Patents by Inventor Cheng C. Yang

Cheng C. Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084487
    Abstract: A knitted component comprising two yarns, forming at least a heel region of an upper for an article of footwear, where one of the yarns comprises a thermoplastic material. The outer surface may include a fused area comprising a first thermoplastic yarn. The inner surface may be at least partially formed with a second yarn and may substantially exclude the thermoplastic material. There may be a transitional area including a reduced amount of thermoplastic material relative to a fused area. The knitted component may include a cushioning material between layers of the knit element.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: Jessica Green, Chun-Ying Hsu, Jaroslav J. Lupinek, Darryl Matthews, William C. McFarland, II, Chun-Yao Tu, Yi-Ning Yang, Cheng-Ying Han
  • Patent number: 5376901
    Abstract: A hermetically sealable millimeter waveguide launch transition feedthrough for channelling high frequency electrical signals in a circuit which includes at least one waveguide. An aperture is formed in one wall of the waveguide and a conductive pin passes through the aperture. The pin is sealed therein by a dielectric material which surrounds the pin so as to isolate it from the waveguide wall. A probe head is disposed at one end of the conductive pin and within the waveguide. The opposite end of the pin contains a second probe head or other circuit connector. The transition may be effectively implemented in waveguide-to-waveguide or waveguide-to-device applications as well as in colinear device housing applications.
    Type: Grant
    Filed: May 28, 1993
    Date of Patent: December 27, 1994
    Assignee: TRW Inc.
    Inventors: Steven S. Chan, Victor J. Watson, Cheng C. Yang, Stuart Kam