Abstract: A method for manufacturing a package structure includes providing a carrier board; providing at least one die having a top surface, a bottom surface, and a side surface on the carrier board; and forming a protective layer to cover at least a portion of the side surface of the die. The die includes a substrate, a semiconductor layer, a gate structure, a source structure and a drain structure, at least one dielectric layer, and at least one pad. The semiconductor layer is disposed on the substrate. The gate structure is disposed on the semiconductor layer. The source and the drain structures are disposed on opposite sides of the gate structure. The dielectric layer covers the gate, source, and drain structures. The pad is disposed on the dielectric layer and penetrates through the dielectric layer to electrically contact with the gate, source or drain structure.

Abstract: A method controls a computing device with an security device wherein a first identification information is stored in said computing device and a second identification information is stored in said security device. The computing device has a BIOS program and an operation system program. The method includes the steps of executing said BIOS program of said computer system; fetching said first identification information and said second identification information; comparing said first identification information with said second identification information; and executing said operation system program if said second identification information matches said first identification information.