Abstract: A display substrate and a test method thereof are disclosed. The display substrate includes a test wire connected to a first gate driving circuit and a second gate driving circuit; a high vertical alignment process test pad disposed on at least one side of the test wire; a first array test pad electrically connected to the first gate driving circuit and connected to the test wire to form a first connection node; a second array test pad electrically connected to the second gate driving circuit and connected to the test wire to form a second connection node; and a switch unit formed between the first connection node and the second connection node for controlling the test wire to connect or disconnect.

Abstract: A graphene-containing composite material comprises components of a composite functional material with a double-conductive channel and a polymer matrix. The composite functional material with a double-conductive channel is sulfonated graphene surface grafted conductive polymer poly-3,4-(ethylenedioxythiophene). The composite functional material with a double-conductive channel and the graphene-containing composite material can be used for preparing a piezoresistance response material or an antistatic or electromagnetic shielding material and the like, and have excellent piezoresistance response, piezoresistance repeatability and electromagnetic shielding effect. The present invention is simple and easy to operate, can be used in large scale production, has excellent piezoresistance performance and very sensitive piezoresistance response, with the percolation threshold being only 0.

Abstract: A complex optical proximity sensor has a vertical-cavity surface emitting laser (VCSEL), an ambient lights detection chip, and a proximity sensor (PS) arranged in linear alignment to form a self-integrated barrier within the structure. The PS only receives lights with a first wavelength and a first energy and the ambient lights detection chip solely receives lights with a second wavelength and a second energy to prevent the VCSEL from interfering with the PS. Meanwhile, the arrangement has the ambient lights detection chip disposed in a middle section of an oblong opening to maximize a detection angle of ambient lights.

Abstract: A device that can prevent a decrease in an efficiency of a manufacturing line. The device includes a shape acquisition section for acquiring a shape of a workpiece; a motion pattern acquisition section for acquiring basic motion patterns including a reference workpiece shape, a reference working position in the reference workpiece shape, and a type of an operation carried out on the reference working position; a similarity determination section for determining whether a shape of the workpiece is similar to the reference work piece shape; a position determination section for, based on a shape of the workpiece and the reference workpiece shape, determining the working position on the workpiece that corresponds to the reference working position; and an motion-path generation section for, by changing the reference working position to the determined working position, generating a motion path.

Abstract: An image sensor chip package and an image sensor chip packaging method are provided. The image sensor chip package includes: an image sensor chip; a control chip configured to control the image sensor chip; a first substrate electrically connected to the image sensor chip; and a second substrate electrically connected to the control chip. The first substrate is stacked above the second substrate and is electrically connected to the second substrate.

Abstract: A solar cell assembly and a solar cell module are provided. The solar cell assembly includes a solar panel; and an installation member having a supporting portion configured for fixing the solar panel and a connecting portion configured for fixing the installation member onto a support beam. The supporting portion is disposed on a backside of the solar panel, the connecting portion extends out of an edge of the supporting portion along a direction parallel to the solar panel, the connecting portion locates outside of a coverage area of the solar panel, and the connecting portion defines a installation hole therein.

Abstract: The present invention provides a system and a method for rapid pyrolysis of coal.

Abstract: Systems, methods, and devices for providing a comfort dashboard are described herein. One method includes receiving operational data associated with an HVAC system of a facility, receiving credentials associated with a user of a user device including a number of display elements configurable by the user, and determining a particular portion of the operational data to provide to the user via the display elements of the user device based, at least in part, on the credentials.

Abstract: A protection device and a battery pack are provided, the protection device includes multiple terminal electrodes including a first terminal electrode and a second terminal electrode; a fusible conductor, where a lower surface of the fusible conductor is disposed on the first and second terminal electrodes, and the fusible conductor is supported by the first and second terminal electrodes, and two ends of the fusible conductor are electrically connected to the first and second terminal electrodes, respectively; and a first heat generating element, where one end of the first heat generating element is coupled to another surface of the fusible conductor different to the lower surface, or one end of the first heat generating element is coupled to a surface of any one of the first and second terminal electrodes.

Abstract: A method of improving micro-loading effect when recess etching a tungsten layer. A substrate having trenches thereon is provided. A tungsten layer is deposited on the substrate and in the trenches. A planarization process is performed to form a planarization layer on the tungsten layer. A first etching process is performed to etch the planarization layer and the tungsten layer with an etch selectivity of planarization layer:tungsten layer=1:1 until the planarization layer is completely removed. A second etching process is performed to etch the remainder of the tungsten layer to recess the tungsten layer within the trenches.

Abstract: A memory system includes a memory controller, a first memory device and a second memory device. The memory controller issues a first clock signal and a second clock signal. The memory controller transmits or receives a data signal. The first memory device receives the first clock signal and the second clock signal. The second memory device receives the first dock signal and the second clock signal. If a first mode register of the first memory device is in a first single-ended mode and a second mode register of the second memory device is in a second single-ended mode, the first memory device transmits or receives the data signal according to the first dock signal, and the second memory device transmits or receives the data signal according to the second clock signal.

