Patents by Inventor Chen ZHUANG

Chen ZHUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat extraction path from a laser die using a highly conductive thermal interface material in an optical transceiver
    Patent number: 12183650
    Abstract: A semiconductor package comprises a substrate and a ceramic carrier mounted to the substrate. An integrated circuit (IC) die is mounted to the ceramic carrier. A heat extraction path away from the IC die comprises: i) a thermal interface material over the IC die, the thermal interface material having a thickness of approximately 25 to 80 um; ii) an integrated heat spreader over the thermal interface material; iii) a ceramic carrier plate over the integrated heat spreader; and iv) an electrically conductive thermal pad between the ceramic carrier plate and a housing of the semiconductor package.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: December 31, 2024
    Assignee: Intel Corporation
    Inventors: Aditi Mallik, Chen Zhuang, Raghuram Narayan
  • HEAT EXTRACTION PATH FROM A LASER DIE USING A HIGHLY CONDUCTIVE THERMAL INTERFACE MATERIAL IN AN OPTICAL TRANSCEIVER
    Publication number: 20220199486
    Abstract: A semiconductor package comprises a substrate and a ceramic carrier mounted to the substrate. An integrated circuit (IC) die is mounted to the ceramic carrier. A heat extraction path away from the IC die comprises: i) a thermal interface material over the IC die, the thermal interface material having a thickness of approximately 25 to 80 um; ii) an integrated heat spreader over the thermal interface material; iii) a ceramic carrier plate over the integrated heat spreader; and iv) an electrically conductive thermal pad between the ceramic carrier plate and a housing of the semiconductor package.
    Type: Application
    Filed: December 22, 2020
    Publication date: June 23, 2022
    Inventors: Aditi MALLIK, Chen ZHUANG, Raghuram NARAYAN