Abstract: A method of using a lithographic system to perform lithography is provided. The lithographic system includes an illuminator and a projection apparatus. The illuminator is configured to output a light beam from a light source unit to a reticle through a beam shaping unit, a diffuser unit, a light pipe unit and an exposure control unit to generate a patterned light beam. The projection apparatus is configured to project the patterned light beam onto a wafer coated with a photoresist layer. The aperture of the diffuser unit is changed based on a dataset that is related a lithographic process and that includes a thickness of the photoresist layer and a numerical aperture value of a numerical aperture component of the projection apparatus. Then, the lithographic system performs the lithographic process on the wafer with the diffuser unit having the aperture thus changed.

Abstract: An assembled structure includes an integrated circuit chipset and a heat-dissipating module. The heat-dissipating module includes a heat sink, a locking member and at least one elastic element. The heat sink includes a base and a plurality of fins. The locking member includes a rectangular frame with at least one sustaining part. Two first lateral plates are downwardly extended from a first side and a second side of the rectangular frame, respectively. The first side and the second side are opposed to each other. In addition, at least one hook is formed on an inner surface and a lower edge of each first lateral plate. The elastic element has a first part sustained against the base of the heat sink and a second part sustained against the sustaining part of the rectangular frame. The hooks are engaged with a bottom surface of the substrate of the integrated circuit chipset.

Abstract: An assembled structure includes an integrated circuit chipset and a heat-dissipating module. The heat-dissipating module includes a heat sink, a locking member and at least one elastic element. The heat sink includes a base and a plurality of fins. The locking member includes a rectangular frame with at least one sustaining part. Two first lateral plates are downwardly extended from a first side and a second side of the rectangular frame, respectively. The first side and the second side are opposed to each other. In addition, at least one hook is formed on an inner surface and a lower edge of each first lateral plate. The elastic element has a first part sustained against the base of the heat sink and a second part sustained against the sustaining part of the rectangular frame. The hooks are engaged with a bottom surface of the substrate of the integrated circuit chipset.