Abstract: Disclosed is an application of a hydrophobic phthalocyanine as a heterogeneous catalyst in oxidizing phenol wastewater by hydrogen peroxide. A hydrophobic silane is decorated on a bacterial cellulose-metal phthalocyanine heterogeneous catalyst to obtain a hydrophobic phthalocyanine heterogeneous catalyst; during the catalytic degradation of phenols, the obtained catalyst is capable of adjusting a concentration of hydrogen peroxide oxidant around the catalyst. A preparation method of the hydrophobic phthalocyanine comprises: 1. preparing a mixed solution of a bacterial cellulose medium containing metal phthalocyanine; 2. adding acetic acid bacterium into the mixed solution obtained in step 1 for biological culture; 3. heating the product obtained in step 2, and taking out a solid for cleaning and drying; 4. preparing a hydrophobic silane solution; and 5. immersing the product obtained in step 3 into the solution obtained in step 4, and taking out a solid after reaction for cleaning and drying.

Abstract: A portable electronic device with a movable door cover including a host, at least one door cover pivoted to the host to be opened or closed relative to the host, at least one linking member connected to the door cover, a shape-memory alloy (SMA) spring connected between the linking member and the host, and a heat source disposed in the host is provided. The SMA spring is affected by heat generated from the heat source to form at least two stretching states, and drives the door cover through the linking member to form at least two states including said being opened or closed.

Abstract: A pixel array substrate includes data lines, first gate lines, pixel structures, first common lines, and conductive line sets. The conductive line sets are arranged in a first direction. Each of the conductive line sets includes first conductive line groups and a second conductive line group sequentially arranged in the first direction. Each of the first conductive line groups includes second gate lines and a second common line. The second conductive line group includes first auxiliary lines and a second common line. An arrangement order of the second gate lines and the second common line of each of the first conductive line groups in the first direction are the same as an arrangement order of the first auxiliary lines and the second common line of the second conductive line group in the first direction, respectively.

Abstract: An electronic apparatus performs a method of representing a 3D shape that includes: dividing a 3D space enclosing the 3D shape into a plurality of 3D spaces with a hierarchical octree structure; generating local implicit functions, and each of the local implicit functions corresponds to a respective 3D space of the plurality of 3D spaces; and reconstructing a representation of the 3D shape from the local implicit functions with the hierarchical octree structure. In some embodiments, the 3D space is recursively subdivided into the child octants according to the surface occupancy and richness of the geometry of the 3D shape, and a respective local implicit function is generated corresponding to a geometry of a part of the surface.

Abstract: A headrest support structure applied to a safety seat is disclosed. The headrest support structure includes a buffer mechanism. The buffer mechanism is connected to a headrest and a seat of the safety seat. Elastic deformation of the buffer mechanism provides a buffer to the headrest and the seat. The headrest support mechanism provided by an embodiment of the present application has a high safety factor and provides a buffer to the headrest and the seat during an emergency brake for accident prevention. The present application further provides an infant carrier having the headrest support structure.

Abstract: A method for forming a semiconductor structure is provided. In one form, a method includes: providing a base, where the base includes first regions and a second region located between the first regions; forming a pattern definition layer on the base; forming discrete mask layers on the pattern definition layer, the mask layers and the base defining openings, where openings of the first regions serve as first openings, and an opening of the second region serves as a second opening; forming a filling layer in the second opening; and etching, using the mask layers and the filling layer as masks, the pattern definition layer exposed from the first openings, to form target patterns.

Abstract: The invention discloses a modular differential compliant displacement reducer with output in same direction or reverse direction of input. The modular differential compliant displacement reducer includes a forward motion module, a reverse motion module and an actuator, and two ends of the forward motion module are respectively connected to one end of the reverse motion module. Differential superposition of displacement is achieved through combination of the forward motion module and the reverse motion module, a large displacement reduction ratio can be obtained, and therefore the resolution ratio and precision of motion are greatly improved. The reducer can be matched with a macro-motion platform, and large-range and ultrahigh-precision motion positioning is achieved.

Abstract: Methods for forming light emitting diodes (LEDs) that leverage cavity profiles and induced stresses to alter emitted wavelengths of the LEDs. In some embodiments, the method includes forming a cavity on a substrate where the cavity has a cavity profile that is configured to accept an emitter pixel structure for an LED, forming at least one passivation layer in the cavity, and forming at least one optical layer in the cavity on at least a portion of one of the at least one passivation layer. The at least one optical layer is configured to increase a lumen output of the emitter pixel structure. The method further includes forming the emitter pixel structure in the cavity on the at least one optical layer of the emitter pixel structure where the cavity profile is configured to adjust an emitted light wavelength of the emitter pixel structure.

Abstract: A multi-layer segmentation/stalk cutter device for a first season of double-crop rice and a control method, and a combine harvester for a first season of double-crop rice, the multi-layer segmentation/stalk cutter device comprising: a cutting platform, a segmenting cutter and a stalk cutter, at least one segmenting cutter being disposed at a lower rear portion of the cutting platform, the segmenting cutter being hinged on a moving chassis, and a second execution mechanism controlling the cutting height of the segmenting cutter; the stalk cutter being disposed at a lower rear portion of the segmenting cutter, the stalk cutter being hinged on the moving chassis, and a third execution mechanism controlling the cutting height of the stalk cutter.

