Patents by Inventor Chen-Yuan Lee
Chen-Yuan Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11990381Abstract: In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.Type: GrantFiled: November 14, 2022Date of Patent: May 21, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai, Po-Yuan Teng, Chen-Hua Yu
-
Patent number: 11990258Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler, and a titanium-containing dielectric filler. The polymer matrix has a fluoropolymer. The titanium-containing dielectric filler has a compound represented by a general formula of MTiO3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing dielectric filler accounts to for 5-15% by volume of the PTC material layer.Type: GrantFiled: September 28, 2022Date of Patent: May 21, 2024Assignee: POLYTRONICS TECHNOLOGY CORP.Inventors: Hsiu-Che Yen, Yung-Hsien Chang, Cheng-Yu Tung, Chen-Nan Liu, Chia-Yuan Lee, Yu-Chieh Fu, Yao-Te Chang, Fu-Hua Chu
-
Publication number: 20240145132Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, and a conductive filler. The polymer matrix has a fluoropolymer. The total volume of the PTC material layer is calculated as 100%, and the fluoropolymer accounts for 47-62% by volume of the PTC material layer. The fluoropolymer has a melt viscosity higher than 3000 Pa·s.Type: ApplicationFiled: March 16, 2023Publication date: May 2, 2024Inventors: CHENG-YU TUNG, CHEN-NAN LIU, Chia-Yuan Lee, HSIU-CHE YEN, YUNG-HSIEN CHANG, Yao-Te Chang, FU-HUA CHU
-
Publication number: 20240145133Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.Type: ApplicationFiled: April 5, 2023Publication date: May 2, 2024Inventors: CHEN-NAN LIU, YUNG-HSIEN CHANG, CHENG-YU TUNG, HSIU-CHE YEN, Chia-Yuan LEE, Yao-Te CHANG, FU-HUA CHU
-
Publication number: 20240127988Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.Type: ApplicationFiled: March 2, 2023Publication date: April 18, 2024Inventors: HSIU-CHE YEN, YUNG-HSIEN CHANG, CHENG-YU TUNG, Chia-Yuan Lee, CHEN-NAN LIU, Yao-Te Chang, FU-HUA CHU
-
Publication number: 20240127989Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 33% to 42%.Type: ApplicationFiled: January 25, 2023Publication date: April 18, 2024Inventors: CHIA-YUAN LEE, CHENG-YU TUNG, HSIU-CHE YEN, CHEN-NAN LIU, YUNG-HSIEN CHANG, YAO-TE CHANG, FU-HUA CHU
-
Patent number: 8848376Abstract: A rack-mounted console module includes a lower unit slideably mounted on a rail and an upper unit pivotally coupled to the lower unit. A locking mechanism includes a first part moveably disposed in the lower unit and a second part fixedly disposed on the rail. When the upper unit is closed and the lower unit slides along the rail to a target position, the first part of the locking mechanism changes from a released state to a locked state where it engages the second part of the locking mechanism to lock the lower unit. When the upper unit is opened, the first part changes from the locked state to a ready-to-released state. When the upper unit is subsequently closed, the first part changes from the ready-to-released state to a released state where it disengages from the second part, and the console module can be slid back into the rack.Type: GrantFiled: September 9, 2011Date of Patent: September 30, 2014Assignee: Aten International Co., Ltd.Inventor: Chen-Yuan Lee
-
Publication number: 20120176739Abstract: A rack-mounted console module includes a lower unit slideably mounted on a rail and an upper unit pivotally coupled to the lower unit. A locking mechanism includes a first part moveably disposed in the lower unit and a second part fixedly disposed on the rail. When the upper unit is closed and the lower unit slides along the rail to a target position, the first part of the locking mechanism changes from a released state to a locked state where it engages the second part of the locking mechanism to lock the lower unit. When the upper unit is opened, the first part changes from the locked state to a ready-to-released state. When the upper unit is subsequently closed, the first part changes from the ready-to-released state to a released state where it disengages from the second part, and the console module can be slid back into the rack.Type: ApplicationFiled: September 9, 2011Publication date: July 12, 2012Applicant: ATEN INTERNATIONAL CO., LTD.Inventor: Chen-Yuan LEE
-
Publication number: 20110291805Abstract: The present disclosure teaches an RFID chip reader comprising two spaced-apart antennae in electrical communication with each other, with one antenna being incorporated into the chip reader, and with the other antenna separate from the main body of the chip reader but in electrical communication with the other antenna by suitable circuitry. The RFID chip reader may optionally include tuner means disposed within the circuitry connecting the two antennae. One antenna may be smaller than the other to facilitate reading of data from an RFID chip associated with an object made from a electrically-conductive material. The chip reader may optionally incorporate tuner means associated with the circuitry connecting the antennas, to optimize circuitry effectiveness. Also taught is an RFID plug comprising an RFID chip encased within a non-conductive matrix, and having deformable projections to facilitate effectively permanent press-fit installation into a plug-receiving pocket in an object associated with the RFID chip.Type: ApplicationFiled: April 8, 2011Publication date: December 1, 2011Inventors: Christopher D. GELOWITZ, Chen Yuan LEE
-
Patent number: 7414853Abstract: A KVM operation console includes a lower body and an upper body. The lower body and the upper body are assembled into and can be separately slid from an industrial console. A lock mechanism is installed in a bottom cover of the upper body. An L-shaped arm and is pivotally connected with the bottom cover. A lock shaft and a handle are respectively pivotally connected with two ends of the L-shaped arm. The handle is moved to retract the lock shaft from or extend the lock shaft into an opening of the bottom cover by a torque of the L-shaped arm. The extended lock shaft is inserted into a hole of the industrial console so as to secure the upper body. The upper body blocks a holder of the lower body to prevent the lower body from sliding out of the industrial console.Type: GrantFiled: November 28, 2005Date of Patent: August 19, 2008Assignee: Aten International Co., LtdInventor: Chen-Yuan Lee
-
Publication number: 20070121302Abstract: A KVM operation console includes a lower body and an upper body. The lower body and the upper body are assembled into and can be separately slid from an industrial console. A lock mechanism is installed in a bottom cover of the upper body. An L-shaped arm and is pivotally connected with the bottom cover. A lock shaft and a handle are respectively pivotally connected with two ends of the L-shaped arm. The handle is moved to retract the lock shaft from or extend the lock shaft into an opening of the bottom cover by a torque of the L-shaped arm. The extended lock shaft is inserted into a hole of the industrial console so as to secure the upper body. The upper body blocks a holder of the lower body to prevent the lower body from sliding out of the industrial console.Type: ApplicationFiled: November 28, 2005Publication date: May 31, 2007Inventor: Chen-Yuan Lee