Patents by Inventor Cheng-An Chen

Cheng-An Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210377481
    Abstract: A photodetector circuit includes a photodetector and a sensing circuit located over a substrate semiconductor layer having a doping of a first conductivity type. The photodetector includes a second-conductivity-type pinned photodiode layer that forms a p-n junction with the substrate semiconductor layer, at least one floating diffusion region that is laterally spaced from a periphery of the second-conductivity-type pinned photodiode layer, and at least one transfer gate electrode. At least two different operations may be performed by applying at least two different pulse patterns to the at least one transfer gate electrode. The at least two different pulse patterns differ from one another or from each other by at least one of pulse duration, pulse magnitude, and delay time between a control signal applied to the sensing circuit and pulse initiation at a respective one of the at least one transfer gate electrode.
    Type: Application
    Filed: May 28, 2020
    Publication date: December 2, 2021
    Inventors: Feng-Chien HSIEH, Wei-Li HU, Kuo-Cheng LEE, Hsin-Chi CHEN, Yun-Wei CHENG
  • Publication number: 20210375878
    Abstract: A semiconductor memory device is provided in the present invention, including a substrate, word lines in the substrate, bit lines over the word lines, partition structures between the bit lines and right above the word lines, storage node contacts in spaces defined by the bit lines and the partition structures and electrically connecting with the substrate, wherein a portion of the storage node contact protruding from top surfaces of the bit lines and the partition structures is contact pad, and contact pad isolation structures on the partition structures and between the contact pads, wherein the contact pad isolation structure includes outer silicon nitride layers and inner silicon oxide layers.
    Type: Application
    Filed: May 12, 2021
    Publication date: December 2, 2021
    Inventors: Janbo Zhang, Chao-Wei Lin, Chia-Yi Chu, Yu-Cheng Tung, Ken-Li Chen, Tsung-Wen Chen
  • Publication number: 20210376095
    Abstract: A device includes an active region, a gate structure, an epitaxial structure, an epitaxial layer, a metal alloy layer, a contact, and a contact etch stop layer. The gate structure is across the active region. The epitaxial structure is above the active region and adjacent the gate structure. The epitaxial layer is above the epitaxial structure. The metal alloy layer is above the epitaxial layer. The contact is above the metal alloy layer. The contact etch stop layer lines sidewalls of the epitaxial structure. The metal alloy layer is spaced apart from the contact etch stop layer.
    Type: Application
    Filed: May 28, 2020
    Publication date: December 2, 2021
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Cheng CHEN, Chun-Hsiung LIN, Chih-Hao WANG
  • Publication number: 20210376411
    Abstract: A temperature regulation system for a battery is provided. The temperature regulation system includes an electrochemical cell, which may be in the form of a battery. The electrochemical cell includes a housing having a first side surface that extends from a first end to a second end, and a first temperature control chamber containing a dielectric fluid. The first temperature control chamber is located along the first side surface of the housing or along at least one of the first end or the second end of the housing. The dielectric fluid is in direct contact with the housing at the first side surface or at the first end or the second end.
    Type: Application
    Filed: May 29, 2020
    Publication date: December 2, 2021
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Chih-hung YEN, David R. CLARK, Matthew SWIFT, Taeyoung HAN, Kuo-huey CHEN, Bahram KHALIGHI, Goro TAMAI, Chih-cheng HSU
  • Publication number: 20210376121
    Abstract: A method of fabricating a metal gate transistor includes providing a substrate. An interlayer dielectric layer covers the substrate. A dummy gate is embedded in the interlayer dielectric layer. A high-k dielectric layer is disposed between the dummy gate and the substrate. Later, the dummy gate is removed to form a trench, and the high-k dielectric layer is exposed through the trench. After the dummy gate is removed, an ion implantation process is performed to implant fluoride ions into the high-k dielectric layer. Finally, after the ion implantation process, a metal gate is formed to fill in the trench.