Abstract: The present invention relates to the technology of material surface modification and the preparation adsorption new material, which involves the preparation of CQDs and the application of CQDs on modifying water purification function material. Firstly, the CQDs with rich functional groups and specific graphene structure has been prepared based on the low-cost biomass. Then, modified the traditional adsorbent by prepared CQDs under the in situ synthesis process. Secondly, synthesis the CQDs basic on the organic waste-water under low-temperature hydrothermal treatment process. Then, prepared the CQDs modified water purification material by collecting the CQDs under the flocculation process. This invention can be used in the widely used in the field of modification and preparation of functional materials, because of it not only gives a new method to synthesis low-cost and high performance water purification material, but also provide a new idea to treat high toxicity and refractory organic waste-water.

Abstract: In one implementation, a method of forming an amorphous silicon layer on a substrate in a processing chamber is provided. The method comprises depositing a predetermined thickness of a sacrificial dielectric layer over a substrate. The method further comprises forming patterned features on the substrate by removing portions of the sacrificial dielectric layer to expose an upper surface of the substrate. The method further comprises performing a plasma treatment to the patterned features. The method further comprises depositing an amorphous silicon layer on the patterned features and the exposed upper surface of the substrate. The method further comprises selectively removing the amorphous silicon layer from an upper surface of the patterned features and the upper surface of the substrate using an anisotropic etching process to provide the patterned features filled within sidewall spacers formed from the amorphous silicon layer.

Abstract: Embodiments include a load calculator, a workload analyzer, and a decision module. The load calculator generates an input/output (IO) record for an asset. The IO record includes a count of read operations and write operations corresponding to the asset from each of a plurality of sites. The workload analyzer collects the IO record and generates at least one of a write threshold and a read threshold. The decision module generates a request for at least one of a promotion and a copy of the asset in response to a determination that an operation has reached at least one of the write threshold and the read threshold for the asset.

Abstract: Embodiments of the present invention disclose a polar code processing method and communications device. The method includes: obtaining, based on a target coded bit quantity M and preset first mapping relationship information, a first sequence number set of M uncoded bits that is corresponding to the target coded bit quantity M, the first mapping relationship information is used to indicate a one-to-one correspondence between a plurality of coded bit quantities and a plurality of uncoded bit sequence number sets, the M uncoded bits include K information bits, and M target coded bits are obtained after polar encoding is performed on the M uncoded bits; and selecting, from the first sequence number set of the M uncoded bits according to a preset first selection rule, K sequence numbers as a sequence number set of the K information bits.

Abstract: This invention relates to a fireproofing article and the method of manufacturing the same. The fireproofing article comprises an external portion and an inner portion. The external portion defines external surfaces of the fireproofing article that are exposed to the environment. The inner portion is formed inside of the external portion. The external portion and the inner portion are both porous and made of a fireproofing material. The external portion has a first material density and the inner portion has a second material density. The first material density is less than the second material density. The method of manufacturing a fireproofing article comprises forming the fireproofing article with a fireproofing material through 3D printing; wherein the fireproofing article formed is porous.

Abstract: Runtime non-intrusive container security introspection and remediation is disclosed. For example, a persistent storage associated with a container has a write protected lower system layer and an upper system layer, and a first snapshot of the upper system layer is created. A first request to modify data in the persistent storage is detected. A first requested modification is forwarded to a security inspection service. A threat state of the container based is determined on the first requested modification, where the threat state is one of a threatening state and a non-threatening state. In response to determining that the container is in the non-threatening state, the container is notified that the first requested modification is non-threatening and a second snapshot of the upper system layer is created. In response to determining that the container is in the threatening state, a container engine is instructed to respond to the threatening state.

Abstract: A chip-scale image sensor package includes a semiconductor substrate, a transparent substrate, a thin film, and a plurality of conductive pads. The semiconductor substrate has (i) a pixel array, and (ii) a peripheral region surrounding the pixel array. The transparent substrate covers the pixel array, has a bottom substrate surface proximate the pixel array, and a top substrate surface opposite the bottom substrate surface. The thin film is on a region of the top substrate surface directly above both (i) the entire pixel array and (ii) a portion of the peripheral region adjacent to the pixel array. Each of the plurality of conductive pads is located within the peripheral region, and is electrically connected to the pixel array. A portion of each of the plurality of conductive pads is not directly beneath the thin film.

Abstract: A charging system for a terminal, a charge method, and a terminal are provided. The charging system includes a power adapter and the terminal. The terminal includes a battery, a fast charging circuit, a voltameter and a comparator circuit. The fast charging circuit applies the voltage with a pulsating waveform to the battery and acquires a battery voltage threshold value. The voltameter adjusts a reference voltage based on the battery voltage threshold value. The comparator circuit outputs a reverse signal to the fast charging circuit when a battery voltage reaches the reference voltage. The fast charging module adjusts a charging state through the power adapter.

Abstract: A cleaning structure for endoscope lens includes a sleeve main body having a fitting hole, at least one first axial fluid passage and a first opening. The fitting hole communicates with two ends of the sleeve main body. The first axial fluid passage is axially formed in a wall of the sleeve main body. The first opening is formed at one end of the sleeve main body in communication with the first axial fluid passage. The sleeve main body is fitted around the lens of the endoscope. A fluid is supplied to the fluid passage structure of the sleeve main body and ejected from the opening to clean up the surface of the lens of the endoscope so as to keep the surface of the lens clean.