Patents by Inventor Chen-Yuan Chen
Chen-Yuan Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11791285Abstract: A device includes an outer seal ring, an integrated circuit, and an inner seal ring. The outer seal ring forms a first closed loop. The integrated circuit is surrounded by the outer seal ring. The inner seal ring is between the outer seal ring and the integrated circuit. The inner seal ring forms a second closed loop that defines an enclosed region external to the integrated circuit.Type: GrantFiled: May 13, 2021Date of Patent: October 17, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ming-Hui Yang, Chun-Ting Liao, Yi-Te Chen, Chen-Yuan Chen, Ho-Chun Liou
-
Publication number: 20230238337Abstract: A device includes an integrated circuit, a first seal ring, a second seal ring, and a dielectric layer. The first seal ring surrounds the integrated circuit and includes a plurality of first seal portions separated from each other by a plurality of first gaps. The second seal ring surrounds the integrated circuit, between the integrated circuit and the first seal ring and includes a plurality of second seal portions separated from each other by a plurality of second gaps. The dielectric layer surrounds the first and second seal rings and includes a plurality of first filling portions in the first gaps, respectively, and a plurality of second filling portions in the second gaps, respectively. A connection line of one of the first filling portions and one of the second filling portions closest to said one of the first filling portions is not parallel to edges of the integrated circuit.Type: ApplicationFiled: March 28, 2023Publication date: July 27, 2023Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ming-Hui YANG, Chun-Ting LIAO, Yi-Te CHEN, Chen-Yuan CHEN, Ho-Chun LIOU
-
Publication number: 20210265285Abstract: A device includes an outer seal ring, an integrated circuit, and an inner seal ring. The outer seal ring forms a first closed loop. The integrated circuit is surrounded by the outer seal ring. The inner seal ring is between the outer seal ring and the integrated circuit. The inner seal ring forms a second closed loop that defines an enclosed region external to the integrated circuit.Type: ApplicationFiled: May 13, 2021Publication date: August 26, 2021Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ming-Hui YANG, Chun-Ting LIAO, Yi-Te CHEN, Chen-Yuan CHEN, Ho-Chun LIOU
-
Patent number: 11011478Abstract: A semiconductor device includes an integrated circuit, an outer seal ring, and an inner seal ring. The outer seal ring forms a first closed loop surrounding the integrated circuit. The inner seal ring is between the outer seal ring and the integrated circuit. The inner seal ring has a first seal portion surrounding the integrated circuit and a second seal portion spaced apart from the first seal portion, a first connector interconnecting the first seal portion and the second seal portion, and a second connector spaced apart from the first connector and interconnecting the first seal portion and the second seal portion. The first seal portion, the second seal portion, the first connector, and the second connector form a second closed loop.Type: GrantFiled: July 26, 2019Date of Patent: May 18, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ming-Hui Yang, Chun-Ting Liao, Yi-Te Chen, Chen-Yuan Chen, Ho-Chun Liou
-
Patent number: 10930599Abstract: A method of manufacturing a semiconductor device comprises forming an integrated circuit, surrounding the integrated circuit with an inner seal ring, and surrounding the inner seal ring with a closed-loop outer seal ring. The inner seal ring includes a plurality of metal layers in a stacked configuration, first and second seal portions separated from each other, and third and fourth seal portions spaced apart from the first and second seal portions and separated from each other.Type: GrantFiled: November 30, 2018Date of Patent: February 23, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ming-Hui Yang, Chun-Ting Liao, Yi-Te Chen, Chen-Yuan Chen, Ho-Chun Liou
-
Patent number: 10714384Abstract: A semiconductor device includes an integrated circuit and a guard ring. The integrated circuit includes a first circuit and a second circuit separated from the first circuit. The guard ring is disposed around the first circuit and between the first circuit and the second circuit. The guard ring includes an outer ring, an inner ring, and two connectors. The outer ring is disposed around the first circuit and has a first gap. The inner ring is disposed between the outer ring and the first circuit and has a second gap. The two connectors connect the outer ring and the inner ring. The outer ring, the inner ring, and the two connectors form a closed loop.Type: GrantFiled: August 5, 2019Date of Patent: July 14, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Ming-Hui Yang, Chun-Ting Liao, Chen-Yuan Chen, Ho-Chun Liou, Yi-Te Chen
-
Publication number: 20190363007Abstract: A semiconductor device includes an integrated circuit and a guard ring. The integrated circuit includes a first circuit and a second circuit separated from the first circuit. The guard ring is disposed around the first circuit and between the first circuit and the second circuit. The guard ring includes an outer ring, an inner ring, and two connectors. The outer ring is disposed around the first circuit and has a first gap. The inner ring is disposed between the outer ring and the first circuit and has a second gap. The two connectors connect the outer ring and the inner ring. The outer ring, the inner ring, and the two connectors form a closed loop.Type: ApplicationFiled: August 5, 2019Publication date: November 28, 2019Inventors: Ming-Hui YANG, Chun-Ting LIAO, Chen-Yuan CHEN, Ho-Chun LIOU, Yi-Te CHEN