    Type: Application
    Filed: August 15, 2021
    Publication date: December 2, 2021
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Zhi-Cheng Lee, Wei-Jen Chen, Kai-Lin Lee
  • Publication number: 20210376077
    Abstract: Various examples of an integrated circuit device and a method for forming the device are disclosed herein. In an example, a method includes receiving a workpiece that includes a substrate, and a device fin extending above the substrate. The device fin includes a channel region. A portion of the device fin adjacent the channel region is etched, and the etching creates a source/drain recess and forms a dielectric barrier within the source/drain recess. The workpiece is cleaned such that a bottommost portion of the dielectric barrier remains within a bottommost portion of the source/drain recess. A source/drain feature is formed within the source/drain recess such that the bottommost portion of the dielectric barrier is disposed between the source/drain feature and a remainder of the device fin.
    Type: Application
    Filed: August 9, 2021
    Publication date: December 2, 2021
    Inventors: Feng-Ching Chu, Wei-Yang Lee, Yen-Ming Chen, Feng-Cheng Yang
  • Publication number: 20210370413
    Abstract: Disclosed is an assembling and centering structure for a processing tool, the structure having a clamping handle (10), a processing head (20), and a fastening member (30) for connecting and fixing the clamping handle (10) and the processing head (20). An end face accommodation groove (100) of the clamping handle (10) is formed with a concave part (11) and a centering hole (12). The processing head (20) is formed with a convex part (211) and a centering post (222), the convex part (211) matches the concave part (11), and the centering post (222) matches the centering hole (12). Thus, it can be ensured that after assembly, the central axis of rotation of the clamping handle (10) is in a straight line with the central axis of rotation of the processing head (20).
    Type: Application
    Filed: March 4, 2019
    Publication date: December 2, 2021
    Inventor: Li-Cheng Chen
  • Publication number: 20210375776
    Abstract: The present disclosure provides a structure and a method to reduce electro-migration. An interconnect structure according to the present disclosure includes a conductive feature embedded in a dielectric layer, a capping barrier layer disposed over the conductive feature and the dielectric layer, and an adhesion layer sandwiched between the capping barrier layer and the dielectric layer. The adhesion layer includes a degree of crystallinity between about 40% and about 70%.
    Type: Application
    Filed: September 10, 2020
    Publication date: December 2, 2021
    Inventors: Yi-Chen Ho, Chien Lin, Cheng-Yeh Yu, Hsin-Hsing Chen, Ju Ru Hsieh
  • Publication number: 20210376086
    Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having a first semiconductor material. A second semiconductor material is disposed on the first semiconductor material. The second semiconductor material is a group IV semiconductor or a group III-V compound semiconductor. A passivation layer is disposed on the second semiconductor material. The passivation layer includes the first semiconductor material. A first doped region and a second doped region extend through the passivation layer and into the second semiconductor material.
    Type: Application
    Filed: September 29, 2020
    Publication date: December 2, 2021
    Inventors: Yin-Kai Liao, Sin-Yi Jiang, Hsiang-Lin Chen, Yi-Shin Chu, Po-Chun Liu, Kuan-Chieh Huang, Jyh-Ming Hung, Jen-Cheng Liu
  • Publication number: 20210371972
    Abstract: Methods and apparatus for processing a substrate include cleaning and self-assembly monolayer (SAM) formation for subsequent reverse selective atomic layer deposition. An apparatus may include a process chamber with a processing volume and a substrate support including a pedestal, a remote plasma source fluidly coupled to the process chamber and configured to produce radicals or ionized gas mixture with radicals that flow into the processing volume to remove residue or oxides from a surface of the substrate, a first gas delivery system with a first ampoule configured to provide at least one first chemical into the processing volume to produce a SAM on the surface of the substrate, a heating system located in the pedestal and configured to heat a substrate by flowing gas on a backside of the substrate, and a vacuum system fluidly coupled to the process chamber and configured to control heating of the substrate.
