Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment includes a magnetic attraction member and a connecting structure. The magnetic attraction member is independent from the lid and adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. At least a portion of the connecting structure is fixed to the container.

Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment is configured to be disposed on the lid or the body portion and includes a magnetic attraction member and a connecting structure. The magnetic attraction member is adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. The connecting structure includes a fastening member, and the fastening member is adapted to be detachably fastened to the body portion or the lid.

Abstract: Semiconductor devices, FinFET devices and methods of forming the same are disclosed. One of the semiconductor devices includes a substrate and a gate strip disposed over the substrate. The gate strip includes a high-k layer disposed over the substrate, an N-type work function metal layer disposed over the high-k layer, and a barrier layer disposed over the N-type work function metal layer. The barrier layer includes at least one first film containing TiAlN, TaAlN or AlN.

Abstract: Methods for tuning effective work functions of gate electrodes in semiconductor devices and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a channel region over a semiconductor substrate; a gate dielectric layer over the channel region; and a gate electrode over the gate dielectric layer, the gate electrode including a first work function metal layer over the gate dielectric layer, the first work function metal layer including aluminum (Al); a first work function tuning layer over the first work function metal layer, the first work function tuning layer including aluminum tungsten (AlW); and a fill material over the first work function tuning layer.

Abstract: A heat dissipation assembly includes a bottom plate, an outer cover, a heat guiding base, a flow-acceleration unit and two side cover sets. The bottom loads a heat-generating source. The outer cover includes a cover body and two slots. The cover body covers the bottom plate to define an accommodation space therebetween, and the slots are oppositely formed on the cover body and connected to the accommodation space. The heat guiding base thermally contacts the heat-generating source and the cover body, and is formed with voids arranged alongside, each of the voids is communication with the slots respectively. The side cover sets are disposed within the slots, respectively, and detachably connected to the cover body and the heat guiding base. The flow-acceleration unit is disposed in one of the side cover sets to lead a fluid to the other through the voids.

Abstract: A heat dissipation assembly includes a bottom plate, an outer cover, a heat guiding base, a flow-acceleration unit and two side cover sets. The bottom loads a heat-generating source. The outer cover includes a cover body and two slots. The cover body covers the bottom plate to define an accommodation space therebetween, and the slots are oppositely formed on the cover body and connected to the accommodation space. The heat guiding base thermally contacts the heat-generating source and the cover body, and is formed with voids arranged alongside, each of the voids is communication with the slots respectively. The side cover sets are disposed within the slots, respectively, and detachably connected to the cover body and the heat guiding base. The flow-acceleration unit is disposed in one of the side cover sets to lead a fluid to the other through the voids.

Abstract: An identifiable modular electronic device is provided, which includes a base main body, a plurality of external modules, a rotating ring, a plurality of first magnetic induction modules, a second magnetic induction module and a processing module. The base main body includes a plurality of sockets. Each external module can be plugged into each socket. A slot is disposed at a side of each external module. Each external module includes a first magnetic body. Each first magnetic induction module induces each corresponding first magnetic body to produce a magnetic flux signal. The rotating ring sheathes and is fixed on the base main body. The rotating ring is disposed with a plurality of latches, and one of the latches is disposed with a second magnetic body. The rotating ring is rotated from the OFF position to the ON position.

Abstract: A modular electronic device includes a frame and a module disposed in the frame. The frame has a slot and a recess in the slot. The module is disposed in the slot. The module includes a casing, a rail component disposed in casing and having a rail, a push rod slid in the rail, a supporting piece connected to push rod, a magnetic component disposed on supporting piece, and a latching member disposed in casing. Magnetic component includes a first magnet and a second magnet having opposite magnetic directions. Latching member is made of magnetic material. Casing has an opening arranged facing frame. Magnetic component is moved relative to latching member when push rod is slid along rail component. Magnetic component provides a repulsion force to push latching member protruding from opening and engaging with recess or provides an attraction force to restore latching member being contained in casing.

Abstract: The present invention comprises means for sublimating and handling ammonium chloride (NH.sub.4 Cl) vapor, a bi-product of a silicon nitride growth process, thereby preventing backstreaming into the reactor and ingestion of vapor and particulates by the vacuum pump. The exhaust circuit comprises a novel combination of valves, sublimation and cold traps, cooling and heating elements to facilitate reduction of condensed NH.sub.4 Cl volume from a first path trap thus reducing maintenance, increasing production up-time and enhancing product yield.

Abstract: A furnace system for preventing gas leakage is disclosed. The furnace system includes a bottom board for holding a furnace tube. A gas injection device is connected to the furnace tube at a first port for injecting reaction gas into the furnace tube. An exhaust subsystem is connected to the furnace tube at a second port. The exhaust subsystem has a first node, a second node, a third node and a fourth node. A vacuum seal is connected to the furnace tube at a third port for preventing the exhaust gas from leaking. The vacuum seal is connected to the exhaust subsystem at the first node and the second node. Finally, an N.sub.2 sealing tube is connected to furnace tube and surrounding the seam between the furnace tube and the bottom board.

Abstract: A procedure for the installation of clean room processing tools which require rough pumping equipment located in areas outside of the clean room. Instead of simultaneously installing and testing the pumping equipment and the processing tool, the pumping equipment is installed first along with its associated support services. Foreline piping, terminating in the proximity of the processing tool vacuum port is also installed and capped off at this time. Functional testing and qualification of the rough pumping equipment is done and then the processing tool is moved into place and connected to the pumping line on the clean room floor. This independent and sequential installation procedure reduces perturbations of on-going manufacturing activity in the clean room area and also minimizes the risk of costly damage to the processing tool by faulty, un-tested, pumping equipment.

Abstract: A procedure for the installation of clean room processing tools which require rough pumping equipment located in areas outside of the clean room. Instead of simultaneously installing and testing the pumping equipment and the processing tool, the pumping equipment is installed first along with its associated support services. Foreline piping, terminating in the proximity of the processing tool vacuum port is also installed and capped off at this time. Functional testing and qualification of the rough pumping equipment is done and then the processing tool is moved into place and connected to the pumping line on the clean room floor. This independent and sequential installation procedure reduces perturbations of on-going manufacturing activity in the clean room area and also minimizes the risk of costly damage to the processing tool by faulty, un-tested, pumping equipment.