Abstract: A method for automatically activating a video conference meeting device, wherein the video conference meeting device includes a power supply, a main processor and a plurality of peripheral components, and a radar detector connects to the video conference meeting device, the method comprises (a) the radar detector detecting with a radar detection coverage when the video conference device is in a standby state; (b) when the radar detector detects an object appearing in the radar detection coverage, obtain a position of the object detected in the radar detection coverage; (c) the radar detector obtaining boundary information of an effective zone and determining whether the position of the detected object is within the effective zone; (d) when the radar detector determines that the position of the detected object is within the effective zone, activating the video conference meeting device which loads an operation program.

Abstract: The present disclosure provides a method for preparing a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors, the composition prepared by the method, and use of the composition for treating arthritis. The composition of the present disclosure achieves the effect of treating arthritis through various efficacy experiments.

Abstract: A method includes forming first and second semiconductor fins and a gate structure over a substrate; forming a first and second source/drain epitaxy structures over the first and second semiconductor fins; forming an interlayer dielectric (ILD) layer over the first and second source/drain epitaxy structures; etching the gate structure and the ILD layer to form a trench; performing a first surface treatment to modify surfaces of a top portion and a bottom portion of the trench to NH-terminated; performing a second surface treatment to modify the surfaces of the top portion of the trench to N-terminated, while leaving the surfaces of the bottom portion of the trench being NH-terminated; and depositing a first dielectric layer in the trench, wherein the first dielectric layer has a higher deposition rate on the surfaces of the bottom portion of the trench than on the surfaces of the bottom portion of the trench.

Abstract: An optical fiber connector includes a connecting unit, an adapter unit, and an attenuation unit. The adapter unit includes an insertion seat connected removably to a main housing of the connecting unit, and two guide frame bodies located respectively at two opposite sides of the insertion seat in a transverse direction. The insertion seat has two insertion holes spaced apart in the transverse direction and extending in a front-rear direction. Each guide frame body extends in the front-rear direction away from the connecting unit. The attenuation unit includes two attenuation components, two rear ferrules, and two front ferrules. The attenuation components are arranged in the transverse direction and disposed within the main housing. The rear ferrules respectively extend rearwardly from rear ends of the attenuation components into the insertion holes. The front ferrules respectively extend forwardly from front ends of the attenuation components through and outwardly of the main housing.

Abstract: A switch switching method and a related apparatus. The method includes: receiving, by an MIPI switch, an MIPI instruction, and parsing the MIPI instruction preliminarily, to obtain an address and a control instruction in the MIPI instruction; determining, by the MIPI switch, whether the address in the MIPI instruction is the same as an address of the MIPI switch; if the addresses are the same, writing the control instruction into a data register of the MIPI switch; transmitting, by the MIPI switch, the control instruction in the data register of the MIPI switch to a mode identification module; determining, by the mode identification module, which control instruction bits control the MIPI switch, and sending these control instruction bits to a translator in the MIPI switch; and translating, by the translator in the MIPI switch, the control instruction into a component status.

Abstract: A recycling apparatus for a solar cell module includes a platform for supporting and positioning the solar cell module, and at least one milling device disposed on the platform and having a milling member configured to contact a back plate of the solar cell module, and a casing defining a chip-receiving space and having an air inlet and a suction port communicating with the chip-receiving space. A drive device is connected to the at least one milling device for driving the at least one milling device to move around and mill the solar cell module through the milling member.

Abstract: A method for responding to a command is adapted for a storage device. The method for responding to a command includes following steps of: sequentially receiving a first command and a second command by a bridge of the storage device from a host; executing the first command and the second command to generate a status completion signal or a status error signal by the bridge; and detecting an error state of at least one of the first command and the second command to execute a response mode or an idle mode by the bridge according to the error state so as to respond to the host.

Abstract: A cutting tool with through coolant has an elongated shank and a cutting portion. The cutting portion is configured to remove material from a workpiece by cutting. An outer peripheral surface of the shank is configured to be surrounded and tightly held by a hole-wall defined by a tool-fixing hole of a machine tool. At least one coolant-guiding recess is formed in the outer peripheral surface of the shank and extends along a lengthwise direction of the shank. Each coolant-guiding recess forms a coolant channel together with the hole-wall of the tool-fixing hole. An end of the coolant channel is connected to a coolant-supply system. The coolant channel formed by the coolant-guiding recess enables coolant from the coolant-supply system to be jetted toward the cutting portion. The cutting tool provides through coolant without drilled holes, thereby saving cost.

