Abstract: A method applied in a test host for testing and debugging an electronic apparatus is provided. The test host and the electronic apparatus are connected by a connection port. The method comprises the following steps. The method is started when the test host is at a command mode. The test host issuing a test command to the electronic apparatus. Then the test host receives a series of response signal corresponding to the test command during the electronic apparatus executing the test command. When the host detects the response signal representing an execution log, the test host is switched to a debugging mode to monitor the electronic apparatus executing the test command. When the test host extracts a test result from the response signal, the test host is switched to a command mode to receive the test result and issue another test command or stop the testing and debugging.

Abstract: Portable device capable of testing an electronic device is disclosed. An embodiment of a portable device comprises a memory device and a processing unit. The memory device stores a test program describing a test flow including a series of test instructions. The processing unit, coupled to the memory device, acquires the test program, transmits the test command to the electronic device to direct the electronic device sequentially perform the test commands.

Abstract: A slurry residence time enhancement system for a chemical mechanical polishing apparatus having a base, a platen on the base, a polishing pad on the platen and a polishing head over the polishing pad is disclosed. The system includes at least one slurry distribution unit having a slurry distribution member for positioning on the polishing pad. In operation of the CMP apparatus, the slurry distribution member redirects polishing slurry on the polishing pad to the polishing head. The system may alternatively or additionally include a rim for upward extension from the base and a seal for insertion between the platen and the polishing pad adjacent to the rim.

Abstract: A system for use in manufacturing semiconductor devices, is provided. The system includes an electrochemical processing tool and an image sensor. The electrochemical processing tool includes an electrode located at a central region of a platen. The electrode is adapted for contacting a wafer workpiece during certain processing of the wafer workpiece using the tool. At least part of the electrode is viewable from above the platen when the electrochemical processing tool is operably assembled. The image sensor is capable of capturing an image of the viewable part of the electrode. The image sensor is positioned above the platen. The image sensor is adapted to be aimed at the electrode when an image of the electrode is to be taken with the image sensor.

Abstract: A leg guide for use in a leg of a jack up unit adapted to provide sliding guidance of the leg during vertical movement of the leg. The leg guide has a first portion contacting an edge of a leg chord and a second portion contacting a face of the leg chord along a longitudinal plane opposite the contact plane of the first portion. The edge contacting guide has a deflecting guide unit, which uses a compressible member sandwiched between two rigid plates. As the leg moves, the teeth of the leg chord contact the edge guide unit, with the compressible member absorbing compressible loads acting on the leg chord. The second portion provides for a face plate mounted transversely to the edge contacting guide for reducing the build-up of horizontal moment acting on the leg chord during the vertical movement of the leg and for reducing bending moments acting on the leg.