Patents by Inventor Chen-Yuan Hsia

Chen-Yuan Hsia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for removing particles in semiconductor manufacturing
    Patent number: 8046860
    Abstract: A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path.
    Type: Grant
    Filed: September 20, 2010
    Date of Patent: November 1, 2011
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Yuan Hsia, Chang-Cheng Hung, Chi-Lun Lu, Shih-Ming Chang, Wen-Chuan Wang, Yen-Bin Huang, Ching-Yu Chang, Chin-Hsiang Lin
  • SYSTEM AND METHOD FOR REMOVING PARTICLES IN SEMICONDUCTOR MANUFACTURING
    Publication number: 20110005010
    Abstract: A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path.
    Type: Application
    Filed: September 20, 2010
    Publication date: January 13, 2011
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Yuan Hsia, Chang-Cheng Hung, Chi-Lun Lu, Shih-Ming Chang, Wen-Chuan Wang, Yen-Bin Huang, Ching-Yu Chang, Chin-Hsiang Lin
  • System and method for removing particles in semiconductor manufacturing
    Patent number: 7819980
    Abstract: A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path.
    Type: Grant
    Filed: August 16, 2005
    Date of Patent: October 26, 2010
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Yuan Hsia, Chang-Cheng Hung, Chi-Lun Lu, Shih-Ming Chang, Wen-Chuan Wang, Yen-Bin Huang, Ching-Yu Chang, Chin-Hsiang Lin
  • Dimension monitoring method and system
    Patent number: 7460251
    Abstract: A system and method are disclosed for monitoring a dimensional change of a pattern for an object having a transparent layer exposed through the pattern and a non-transparent pattern laminated therewith. According to the method, a first beam is projected to the pattern. A second beam resulted from the first beam passing through the transparent layer exposed by the pattern, or from the first beam reflected from the non-transparent layer of the pattern, is detected. A value of a predetermined property from the second beam detected is obtained. A variation of the value is monitored for identifying the dimensional change of the pattern.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: December 2, 2008
    Assignee: Taiwan Semiconductor Manufacturing Co.
    Inventors: Shih-Ming Chang, Chen-Yuan Hsia, Wen-Chuan Wang, Chi-Lun Lu, Yen-Bin Huang, Chang-Cheng Hung, Chia-Jen Chen, Kai-Chung Liu, Hsin-Chang Lee, Hong-Chang Hsieh
  • Dimension monitoring method and system
    Publication number: 20070075037
    Abstract: A system and method are disclosed for monitoring a dimensional change of a pattern for an object having a transparent layer exposed through the pattern and a non-transparent pattern laminated therewith. According to the method, a first beam is projected to the pattern. A second beam resulted from the first beam passing through the transparent layer exposed by the pattern, or from the first beam reflected from the non-transparent layer of the pattern, is detected. A value of a predetermined property from the second beam detected is obtained. A variation of the value is monitored for identifying the dimensional change of the pattern.
    Type: Application
    Filed: October 5, 2005
    Publication date: April 5, 2007
    Inventors: Shih-Ming Chang, Chen-Yuan Hsia, Wen-Chuan Wang, Chi-Lun Lu, Yen-Bin Huang, Chang-Cheng Hung, Chia-Jen Chen, Kai-Chung Liu, Hsin-Chang Lee, Hong Hsieh
  • System and method for removing particles in semiconductor manufacturing
    Publication number: 20070039631
    Abstract: A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path.
    Type: Application
    Filed: August 16, 2005
    Publication date: February 22, 2007
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Yuan Hsia, Chang-Cheng Hung, Chi-Lun Lu, Shih-Ming Chang, Wen-Chuan Wang, Yen-Bin Huang, Ching-Yu Chang, Chin-Hsiang Lin