Patents by Inventor Cheng Cen

Cheng Cen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220213100
    Abstract: Disclosed are a nitrogen-containing heterocyclic derivative regulator, a preparation method therefor and an application thereof. In particular, disclosed are a compound as represented by general formula (I), a preparation method for the compound and a pharmaceutical composition containing the compound, and the use thereof as a KRAS G12C mutation inhibitor in treatment of diseases or symptoms such as leukemia, neuroblastoma, melanoma, breast cancer, lung cancer and colon cancer, wherein the definitions of substituents in general formula (I) are the same as those in the description.
    Type: Application
    Filed: May 29, 2020
    Publication date: July 7, 2022
    Inventors: Shiqiang LIU, Yongsheng WANG, Yida YUAN, Cheng CEN, Rudi BAO
  • Patent number: 8748950
    Abstract: A reconfigurable device includes a first insulating layer, a second insulating layer, and a nanoscale quasi one- or zero-dimensional electron gas region disposed at an interface between the first and second insulating layers. The device is reconfigurable by applying an external electrical field to the electron gas, thereby changing the conductivity of the electron gas region. A method for forming and erasing nanoscale-conducting structures employs tools, such as the tip of a conducting atomic force microscope (AFM), to form local electric fields. The method allows both isolated and continuous conducting features to be formed with a length well below 5 nm.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: June 10, 2014
    Assignee: University of Pittsburgh—Of the Commonwealth System of Higher Education
    Inventors: Jeremy Levy, Cheng Cen, Patrick Irvin
  • Publication number: 20140073114
    Abstract: Embodiments of the invention relate generally to semiconductor wafer technology and, more particularly, to the use of conformal grounding for active charge screening on wafers during wafer processing and metrology. A first aspect of the invention provides a method of reducing an accumulated surface charge on a semiconductor wafer, the method comprising: grounding a layer of conductive material adjacent a substrate of the wafer; and allowing a mirrored charge substantially equal in magnitude and opposite in sign to the accumulated surface charge to be induced along the conductive material.
    Type: Application
    Filed: November 12, 2013
    Publication date: March 13, 2014
    Applicants: GlobalFoundries Inc., International Business Machines Corporation
    Inventors: Cheng Cen, Steven B. Herschbein, Narender Rana, Nedal R. Saleh, Alok Vaid
  • Publication number: 20130200501
    Abstract: Embodiments of the invention relate generally to semiconductor wafer technology and, more particularly, to the use of conformal grounding for active charge screening on wafers during wafer processing and metrology. A first aspect of the invention provides a method of reducing an accumulated surface charge on a semiconductor wafer, the method comprising: grounding a layer of conductive material adjacent a substrate of the wafer; and allowing a mirrored charge substantially equal in magnitude and opposite in sign to the accumulated surface charge to be induced along the conductive material.
    Type: Application
    Filed: February 8, 2012
    Publication date: August 8, 2013
    Applicants: GLOBALFOUNDRIES INC., INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Cheng Cen, Steven B. Herschbein, Narender Rana, Nedal R. Saleh, Alok Vaid
  • Publication number: 20130048950
    Abstract: A reconfigurable device includes a first insulating layer, a second insulating layer, and a nanoscale quasi one- or zero-dimensional electron gas region disposed at an interface between the first and second insulating layers. The device is reconfigurable by applying an external electrical field to the electron gas, thereby changing the conductivity of the electron gas region. A method for forming and erasing nanoscale-conducting structures employs tools, such as the tip of a conducting atomic force microscope (AFM), to form local electric fields. The method allows both isolated and continuous conducting features to be formed with a length well below 5 nm.
    Type: Application
    Filed: November 17, 2010
    Publication date: February 28, 2013
    Applicant: University of Pittsburgh-Of the Commonwealth System of Higher Education
    Inventors: Jeremy Levy, Cheng Cen, Patrick Irvin