail coupled to a voltage regulator configured to regulate an output voltage of the battery.

Abstract: Features relating to a vaporizer body are provided. The vaporizer body may include an outer shell that includes an inner region defined by an outer shell sidewall. A support structure is configured to fit within the inner region of the outer shell. The support structure includes a storage region defined by a top support structure, a bottom support structure, a bottom cap, and a gasket. An integrated board assembly is configured to fit within the storage region of the support structure. The integrated board assembly may include a printed circuit board assembly formed of multiple layers that form a rigid structure and that include an inner, flexible layer. A first antenna is integrated at a proximal end of the flexible layer, and a second antenna is integrated at a distal end of the flexible layer.

Abstract: A vaporizer device may include a pressure sensor and an ambient pressure sensor. The pressure sensor may be configured to measure a first pressure in an air flow path in the vaporizer device. The ambient pressure sensor may be configured to measure a second pressure corresponding to an atmospheric pressure. The vaporizer device may further include a controller. The controller may be configured to transition the vaporizer device to a first standby mode when the first pressure is equal to or greater than the second pressure for a first threshold quantity of time. While the vaporizer device is in the first standby mode, the controller may be further configured to transition the vaporizer device to a second standby mode when the second pressure is a threshold quantity greater than the first pressure and no motion event is detected for a second threshold quantity of time.

Abstract: The present disclosure provides an element submount and a method for manufacturing the same. The element submount includes a substrate, a first conductive heat-dissipating layer, a second conductive heat-dissipating layer, a first heat-dissipating layer and an element bonding layer. The substrate has opposite first and second surfaces. The first conductive heat-dissipating layer is formed on the first surface. The second conductive heat-dissipating layer is formed on the first surface and separated from the first conductive heat-dissipating layer. The first heat-dissipating layer is formed on the second surface. The element bonding layer is formed on the second conductive heat-dissipating layer. By electroplating and processing techniques, the edge of one or two sides of the element bonding layer exceeds an edge of the second conductive heat-dissipating layer and partially covers a side of the second conductive heat-dissipating layer.

Abstract: Features relating to a vaporizer body are provided. The vaporizer body may include an outer shell that includes an inner region defined by an outer shell sidewall. A support structure is configured to fit within the inner region of the outer shell. The support structure includes a storage region defined by a top support structure, a bottom support structure, a bottom cap, and a gasket. An integrated board assembly is configured to fit within the storage region of the support structure. The integrated board assembly may include a printed circuit board assembly formed of multiple layers that form a rigid structure and that include an inner, flexible layer. A first antenna is integrated at a proximal end of the flexible layer, and a second antenna is integrated at a distal end of the flexible layer.

Abstract: Features relating to a vaporizer device including a vaporizer body and a cartridge for connecting to the vaporizer body are provided. The cartridge includes a wireless transceiver positioned proximate a distal end of the cartridge. The wireless transceiver is configured to transmit, receive, and/or store data and to communicate with a subset of remote devices, which may include the vaporizer body and one or more additional devices such as manufacturing, assembly, and filling equipment. The vaporizer body includes wireless communication circuitry that enables communication with remote devices, which may include the cartridge and user devices such as a wireless device. The vaporizer body is configured to identify the cartridge and implement operational instructions and/or apply configuration parameters received from an application and/or based on preset configuration parameters associated with the cartridge.

Abstract: A vaporizer device may include a pressure sensor and an ambient pressure sensor. The pressure sensor may be configured to measure a first pressure in an air flow path in the vaporizer device. The ambient pressure sensor may be configured to measure a second pressure corresponding to an atmospheric pressure. The vaporizer device may further include a controller. The controller may be configured to transition the vaporizer device to a first standby mode when the first pressure is equal to or greater than the second pressure for a first threshold quantity of time. While the vaporizer device is in the first standby mode, the controller may be further configured to transition the vaporizer device to a second standby mode when the second pressure is a threshold quantity greater than the first pressure and no motion event is detected for a second threshold quantity of time.

