Abstract: In one example, a fluid flow structure includes a micro device embedded in a printed circuit board (PCB). Fluid may flow to the micro device through a channel in the PCB and a PCB conductor is connected to a conductor on the embedded micro device.

Abstract: A MEMS speaker including a base, a circuit board, a spacing layer, a vibration mold, and at least one actuator. The base has a first chamber. The circuit board is disposed on the base, and has at least one support portion and a fixing portion disposed around the support portion. The at least one support portion has a first perforation, and a plurality of second perforations are formed between the at least one support portion and the fixing portion. The spacing layer is disposed on the circuit board. A second chamber is formed between the spacing layer and the circuit board. The vibration mold is disposed on the spacing layer. The actuator is disposed on the support portion of the circuit board. The actuator has a shift part and a deformation part disposed above the first perforation of the support portion. The second perforations communicate with the first chamber and the second chamber.

Abstract: A purifying device including a container, at least one cover, a sensing assembly and an ultraviolet source is provided. The container has a containing space, wherein the containing space is adapted to contain a liquid. The cover is adapted to be connected to the container to cover the containing space. The sensing assembly is disposed on the cover, wherein the sensing assembly is adapted to sense a usage state of the cover. The ultraviolet source is disposed on the cover and is adapted to generate an ultraviolet emitted to outside of the cover, wherein the ultraviolet source is turned on or turned off according the usage state of the cover.

Abstract: A semiconductor device includes a semiconductor substrate, a plurality of semiconductor fins, a gate stack and an epitaxy structure. The semiconductor fins are present on the semiconductor substrate. The semiconductor fins respectively include recesses therein. The gate stack is present on portions of the semiconductor fins that are adjacent to the recesses. The epitaxy structure is present across the recesses of the semiconductor fins. The epitaxy structure includes a plurality of corners and at least one groove present between the corners, and the groove has a curvature radius greater than that of at least one of the corners.

Abstract: A tamper-proof lock includes: a housing, shaft/handle, cam, lever, spring, and plate. The shaft is pivotally mounted in a housing orifice, with the cam pivotally mounted to the shaft. The cam has first and second shaped openings at first and second respective radial positions, and an arcuate recess. The lever is secured to the shaft, and has a protrusion that alternately engages each of first and second ends of the arcuate recess to respectively/selectively drive the cam to rotate/counter-rotate in first and second directions, into locked and unlocked cam positions. The spring biases the plate for a protrusion thereon to be respectively received within each of first and second shaped cam openings, when aligned therewith at those cam positions, and for a curved surface of the plate to be correspondingly received within first and second curved cam recesses, respectively, when aligned therewith, which facilitate withdrawal of the plate protrusion.

Abstract: An adapter and a method for charging control are disclosed. The adapter includes a power conversion unit, a voltage feedback unit, a current feedback unit, and a power adjustment unit. The power adjustment unit includes an input end coupled to an output end of the voltage feedback unit to an output end of the current feedback unit, and an output end coupled to the power conversion unit. The power adjustment unit is used to receive the voltage feedback signal and the current feedback signal, and stabilize the output voltage and output current of the adapter when the voltage feedback signal indicates that the output voltage of the adapter has reached the target voltage or the current feedback signal indicates the output current of the adapter has reached the target current.

Abstract: The invention generally relates to zwitterionic polymers (including zwitterionic copolymers), such as polymethacrylic structures, with pendent functional moieties, such as therapeutic or biologic moieties. More particularly, the invention relates to phosphorylcholine-substituted methacrylic polymers prepared by free radical polymerization and click chemistry, for example, and compositions and products comprising same, as well as related methods and uses of the compositions, for example, as biological or therapeutic agents and in drug delivery thereof.

Abstract: Communications data having a reliability and latency threshold may be transmitted within a legacy downlink control channel. For example, a user equipment (UE) may utilize low latency services, such as ultra-reliable low latency communications (URLLC). In such cases, a base station may transmit URLLC data in a legacy physical downlink control channel (PDCCH) of a downlink transmission time interval. The UE may determine that the PDCCH includes downlink data. The downlink data may have a delay tolerance below the threshold level (e.g., URLLC data), and the determination may be based on a downlink control information (DCI) payload within the received PDCCH. The UE may then receive the downlink data within the PDCCH. In some examples, the downlink data may be received within the DCI payload. Additionally or alternatively, the DCI payload may provide an indication of resources within the PDCCH that are utilized for carrying the downlink data.