-
Publication number: 20190348376Abstract: A semiconductor device includes an integrated circuit, an outer seal ring, and an inner seal ring. The outer seal ring forms a first closed loop surrounding the integrated circuit. The inner seal ring is between the outer seal ring and the integrated circuit. The inner seal ring has a first seal portion surrounding the integrated circuit and a second seal portion spaced apart from the first seal portion, a first connector interconnecting the first seal portion and the second seal portion, and a second connector spaced apart from the first connector and interconnecting the first seal portion and the second seal portion. The first seal portion, the second seal portion, the first connector, and the second connector form a second closed loop.Type: ApplicationFiled: July 26, 2019Publication date: November 14, 2019Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ming-Hui YANG, Chun-Ting LIAO, Yi-Te CHEN, Chen-Yuan CHEN, Ho-Chun LIOU
-
Patent number: 10373865Abstract: A semiconductor device includes an integrated circuit and a guard ring. The integrated circuit includes a first circuit and a second circuit separated from the first circuit. The guard ring is disposed around the first circuit and between the first circuit and the second circuit. The guard ring includes an outer ring, an inner ring, and two connectors. The outer ring is disposed around the first circuit and has a first gap. The inner ring is disposed between the outer ring and the first circuit and has a second gap. The two connectors connect the outer ring and the inner ring. The outer ring, the inner ring, and the two connectors form a closed loop.Type: GrantFiled: July 24, 2015Date of Patent: August 6, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Ming-Hui Yang, Chun-Ting Liao, Chen-Yuan Chen, Ho-Chun Liou, Yi-Te Chen
-
Patent number: 10366956Abstract: A semiconductor device includes an integrated circuit, at least one outer seal ring, and at least one inner seal ring. The outer seal ring surrounds the integrated circuit. The outer seal ring includes a plurality of metal layers in a stacked configuration, and the metal layers are closed loops. The inner seal ring is disposed between the outer seal ring and the integrated circuit and separated from the outer seal ring. The inner seal ring has at least one gap extending from a region encircled by the inner seal ring to a region outside the inner seal ring.Type: GrantFiled: July 9, 2015Date of Patent: July 30, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ming-Hui Yang, Chun-Ting Liao, Yi-Te Chen, Chen-Yuan Chen, Ho-Chun Liou
-
Publication number: 20190096827Abstract: A method of manufacturing a semiconductor device comprises forming an integrated circuit, surrounding the integrated circuit with an inner seal ring, and surrounding the inner seal ring with a closed-loop outer seal ring. The inner seal ring includes a plurality of metal layers in a stacked configuration, first and second seal portions separated from each other, and third and fourth seal portions spaced apart from the first and second seal portions and separated from each other.Type: ApplicationFiled: November 30, 2018Publication date: March 28, 2019Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ming-Hui YANG, Chun-Ting LIAO, Yi-Te CHEN, Chen-Yuan CHEN, Ho-Chun LIOU
-
Publication number: 20170025367Abstract: A semiconductor device includes an integrated circuit and a guard ring. The integrated circuit includes a first circuit and a second circuit separated from the first circuit. The guard ring is disposed around the first circuit and between the first circuit and the second circuit. The guard ring includes an outer ring, an inner ring, and two connectors. The outer ring is disposed around the first circuit and has a first gap. The inner ring is disposed between the outer ring and the first circuit and has a second gap. The two connectors connect the outer ring and the inner ring. The outer ring, the inner ring, and the two connectors form a closed loop.Type: ApplicationFiled: July 24, 2015Publication date: January 26, 2017Inventors: Ming-Hui YANG, Chun-Ting LIAO, Chen-Yuan CHEN, Ho-Chun LIOU, Yi-Te CHEN
-
Publication number: 20160365318Abstract: A semiconductor device includes an integrated circuit, at least one outer seal ring, and at least one inner seal ring. The outer seal ring surrounds the integrated circuit. The outer seal ring includes a plurality of metal layers in a stacked configuration, and the metal layers are closed loops. The inner seal ring is disposed between the outer seal ring and the integrated circuit and separated from the outer seal ring. The inner seal ring has at least one gap extending from a region encircled by the inner seal ring to a region outside the inner seal ring.Type: ApplicationFiled: July 9, 2015Publication date: December 15, 2016Inventors: Ming-Hui YANG, Chun-Ting LIAO, Yi-Te CHEN, Chen-Yuan CHEN, Ho-Chun LIOU
-
Patent number: 8528870Abstract: A retaining device for a stand includes a base, a shaft inserted in the base, a handle pivotally mounted on the shaft, and a retainer sleeved on a cam portion of the handle. When the handle is pivotally moved downwards, the retainer can be driven to move toward an extending rod of the stand by actuation of the cam portion of the handle for stopping against the extending rod of the stand and retaining the extending rod of the stand in position.Type: GrantFiled: December 10, 2009Date of Patent: September 10, 2013Assignee: Durq Machinery Corp.Inventors: Chia-Sheng Liu, Chen-Yuan Chen
