Abstract: A device is provided. The device may be an optical device, a light coupling device, or a tunable light coupling device. The device includes a first portion, a lens, a light emitting element, and a waveguide. The first portion is disposed adjacent to a surface of a substrate and has a first side and a second side opposite to the first side. The light emitting element is disposed adjacent to the second side of the first portion. The lens is disposed adjacent to the first side of the first portion and between the light emitting element and the waveguide.

Abstract: A device is provided. The device may be an optical device, a light coupling device, or a tunable light coupling device. The device includes a first portion, a lens, a light emitting element, and a waveguide. The first portion is disposed adjacent to a surface of a substrate and has a first side and a second side opposite to the first side. The light emitting element is disposed adjacent to the second side of the first portion. The lens is disposed adjacent to the first side of the first portion and between the light emitting element and the waveguide.

Abstract: A semiconductor package includes a semiconductor die having a first surface and a second surface opposite to the first surface, a conductive wiring layer stacked with the semiconductor die and proximal to the first surface, an encapsulant encapsulating the semiconductor die and stacked with the conductive wiring layer, and a replacement structure exposing from the encapsulant and being free of fillers. A method for manufacturing the semiconductor package is also disclosed in the present disclosure.

Abstract: A device structure includes a first electronic structure and a plurality of first electric contacts. The first electronic structure has a surface and a center. The first electric contacts are exposed from the surface. The first electric contacts are spaced by a pitch that increases with increasing distance from the center.

Abstract: A device structure includes a first electronic structure and a plurality of first electric contacts. The first electronic structure has a surface and a center. The first electric contacts are exposed from the surface. The first electric contacts are spaced by a pitch that increases with increasing distance from the center.

Abstract: A semiconductor package includes a semiconductor die having a first surface and a second surface opposite to the first surface, a conductive wiring layer stacked with the semiconductor die and proximal to the first surface, an encapsulant encapsulating the semiconductor die and stacked with the conductive wiring layer, and a replacement structure exposing from the encapsulant and being free of fillers. A method for manufacturing the semiconductor package is also disclosed in the present disclosure.

Abstract: A semiconductor device package includes a redistribution layer, a first semiconductor device, a second semiconductor device, a first insulation body, and a second insulation body. The first semiconductor device can be disposed on the redistribution layer. The second semiconductor device can be stacked on the first semiconductor device. The first insulation body can be disposed between the first semiconductor device and the second semiconductor device. The first insulation body may have a number of first particles. The second insulation body can encapsulate the first insulation body and have a number of second particles. One of the number of first particles can have a flat surface.

Abstract: A pressure relief valve comprising a tubular main body with a pressure relief perforation, a pressure adjustor with an anti-leakage rubber and an anti-reverse member; wherein the main body further comprises air inlet and outlet, a channel between the inlet and outlet and with a through-hole penetrating the main body. The pressure adjustor is mounted on the through-hole and the anti-reverse member is mounted on the outlet. As the inlet is connected to an air pump and the outlet is connected to a filling-article, a pressure value is preset with the pressure adjustor such that when the filling-article reaches the preset pressure value, the anti-reverse member engages the channel to move the anti-leakage rubber of the pressure adjustor upward and the air is released from the pressure release perforation in order to stably maintain the filling-article at an air-filling state within the preset pressure value.

Abstract: The present invention provides an improved pressure relief valve comprising a tubular main body with a pressure relief peroration, a pressure adjustor with an anti-leakage rubber and an anti-reverse unit; wherein the main body comprises a mount opening, an air outlet and a conduit between the air intake and outlet. The conduit comprises an abutting portion; the pressure adjustor is mounted on the air intake and the anti-reverse unit is fastened onto said outlet. As the pressure adjustor is connected to an air pump and said outlet is connected to an air-filling article, the pressure value of said article is set via the pressure adjustor. As said article reaches said pressure value, the anti-leakage rubber of the pressure adjustor is pushed such that air is released from the relief perforation and the anti-reverse unit abuts the staged portion of the conduit to maintain the article at a stabilized filling state.

Abstract: The present invention provides an improved pressure relief valve comprising a tubular main body with a pressure relief perforation, a pressure adjustor with an anti-leakage rubber and an anti-reverse member; wherein the main body further comprises air inlet and outlet, a channel between the inlet and outlet and with a through-hole penetrating the main body. The pressure adjustor is mounted on the through-hole and the anti-reverse member is mounted on the outlet. As the inlet is connected to an air pump and the outlet is connected to a filling-article, a pressure value is preset with the pressure adjustor such that when the filling-article reaches the preset pressure value, the anti-reverse member engages the channel to move the anti-leakage rubber of the pressure adjustor upward and the air is released from the pressure release perforation in order to stably maintain the filling-article at an air-filling state within the preset pressure value.

Abstract: The present invention provides an improved pressure relief valve comprising a tubular main body with a pressure relief peroration, a pressure adjustor with an anti-leakage rubber and an anti-reverse unit; wherein the main body comprises a mount opening, an air outlet and a conduit between the air intake and outlet. The conduit comprises an abutting portion; the pressure adjustor is mounted on the air intake and the anti-reverse unit is fastened onto said outlet. As the pressure adjustor is connected to an air pump and said outlet is connected to an air-filling article, the pressure value of said article is set via the pressure adjustor. As said article reaches said pressure value, the anti-leakage rubber of the pressure adjustor is pushed such that air is released from the relief perforation and the anti-reverse unit abuts the staged portion of the conduit to maintain the article at a stabilized filling state.