Abstract: According to aspects of the present disclosure, a method includes selecting a faying surface of a first metal substrate, placing a reaction material on the faying surface, and attaching, prior to a second metal substrate being adjacent the first metal substrate, the reaction material to the faying surface via ultrasonic welding. The reaction material is configured to form a metallurgical joint between the faying surface and the second metal substrate adjacent the first metal substrate.

Abstract: A cord and a wire puller are used to pass through narrow pipes or the like. The cord includes a first guide wire section and a second guide wire section. The first guide wire section includes a plurality of first guide wires, and the first guide wire section has a first segment in which the first guide wires are intertwisted with each other. At least a part of the first guide wires extends from the first segment to a transitional segment. The second guide wire section includes a plurality of second guide wires, and the second guide wire section has a second segment in which the second guide wires are intertwisted with each other. At least a part of the second guide wires extends from the second segment to the transitional segment, in which the first and second guide wires are intertwisted with each other.

Abstract: An optical module includes an illuminating unit, an imaging unit and a projection lens. The illuminating unit includes a light source, a first collimating lens, a splitter, a microlens array and a first lens and is configured to generate a light beam. The imaging unit includes a first prism, a second prism and a display component and is configured to cover the light beam to image light containing image information. The projection lens includes a plurality of lenses and is configured to project the image light. A first axis sequentially passes through the light source, the first collimating lens, the splitter, the microlens array, the first lens, the first prism, the second prism and the lenses. The invention also provides a projection device including the optical module, a first holder and a second holder.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: A single chip for generating multiple differential signals and loop-through signals according to a single-ended RF signal inputted to the single chip, wherein delays between different channels of the multiple differential signals and loop-through signals can be minimized for supporting picture-in-picture applications; in addition, the single chip can integrate a power detector and an AGC circuit for controlling the gain of an LNA inside the single chip, and the gain of the LNA can be outputted from the single chip for different usages.

Abstract: Systems and methods for image classification include receiving imaging data of in-vivo or excised tissue of a patient during a surgical procedure. Local image features are extracted from the imaging data. A vocabulary histogram for the imaging data is computed based on the extracted local image features. A classification of the in-vivo or excised tissue of the patient in the imaging data is determined based on the vocabulary histogram using a trained classifier, which is trained based on a set of sample images with confirmed tissue types.

Abstract: A multi-channel power system and a method of controlling a phase shift of the same are provided. The multi-channel power system includes one or more first DC to DC converters and one or more second DC to DC converters. The first DC-DC converter outputs a first pulse width modulated signal having a first default frequency. When the first DC-DC converter receives a reference clock signal, it outputs the first pulse width modulated signal having a frequency that is the same as that of the reference clock signal. The first DC-DC converter outputs a phase-shifted clock signal having a preset phase shift relative to the first pulse width modulated signal. The second DC-DC converter outputs a second pulse width modulated signal having a second default frequency. The second DC-DC converter outputs the second pulse width modulated signal having the preset phase shift according to the phase shift clock signal.

Abstract: The invention provides an expression and secretion system, and methods of using the same, for the expression and secretion of one fusion protein in prokaryotic cells and a second fusion protein in eukaryotic cells. Also provided herein are nucleic acid molecules, vectors and host cells comprising such vectors and nucleic acid molecules.

Abstract: Disclosed is a current sensing circuit to sense a current flowing through a load switch. The load switch receives a supply voltage to generate an output voltage. The current sensing circuit includes a first circuit and a second circuit. The first circuit is coupled the load switch through a first resistor, and senses the current flowing through the load switch. The second circuit is coupled to the first circuit and the load switch, senses the output voltage, and generates an adjusting current according to the output voltage. The second circuit generates the adjusting current when the output voltage is smaller than a threshold voltage, such that the ratio of the current flowing through the load switch to a current flowing through the first circuit is maintained at certain ratio, but the second circuit is disabled when the output voltage is larger than or equal to the threshold voltage.

Abstract: A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.

Abstract: The present disclosure describes a fabrication method that prevents divots during the formation of isolation regions in integrated circuit fabrication. In some embodiments, the method of forming the isolation regions includes depositing a protective layer over a semiconductor layer; patterning the protective layer to expose areas of the semiconductor layer; depositing an oxide on the exposed areas the semiconductor layer and between portions of the patterned protective layer; etching a portion of the patterned protective layer to expose the semiconductor layer; etching the exposed semiconductor layer to form isolation openings in the semiconductor layer; and filling the isolation openings with a dielectric to form the isolation regions.