-
Publication number: 20110067207Abstract: A retaining device for a stand includes a base, a shaft inserted in the base, a handle pivotally mounted on the shaft, and a retainer sleeved on a cam portion of the handle. When the handle is pivotally moved downwards, the retainer can be driven to move toward an extending rod of the stand by actuation of the cam portion of the handle for stopping against the extending rod of the stand and retaining the extending rod of the stand in position.Type: ApplicationFiled: December 10, 2009Publication date: March 24, 2011Applicant: DURQ MACHINERY CORP.Inventors: Chia-Sheng LIU, Chen-Yuan Chen
-
Patent number: 7891278Abstract: An eye-protection cover quick-release structure includes a spreader, which has a notch and a locating hole at the top side and a contracted passage connected between the notch and the locating hole, a bracket, which has a locating groove for accommodating a part of the spreader and an axle hole, an axle pin, which is insertable through the axle hole of the bracket and the locating hole of the spreader and has a shank and a shoulder, and a handle fastened to the shank of the axle pin and biasable between a pressed position where the shoulder of the axle pin is forced into the locating hole of the spreader to lock the bracket to the spreader and a lifted position where the shank of the axle pin is forced into the locating hole of the spreader and movable through the contracted passage for allowing the bracket to be separated from the spreader.Type: GrantFiled: January 12, 2009Date of Patent: February 22, 2011Assignee: Durq Machinery Corp.Inventors: Chia-Sheng Liu, Chen-Yuan Chen
-
Publication number: 20100116114Abstract: An eye-protection cover quick-release structure includes a spreader, which has a notch and a locating hole at the top side and a contracted passage connected between the notch and the locating hole, a bracket, which has a locating groove for accommodating a part of the spreader and an axle hole, an axle pin, which is insertable through the axle hole of the bracket and the locating hole of the spreader and has a shank and a shoulder, and a handle fastened to the shank of the axle pin and biasable between a pressed position where the shoulder of the axle pin is forced into the locating hole of the spreader to lock the bracket to the spreader and a lifted position where the shank of the axle pin is forced into the locating hole of the spreader and movable through the contracted passage for allowing the bracket to be separated from the spreader.Type: ApplicationFiled: January 12, 2009Publication date: May 13, 2010Applicant: DURQ MACHINERY CORP.Inventors: Chia-Sheng Liu, Chen-Yuan Chen
-
Patent number: 7681893Abstract: A folding support settable between an extended position and a received position is disclosed to include a rack for holding thereon a table machine, a pair of first legs and a pair of second legs respectively pivoted to the rack for supporting the rack above the floor, two first links respectively pivoted to the rack, and two second links respectively pivoted to the second legs and the first links. The first links and the second links are moved with the second legs toward the first legs when receiving the folding support, and at the same time the first links are stopped against the first legs, assuring safety of the receiving action.Type: GrantFiled: March 13, 2007Date of Patent: March 23, 2010Assignee: Durq Machinery Corp.Inventors: Chia-Sheng Liu, Chen-Yuan Chen
-
Patent number: 7494149Abstract: A support structure for table machine includes a top frame unit holding a table machine, and a folding mechanism movable between an extended position to support the top frame unit in horizontal and a received position to hold the top frame unit in vertical. The folding mechanism has two first legs and two second legs and two first connecting members respectively pivoted to the top frame unit, and two second connecting members and two third connecting members pivotally coupled between the front legs and the first connecting members such that when the folding mechanism is moved toward the receiving position, the first, second and third connecting members are moved with the second legs toward the first legs smoothly.Type: GrantFiled: March 13, 2007Date of Patent: February 24, 2009Assignee: Durq Machinery Corp.Inventors: Chia-Sheng Liu, Chen-Yuan Chen
-
Publication number: 20080067786Abstract: A support structure for table machine includes a top frame unit holding a table machine, and a folding mechanism movable between an extended position to support the top frame unit in horizontal and a received position to hold the top frame unit in vertical. The folding mechanism has two first legs and two second legs and two first connecting members respectively pivoted to the top frame unit, and two second connecting members and two third connecting members pivotally coupled between the front legs and the first connecting members such that when the folding mechanism is moved toward the receiving position, the first, second and third connecting members are moved with the second legs toward the first legs smoothly.Type: ApplicationFiled: March 13, 2007Publication date: March 20, 2008Applicant: DURQ MACHINERY CORP.Inventors: Chia-Sheng Liu, Chen-Yuan Chen