Abstract: A vaporizer device may include a controller and a heater control circuitry. The controller may generate, based at least on a temperature of a heating coil in a cartridge coupled with the vaporizer device, an output signal for controlling a discharge of a battery of the vaporizer device. The battery may be discharged to the heating coil to increase the temperature of the heating coil and cause a vaporization of a vaporizable material contained in the cartridge. The heater control circuitry may determine the temperature of the heating coil. The heater control circuitry may further control, based on the output signal from the controller, the discharge of the battery to the heating coil. The heater control circuitry may be powered by a voltage rail coupled to a voltage regulator configured to regulate an output voltage of the battery.

Abstract: Features relating to a cartridge for use with a vaporizer body are provided. The cartridge mates with the vaporizer body in a cartridge receptacle. The cartridge may include a cartridge body defining a reservoir configured to contain vaporizable material; a mouthpiece coupled to a proximal end region of the cartridge body; at least one proximal absorbent pad wedged within an internal volume of the mouthpiece; a mouthpiece seal with sealing ribs; a cannula defining a vaporization chamber extending through the cartridge body; a resistive heating element; a porous wick configured to draw the vaporizable material in the reservoir towards the vaporization chamber; an internal sealing gasket positioned in a distal end region of the cartridge body; a lower support structure positioned in the distal end region of the cartridge body; and at least one distal absorbent pad configured to wedge within a recess located in the lower support structure.

Abstract: A method of making a semiconductor device includes: (a) providing a semiconductor substrate that is made from a material containing an element of boron group; (b) forming on the semiconductor substrate a buffer structure that includes an aluminum nitride buffer film formed using a physical vapor deposition technique; and (c) forming on the buffer structure a semiconductor unit that includes a GaN-based epitaxial layer, the GaN-based epitaxial layer having a hexagonal crystal structure and being formed using a chemical vapor deposition technique.

Abstract: The present disclosure provides an element submount and a method for manufacturing the same. The element submount includes a substrate, a first conductive heat-dissipating layer, a second conductive heat-dissipating layer, a first heat-dissipating layer and an element bonding layer. The substrate has opposite first and second surfaces. The first conductive heat-dissipating layer is formed on the first surface. The second conductive heat-dissipating layer is formed on the first surface and separated from the first conductive heat-dissipating layer. The first heat-dissipating layer is formed on the second surface. The element bonding layer is formed on the second conductive heat-dissipating layer. By electroplating and processing techniques, the edge of one or two sides of the element bonding layer exceeds an edge of the second conductive heat-dissipating layer and partially covers a side of the second conductive heat-dissipating layer.

Abstract: A housing module having a circuit board quick-assembling function is applied to an electronic device with a circuit board having a specific height. The housing module includes a housing, an spacer and two pivoting components. The housing includes a substrate and several lateral boards. The spacer includes a main body, two pivoting portions and a locking portion. The pivoting portions are disposed on corresponding sides of the main body, the locking portion stretches from a lower side of the main body and is fixed on the circuit board via an external fixing component. The pivoting portions pass through the lateral boards and are connected to the pivoting portions. While the circuit board slides relative to the substrate to push the spacer, the main body is rotated inside the housing via the pivoting portions to lift the lower side.

Abstract: A server includes a case and function modules. The case includes a frame, a first upright partition and a second upright partition. The frame has an internal space and an opening. The opening corresponds to the internal space. The first upright partition and the second upright partition jointly define a first accommodating portion, a second accommodating portion and a third accommodating portion in the internal space. Each of the function modules is a first function module, a second function module or a third function module. A width of the first function module is half of the width of the second accommodating portion. The width of the first function module, a width of the second function module and a width of the third function module have a ratio of 1:2:4.

Abstract: An assembly includes an electronic device casing, a heat-dissipating module and a waterproofing module. The electronic device casing is formed with an encircling wall. The encircling wall has a wall body and an apertured portion formed in the wall body. The heat-dissipating module is coupled to the electronic device casing, is surrounded by the encircling wall, and includes a heat pipe extending through the apertured portion. The waterproofing module includes a waterproofing element that has a ring portion disposed on a top rim of the wall body, and a sleeve portion having a first sleeve segment that is connected to the ring portion, that is sleeved on the heat pipe and that engages the apertured portion so as to establish water tightness between the heat pipe and the apertured portion.