    Type: Application
    Filed: June 1, 2020
    Publication date: December 2, 2021
    Inventors: Xiangjin XIE, Carmen LEAL CERVANTES, Feng CHEN, Lu CHEN, Wenjing XU, Aravind KAMATH, Cheng-Hsiung Matthew TSAI, Tae Hong HA, Alexander JANSEN, Xianmin TANG
  • Publication number: 20210376091
    Abstract: A semiconductor device including: a first S/D arrangement including a silicide-sandwiched portion of a corresponding active region having a silicide-sandwiched configuration, a first portion of a corresponding metal-to-drain/source (MD) contact structure, a first via-to-MD (VD) structure, and a first buried via-to-source/drain (BVD) structure; a gate structure over a channel portion of the corresponding active region; and a second S/D arrangement including a first doped portion of the corresponding active region; and at least one of the following: an upper contact arrangement including a first silicide layer over the first doped portion, a second portion of the corresponding MD contact structure; and a second VD structure; or a lower contact arrangement including a second silicide layer under the first doped portion, and a second BVD structure.
    Type: Application
    Filed: February 12, 2021
    Publication date: December 2, 2021
    Inventors: Chung-Hui CHEN, Tung-Tsun CHEN, Jui-Cheng HUANG
  • Publication number: 20210375864
    Abstract: A semiconductor device according to the present disclosure includes a bottom dielectric feature on a substrate, a plurality of channel members directly over the bottom dielectric feature, a gate structure wrapping around each of the plurality of channel members, two first epitaxial features sandwiching the bottom dielectric feature along a first direction, and two second epitaxial features sandwiching the plurality of channel members along the first direction.
    Type: Application
    Filed: May 29, 2020
    Publication date: December 2, 2021
    Inventors: Jung-Hung Chang, Lo-Heng Chang, Zhi-Chang Lin, Shih-Cheng Chen, Kuo-Cheng Chiang, Chih-Hao Wang
  • Publication number: 20210373606
    Abstract: A display apparatus includes a first display and a second display. The first display includes a first display body having a first side, a positioning recess located at the first side, and an engagement recess located in the positioning recess. The second display is detachably mounted at one side of the first display body, includes a second display body, a positioning protrusion, and a pendulum hook, and has a second side. The positioning protrusion is connected to the second side and has a cavity configured to accommodate the pendulum hook pivotally connected to the positioning protrusion and including an engagement protrusion. The positioning protrusion is inserted into the positioning recess. The second side contacts the first side. The engagement protrusion is configured to move out of the cavity and be engaged with the engagement recess or move away from the engagement recess and move back to the cavity.
    Type: Application
    Filed: November 3, 2020
    Publication date: December 2, 2021
    Applicant: Acer Incorporated
    Inventors: Yi-Hsuan Yang, Wu-Chen Lee, Cheng-Nan Ling, Chia-Bo Chen
  • Publication number: 20210373168
    Abstract: A photo-detecting apparatus is provided. The photo-detecting apparatus includes: a substrate made by a first material or a first material-composite; an absorption layer made by a second material or a second material-composite, the absorption layer being supported by the substrate and the absorption layer including: a first surface; a second surface arranged between the first surface and the substrate; and a channel region having a dopant profile with a peak dopant concentration equal to or more than 1×1015 cm?3, wherein a distance between the first surface and a location of the channel region having the peak dopant concentration is less than a distance between the second surface and the location of the channel region having the peak dopant concentration, and wherein the distance between the first surface and the location of the channel region having the peak dopant concentration is not less than 30 nm.
    Type: Application
    Filed: August 17, 2021
    Publication date: December 2, 2021
    Inventors: Szu-Lin Cheng, Chien-Yu Chen, Shu-Lu Chen, Yun-Chung Na, Ming-Jay Yang, Han-Din Liu, Che-Fu Liang, Jung-Chin Chiang, Yen-Cheng Lu, Yen-Ju Lin
  • Publication number: 20210371812
    Abstract: The present invention relates to a cell differentiation medium composition, a high secretion insulin-producing cells and a preparation method thereof. The high secretion insulin-producing cells obtained by using the cell differentiation medium composition to induce stem cell differentiated under specific conditions can secrete a large amount of insulin in a short time, and when the high-secreting insulin-producing cells are transplanted into the human body, they are not easy to be swallowed by macrophages, which can improve the survival rate of the insulin-producing cells and prolong the time of insulin secretion thereby.