Abstract: A computer-implemented method is provided for model training performed by a processing system. The method comprises determining a set of first weights based on a first matrix associated with a source model, determining a set of second weights based on the set of first weights, forming a second matrix associated with a target model based on the set of first weights and the set of second weights, initializing the target model based on the second matrix, and training the target model.

Abstract: Some implementations described herein provide techniques and apparatuses for a stacked semiconductor die package. The stacked semiconductor die package may include an upper semiconductor die package above a lower semiconductor die package. The stacked semiconductor die package includes one or more rows of pad structures located within a footprint of a semiconductor die of the lower semiconductor die package. The one or more rows of pad structures may be used to mount the upper semiconductor die package above the lower semiconductor die package. Relative to another stacked semiconductor die package including a row of dummy connection structures adjacent to the semiconductor die that may be used to mount the upper semiconductor die package, a size of the stacked semiconductor die package may be reduced.

Abstract: A fan braking structure includes a fan including a frame having an upright bearing cup, and a fan impeller having a vertical rotating shaft pivotally received in the bearing cup and provided at a free end with a groove; a braking structure located at a lower part of the bearing cup and including a brake plate and an electromagnet, and the brake plate being provided at one side with a protruded brake pin and at another side with a magnetic member; and an elastic element disposed between and pressed against a top of the shell and the brake plate. When the fan is inactive, the electromagnet is energized to produce magnetic poles that repel the magnetic member and compress the elastic element, such that the brake pin is magnetically pushed toward the rotating shaft to engage with the groove, causing the fan to brake and stop rotating inertially.

Abstract: Disclosed herein, inter alia, are compounds, compositions, and methods of use thereof in the sequencing of a nucleic acid.

Abstract: A system for a sandy soil landfill solid waste polluted river channel, includes a ground water interception and diversion system and a river channel ecological remediation system. The ground water interception and diversion system includes a water intake well arranged upstream of ground water in a landfill area, a buffer pool communicated with the water intake well, and a wastewater treatment system communicated with the buffer pool. The water intake well, the buffer pool, and the wastewater treatment system are communicated through a wastewater pipe. An electric wastewater valve and a variable frequency water pump are arranged on the wastewater pipe in sequence. The river channel ecological remediation system includes an impermeable layer arranged at a bottom of a river channel and ecological bank protections arranged on both sides of a river channel slope.

Abstract: A device includes a first power rail for a first power domain and a second power rail for a second power domain. A first circuit block is connected to the first power rail and a second circuit block is connected to the second power rail. The first and second circuit blocks are both connected to a virtual VSS terminal. A footer circuit is connected between the virtual VSS terminal and a ground terminal, and the footer circuit is configured to selectively control a connection between the virtual VSS terminal and the ground terminal.

Abstract: Provided are a circuit apparatus, a manufacturing method thereof, and a circuit system. The circuit apparatus includes a flexible circuit board, a flexible packaging material layer and an electronic device. The flexible circuit board has at least one hollow pattern, wherein the flexible circuit board has an inner region and a peripheral region surrounding the inner region, and has a first surface and a second surface opposite to each other. The flexible packaging material layer is disposed in the at least one hollow pattern. The electronic device is disposed on the first surface of the flexible circuit board and electrically connected with the flexible circuit board.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A conductive region is disposed in the polymer region and electrically coupled to the redistribution line. The conductive region includes a second flat top surface not higher than the first flat top surface.

Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.

Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.

Abstract: An electronic device including a hinge module, a first body, a second body, and a flexible display assembled to the first body and the second body is provided. Each of the first body and the second body is pivoted and slidably connected to the hinge module, and a cover of the hinge module is exposed out of the first body and the second body. The first body and the second body are rotated relatively via the hinge module to bend or flatten the flexible display, when the flexible display is bending from a flat state, a bending portion of the flexible display leans against the cover and pushes the cover away from the first body and the second body.