Patents by Inventor Chenfu Chen

Chenfu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sealant composition
    Patent number: 10108029
    Abstract: A sealant composition particularly suitable for a plastic substrate is disclosed. The sealant composition contains: a partially (meth)acrylated epoxy resin, a hydrophobic oligomer having a flexible hydrophobic backbone moiety and at least one functional group co-curable with the partially (meth)acrylated epoxy resin, and a latent epoxy-curing agent.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: October 23, 2018
    Assignee: HENKEL AG & CO. KGAA
    Inventor: Chenfu Chen