Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: The embodiments described herein are directed to a method for reducing fin oxidation during the formation of fin isolation regions. The method includes providing a semiconductor substrate with an n-doped region and a p-doped region formed on a top portion of the semiconductor substrate; epitaxially growing a first layer on the p-doped region; epitaxially growing a second layer different from the first layer on the n-doped region; epitaxially growing a third layer on top surfaces of the first and second layers, where the third layer is thinner than the first and second layers. The method further includes etching the first, second, and third layers to form fin structures on the semiconductor substrate and forming an isolation region between the fin structures.

Abstract: The embodiments described herein are directed to a method for reducing fin oxidation during the formation of fin isolation regions. The method includes providing a semiconductor substrate with an n-doped region and a p-doped region formed on a top portion of the semiconductor substrate; epitaxially growing a first layer on the p-doped region; epitaxially growing a second layer different from the first layer on the n-doped region; epitaxially growing a third layer on top surfaces of the first and second layers, where the third layer is thinner than the first and second layers. The method further includes etching the first, second, and third layers to form fin structures on the semiconductor substrate and forming an isolation region between the fin structures.

Abstract: A system includes an image capturing device, a subject reference marker disposed adjacent to a subject, a tool reference marker disposed on a treatment tool, a display device mounted on an operator, an operator reference marker disposed on the display device, and a processor. The image capturing device includes two image capturing modules that simultaneously and respectively capture two images of the operator, the subject, and the treatment tool. The processor receives the images, analyzes the images to obtain spatial locations of the reference markers, and transmits coordinate information and auxiliary information.

Abstract: In a proposed surgical navigation method for a surgical operation to be performed on an operation target, a mobile device stores 3D imaging information that relates to the operation target before the surgical operation. Then, an optical positioning system is used to acquire spatial coordinate information relating to the mobile device and the operation target, so that the mobile device can obtain a relative coordinate which is a vector from the operation target to the mobile device, obtain a 3D image based on the relative coordinate and the 3D imaging information, and display the 3D image based on the relative coordinate, such that visual perception of the operation target through the mobile device has the 3D image superimposed thereon.

Abstract: A system includes an image capturing device, a subject reference marker disposed adjacent to a subject, a tool reference marker disposed on a treatment tool, a display device mounted on an operator, an operator reference marker disposed on the display device, and a processor. The image capturing device includes two image capturing modules that simultaneously and respectively capture two images of the operator, the subject, and the treatment tool. The processor receives the images, analyzes the images to obtain spatial locations of the reference markers, and transmits coordinate information and auxiliary information.

Abstract: A Universal Serial Bus (USB) controller with a VIDS pin to set up a plurality of vendor identification which can be accompanied with interface and software program. Thus, one chip can achieve Vendor ID/Product ID (VID/PID) of 2N types (N is a positive integer equal to or greater than 1) in accordance with various USB manufactures and products.