    Type: Application
    Filed: April 20, 2021
    Publication date: December 2, 2021
    Inventors: Ruei-Yue Liang, Kai-Ling Zhang, Ming-Hsi Chuang, Po-Cheng Lin, Chun-Hung Chen, Pei-Syuan Chao
  • Publication number: 20210373430
    Abstract: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, and an absorber layer disposed on the capping layer. The absorber layer includes a base material made of one or more of a Cr based material, an Ir based material, a Pt based material, or Co based material, and further contains one or more additional elements selected from the group consisting of Si, B, Ge, Al, As, Sb, Te, Se and Bi.
    Type: Application
    Filed: November 24, 2020
    Publication date: December 2, 2021
    Inventors: Hung-Yi TSAI, Wei-Che HSIEH, Ta-Cheng LIEN, Hsin-Chang LEE, Ping-Hsun LIN, Hao-Ping CHENG, Ming-Wei CHEN, Szu-Ping TSAI
  • Publication number: 20210375819
    Abstract: In a method, a wafer is bonded to a first carrier. The wafer includes a semiconductor substrate, and a first plurality of through-vias extending into the semiconductor substrate. The method further includes bonding a plurality of chips over the wafer, with gaps located between the plurality of chips, performing a gap-filling process to form gap-filling regions in the gaps, bonding a second carrier onto the plurality of chips and the gap-filling regions, de-bonding the first carrier from the wafer, and forming electrical connectors electrically connecting to conductive features in the wafer. The electrical connectors are electrically connected to the plurality of chips through the first plurality of through-vias.
    Type: Application
    Filed: October 19, 2020
    Publication date: December 2, 2021
    Inventors: Ming-Fa Chen, Cheng-Feng Chen, Sung-Feng Yeh, Chuan-An Cheng
  • Publication number: 20210373593
    Abstract: An ear physiological wearable device, including a main body and a supporting body, is provided. The main body includes an acoustic driving portion, a temperature sensing portion and an optical scanning portion. The acoustic driving portion is adjacent to the temperature sensing portion, and the optical scanning portion is disposed below the acoustic driving portion and the temperature sensing portion. The supporting body is connected to the main body. The acoustic driving portion includes an acoustic outlet, and the temperature sensing portion includes a nozzle. Two ear physiological wearable devices, one of them including an acoustic driving portion with an acoustic end against the user's skull, another including a main body including a temperature sensing portion and an optical scanning portion, are provided. In this way, the audio signal can be transmitted and/or the users' physiological status can be sensed.
    Type: Application
    Filed: May 25, 2021
    Publication date: December 2, 2021
    Inventors: Tong-Jing FANG, Lih-Jen KAU, Juin-Hong CHERNG, Hsiang-Cheng CHEN, Kae-Shin LIN, Gang-Yi FAN, Shu-Jen CHANG
  • Publication number: 20210375821
    Abstract: A method for forming a chip package structure is provided. The method includes forming a first conductive bump and a first ring-like structure over a chip. The first ring-like structure surrounds the first conductive bump, the first ring-like structure and the first conductive bump are made of a same first material, the chip includes an interconnect structure, and the first ring-like structure is electrically insulated from the interconnect structure and the first conductive bump. The method includes bonding the chip to a substrate through the first conductive bump.
    Type: Application
    Filed: August 5, 2021
    Publication date: December 2, 2021
    Inventors: Sheng-Yao YANG, Ling-Wei LI, Yu-Jui WU, Cheng-Lin HUANG, Chien-Chen LI, Lieh-Chuan CHEN, Che-Jung CHU, Kuo-Chio LIU
  • Publication number: 20210374908
    Abstract: A method for processing an image that can be played on a virtual device, including obtaining a super-resolution deep learning network model, which is trained to learn to reconstruct an image from low resolution to high resolution; wherein the super-resolution deep learning network model includes a plurality of feature filters to extract features of the image; modifying the resolution of the feature filters from a preset value to an established value, wherein the established value is higher than the preset value; inputting a low-resolution image into the super-resolution deep learning network model; and increasing the resolution of the low-resolution image to become a high-resolution image through the super-resolution deep learning network model.
    Type: Application
    Filed: March 9, 2021
    Publication date: December 2, 2021
    Inventors: Shih-Hao LIN, Chao-Kuang YANG, Wen-Cheng HSU, Liang-Chi CHEN