Abstract: A semiconductor device includes a buried metal line disposed in a semiconductor substrate, a first dielectric material on a first sidewall of the buried metal line and a second dielectric material on a second sidewall of the buried metal line, a first multiple fins disposed proximate the first sidewall of the buried metal line, a second multiple fins disposed proximate the second sidewall of the buried metal line, a first metal gate structure over the first multiple fins and over the buried metal line, wherein the first metal gate structure extends through the first dielectric material to contact the buried metal line, and a second metal gate structure over the second multiple fins and over the buried metal line.

Abstract: An adaptor device includes a first interface for coupling to a first processor, a second interface for coupling to a second processor, the second interface being different than the first interface, and a plurality of third interfaces, which are different than either the first interface or the second interface. The plurality of third interfaces are configured for coupling to a corresponding plurality of external devices. The adaptor device is configured to receive, at the first interface, a first signal from the first processor. In response to the first signal, the adaptor device couples through the plurality of third interfaces to the plurality of external devices to enable the first processor substantially concurrent access to the plurality of external devices. The adaptor device is also configured to receive, at the first interface, a second signal from the first processor.

Abstract: A display device includes a semiconductor substrate, an isolation layer, a light-emitting layer and a second electrode. The semiconductor substrate has a pixel region and a peripheral region located around the pixel region. The semiconductor substrate includes first electrodes and a driving element layer. The first electrodes are disposed in the pixel region and the first electrodes are electrically connected to the driving element layer. The isolation layer is disposed on the semiconductor substrate. The isolation layer includes a first isolation pattern disposed in the peripheral region, and the first isolation pattern has a first side surface and a second side surface opposite to the first side surface. The light-emitting layer is disposed on the isolation layer and the first electrodes, and covers the first side surface and the second side surface of the first isolation pattern. The second electrode is disposed on the light-emitting layer.

Abstract: Apparatus, methods, and computer-readable media for facilitating multiplexing of downlink grant-triggered aperiodic channel state information reports on an uplink control channel are disclosed herein. An example method for wireless communication at a UE includes receiving scheduling to provide multiple A-CSI reports while foregoing A-CSI multiplexing, the scheduling for up to two A-CSI reports in a same slot for the UE, and the multiple A-CSI reports being non-overlapping in time in the same slot. The example method also includes transmitting the multiple A-CSI reports to a base station in respective PUCCH in the same slot and while foregoing CSI multiplexing.

Abstract: A decoding method for decoding blocks of a picture part is disclosed that comprises: —decoding a plurality of candidate sets of filter parameters from a bitstream; —decoding for a current block of said picture an index identifying one of the accessing a bitstream candidate sets of filter parameters from said bitstream; —decoding said current block from said bitstream; and —filtering said decoded current block with the candidate set of filter parameters of filter parameters from a bitstream identified by said decoded index decoding for a current block an index.

Abstract: A passive optical alignment coupling between an optical connector having a first two-dimensional planar array of alignment features and a foundation having a second two-dimensional planar array of alignment features. One of the arrays is a network of orthogonally intersecting longitudinal grooves defining an array of discrete protrusions that are each in a generally pyramidal shape with a truncated top separated from one another by the orthogonally intersecting longitudinal grooves, and the other array is a network of longitudinal cylindrical protrusions. The cylindrical protrusions are received in the grooves, with protrusion surfaces of the cylindrical protrusions in contact with groove surfaces and the top of the discrete protrusions contacting the surface bound by the cylindrical protrusions.

Abstract: A semiconductor package structure includes a substrate, a die and a conductive structure. The die is disposed on or within the substrate. The die has a first surface facing away from the substrate and includes a sensing region and a pad at the first surface of the die. The first surface of the die has a first edge and a second edge opposite to the first edge. The sensing region is disposed adjacent to the first edge. The pad is disposed away from the first edge. The conductive structure electrically connects the pad and the substrate. The sensing region has a first end distal to the first edge of the first surface of the die. A distance from the first end of the sensing region to a center of the pad is equal to or greater than a distance from the first end of the sensing region to the first edge of the first surface of the die.

Abstract: This application provides a method for detecting images of testing object using hyperspectral imaging. Firstly, obtaining a hyperspectral imaging information according to a reference image, hereby, obtaining corresponded hyperspectral image from an input image and obtaining corresponded feature values for operating Principal components analysis to simplify feature values. Then, obtaining feature images by Convolution kernel, and then positioning an image of an object under detected by a default box and a boundary box from the feature image. By Comparing with the esophageal cancer sample image, the image of the object under detected is classifying to an esophageal cancer image or a non-esophageal cancer image. Thus, detecting an input image from the image capturing device by the convolutional neural network to judge if the input image is the esophageal cancer image for helping the doctor to interpret the image of the object under detected.