Patents by Inventor Cheng-Bo WU

Cheng-Bo WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11267044
    Abstract: A method for manufacturing a mold includes providing first information regarding a location of a shrinkage hole generated during hardening of a molten metal in a shell mold. Second information regarding a change in the location of the shrinkage hole in response to adjustment of a heat transfer rate of the shell mold is obtained. The heat transfer rate of the shell mold is adjusted to shift the shrinkage hole to a predetermined location.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: March 8, 2022
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Shin-Hong Kuo, Cheng-Bo Wu
  • Publication number: 20210187593
    Abstract: A method for manufacturing a mold includes providing first information regarding a location of a shrinkage hole generated during hardening of a molten metal in a shell mold. Second information regarding a change in the location of the shrinkage hole in response to adjustment of a heat transfer rate of the shell mold is obtained. The heat transfer rate of the shell mold is adjusted to shift the shrinkage hole to a predetermined location.
    Type: Application
    Filed: December 23, 2019
    Publication date: June 24, 2021
    Inventors: Shin-Hong Kuo, Cheng-Bo Wu
  • Publication number: 20170313047
    Abstract: A 3D jet printing apparatus having a reciprocating jetting molding mechanism includes: a molding platform mechanism, a jet printing mechanism, and a vertical lifting mechanism; where the molding platform mechanism has a molding area plane; the jet printing mechanism is provided above the molding platform, and can correspondingly perform reciprocating movement of forward and reverse strokes; the jet printing mechanism includes a powder spreading unit, powder supply units, and jet printing units; the powder supply units can drop a powder material to the molding area plane; the powder spreading unit then spreads flat the powder material on the molding area plane, and subsequently the jet printing units perform binder jet printing on the powder material that is spread flat; and after the jet printing mechanism performs a stroke once, the vertical lifting mechanism adds a vertical stacking distance between the jet printing mechanism and the molding platform mechanism.
    Type: Application
    Filed: September 30, 2016
    Publication date: November 2, 2017
    Inventors: Shin-Hong KUO, Cheng-Bo WU, Ching-Tsai WU