Patents by Inventor Cheng Cen

Cheng Cen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240336538
    Abstract: Disclosed herein is a biochar controlled release fertilizer composition. Various embodiments include biochar and one or more nutrients encapsulated in a biodegradable polymer composite. Further embodiments of the controlled release fertilizer composition include one or more of alginate, kaolin, and waste water sludge. The nutrients of the fertilizer may be released such as to be available at the time needed for crop growth while minimizing waste and potentially harmful environmental effects.
    Type: Application
    Filed: July 21, 2022
    Publication date: October 10, 2024
    Inventors: Lin Wei, Zhisheng Cen, Cheng Zhang, Yajun Wu
  • Publication number: 20240253281
    Abstract: A passive horn integrally formed by using liquid silicone rubber, includes a first outer casing, a second outer casing, an inner casing and an iron piece. The first outer casing includes a sealing ring, a folding ring and a vibrating membrane, and the sealing ring, the folding ring and the vibrating membrane are integrally injection molded into the first outer casing. A groove is disposed in the second outer casing, and the first outer casing is disposed in the groove. The back surface of the vibrating membrane is provided with a casing groove, which is sequentially embedded with the inner casing and the iron piece. A preparation method of a passive horn integrally formed by using liquid silicone rubber, under the condition of integrated injection molding, may improve the yield rate, ensure product quality, save assembly time and labor cost, and improve production efficiency.
    Type: Application
    Filed: April 11, 2024
    Publication date: August 1, 2024
    Inventors: Shuhong CEN, Cheng HO
  • Publication number: 20240258109
    Abstract: A method of forming a structure on a substrate includes forming an adhesion layer on a substrate. The method further includes forming a tungsten containing layer in-situ with the adhesion layer. The tungsten containing layer is formed by a one-time soak process including soaking the substrate once, and only once, in a first gas, purging the first gas, and soaking the substrate once, and only once, in a second gas. The method further includes removing the tungsten containing layer from the adhesion layer.
    Type: Application
    Filed: December 7, 2023
    Publication date: August 1, 2024
    Inventors: Xi CEN, Kai WU, Min-Han LEE, Yang LI, Cheng CHENG, Zhixiu LIANG
  • Publication number: 20240253733
    Abstract: A hydrogen energy assisted vehicle, comprising a central control system, a hydrogen fuel cell system, a power control system, and a lithium battery pack. The central control system controls the hydrogen fuel cell system and the power control system to work, and receives feedback information of the hydrogen fuel cell system and the power control system. The hydrogen fuel cell system generates electricity to supply power to the central control system, the power control system and the lithium battery pack. The power control system controls the driving speed. The lithium battery pack supplies power to the central control system and the power control system.
    Type: Application
    Filed: May 27, 2022
    Publication date: August 1, 2024
    Applicant: YOUON TECHNOLOGY CO., LTD
    Inventors: Cheng QIAN, Jian CEN, Xiang SUN, Weijie ZE
  • Publication number: 20220213100
    Abstract: Disclosed are a nitrogen-containing heterocyclic derivative regulator, a preparation method therefor and an application thereof. In particular, disclosed are a compound as represented by general formula (I), a preparation method for the compound and a pharmaceutical composition containing the compound, and the use thereof as a KRAS G12C mutation inhibitor in treatment of diseases or symptoms such as leukemia, neuroblastoma, melanoma, breast cancer, lung cancer and colon cancer, wherein the definitions of substituents in general formula (I) are the same as those in the description.
    Type: Application
    Filed: May 29, 2020
    Publication date: July 7, 2022
    Inventors: Shiqiang LIU, Yongsheng WANG, Yida YUAN, Cheng CEN, Rudi BAO
  • Patent number: 8748950
    Abstract: A reconfigurable device includes a first insulating layer, a second insulating layer, and a nanoscale quasi one- or zero-dimensional electron gas region disposed at an interface between the first and second insulating layers. The device is reconfigurable by applying an external electrical field to the electron gas, thereby changing the conductivity of the electron gas region. A method for forming and erasing nanoscale-conducting structures employs tools, such as the tip of a conducting atomic force microscope (AFM), to form local electric fields. The method allows both isolated and continuous conducting features to be formed with a length well below 5 nm.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: June 10, 2014
    Assignee: University of Pittsburgh—Of the Commonwealth System of Higher Education
    Inventors: Jeremy Levy, Cheng Cen, Patrick Irvin
  • Publication number: 20140073114
    Abstract: Embodiments of the invention relate generally to semiconductor wafer technology and, more particularly, to the use of conformal grounding for active charge screening on wafers during wafer processing and metrology. A first aspect of the invention provides a method of reducing an accumulated surface charge on a semiconductor wafer, the method comprising: grounding a layer of conductive material adjacent a substrate of the wafer; and allowing a mirrored charge substantially equal in magnitude and opposite in sign to the accumulated surface charge to be induced along the conductive material.
    Type: Application
    Filed: November 12, 2013
    Publication date: March 13, 2014
    Applicants: GlobalFoundries Inc., International Business Machines Corporation
    Inventors: Cheng Cen, Steven B. Herschbein, Narender Rana, Nedal R. Saleh, Alok Vaid
  • Publication number: 20130200501
    Abstract: Embodiments of the invention relate generally to semiconductor wafer technology and, more particularly, to the use of conformal grounding for active charge screening on wafers during wafer processing and metrology. A first aspect of the invention provides a method of reducing an accumulated surface charge on a semiconductor wafer, the method comprising: grounding a layer of conductive material adjacent a substrate of the wafer; and allowing a mirrored charge substantially equal in magnitude and opposite in sign to the accumulated surface charge to be induced along the conductive material.
    Type: Application
    Filed: February 8, 2012
    Publication date: August 8, 2013
    Applicants: GLOBALFOUNDRIES INC., INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Cheng Cen, Steven B. Herschbein, Narender Rana, Nedal R. Saleh, Alok Vaid
  • Publication number: 20130048950
    Abstract: A reconfigurable device includes a first insulating layer, a second insulating layer, and a nanoscale quasi one- or zero-dimensional electron gas region disposed at an interface between the first and second insulating layers. The device is reconfigurable by applying an external electrical field to the electron gas, thereby changing the conductivity of the electron gas region. A method for forming and erasing nanoscale-conducting structures employs tools, such as the tip of a conducting atomic force microscope (AFM), to form local electric fields. The method allows both isolated and continuous conducting features to be formed with a length well below 5 nm.
    Type: Application
    Filed: November 17, 2010
    Publication date: February 28, 2013
    Applicant: University of Pittsburgh-Of the Commonwealth System of Higher Education
    Inventors: Jeremy Levy, Cheng Cen, Patrick Irvin