Patents by Inventor Chen Yuang CHEN

Chen Yuang CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210125909
    Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.
    Type: Application
    Filed: January 4, 2021
    Publication date: April 29, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Lin HO, Chih-Cheng LEE, Chun Chen CHEN, Chen Yuang CHEN
  • Semiconductor device package, electronic assembly and method for manufacturing the same
    Patent number: 10886208
    Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: January 5, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Lin Ho, Chih-Cheng Lee, Chun Chen Chen, Chen Yuang Chen
  • SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20200251421
    Abstract: A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.
    Type: Application
    Filed: January 31, 2019
    Publication date: August 6, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chen Yuang CHEN, Jiming LI, Chun Chen CHEN, Yuanhao YU
  • SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20200118912
    Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.
    Type: Application
    Filed: January 31, 2019
    Publication date: April 16, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Lin HO, Chih-Cheng LEE, Chun Chen CHEN, Chen Yuang CHEN