Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes providing a substrate for an interposer, and forming a conductive interconnect structure in and on the substrate for connecting a group of selected IC dies. The method includes forming warpage-reducing trenches in non-routing regions of the interposer, wherein the warpage-reducing trenches are sized and positioned based on a warpage characteristic to reduce the warpage of the chip package structure. The method also includes depositing a warpage-relief material in the warpage-reducing trenches according to the warpage characteristic to reduce the warpage of the chip package structure, and bonding the group of selected IC dies to the interposer to form a chip package structure.

Abstract: Semiconductor devices, FinFET devices and methods of forming the same are disclosed. One of the semiconductor devices includes a substrate and a gate strip disposed over the substrate. The gate strip includes a high-k layer disposed over the substrate, an N-type work function metal layer disposed over the high-k layer, and a barrier layer disposed over the N-type work function metal layer. The barrier layer includes at least one first film containing TiAlN, TaAlN or AlN.

Abstract: Methods for tuning effective work functions of gate electrodes in semiconductor devices and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a channel region over a semiconductor substrate; a gate dielectric layer over the channel region; and a gate electrode over the gate dielectric layer, the gate electrode including a first work function metal layer over the gate dielectric layer, the first work function metal layer including aluminum (Al); a first work function tuning layer over the first work function metal layer, the first work function tuning layer including aluminum tungsten (AlW); and a fill material over the first work function tuning layer.

Abstract: A variable coupled inductor comprises a first core having a first protrusion, a second protrusion, a third protrusion, a first conducting-wire groove and a second conducting-wire groove on the top surface of the first core, wherein the second protrusion is disposed between the first protrusion and the third protrusion, wherein a first conducting wire is disposed in the first conducting-wire groove, and a second conducting wire is disposed in the second conducting-wire groove, wherein a second core, disposed over the first core, wherein a magnetic structure is integrally formed with the second core and protruded on the bottom surface of the second core, wherein the bottom surface of the magnetic structure is located over the top surface of the second protrusion.

Abstract: For producing an inter-layer conductive structure of a circuit board, an insulating layer, a first conductive layer, a second conductive layer and an electric contact material are provided, wherein the insulating layer includes at least a conductive hole therein. The electric contact material is inserted into the conductive hole of the insulating layer to form a conductive plug, and the first and second conductive layers are laminated to opposite surfaces of the insulating layer, respectively. After lamination, the conductive plug has two ends thereof in electric contact with the first conductive layer and the second conductive layer, respectively.

Abstract: An electrical component is disclosed, wherein the electrical component comprises: a body and an electrode structure disposed on a first surface of the body, wherein the electrode structure comprises an inner metal layer and an outer metal layer, wherein a terminal of a conductive element of the electrical component is disposed between the inner metal layer and the outer metal layer, wherein the terminal of the conductive element of the electrical component is electrically connected to the inner metal layer and the outer metal layer for electrically connecting with an external circuit.

Abstract: A variable coupled inductor comprises a first core having a first protrusion, a second protrusion, a third protrusion, a first conducting-wire groove and a second conducting-wire groove on the top surface of the first core, wherein the second protrusion is disposed between the first protrusion and the third protrusion, wherein a first conducting wire is disposed in the first conducting-wire groove, and a second conducting wire is disposed in the second conducting-wire groove, wherein a second core, disposed over the first core, wherein a magnetic structure is integrally formed with the second core and protruded on the bottom surface of the second core, wherein the bottom surface of the magnetic structure is located over the top surface of the second protrusion.

Abstract: A multi-layer wiring structure includes a first conductive structure, a second conductive structure and an insulating layer. To manufacturing the multi-layer wiring structure, a first conductive structure and a second conductive structure are provided. The first conductive structure and the second conductive structure include a plurality of wiring patterns. Then, the insulating layer is disposed between the first conductive structure and the second conductive structure. The insulting layer is thinner than the first conductive structure or the second conductive structure. The first conductive structure, the insulating layer and the second conductive structure are laminated to form the multi-layer wiring structure. A planar magnetic element having a compact coil manufactured by the method is also provided.

Abstract: A variable coupled inductor includes a first core, two conducting wires, a second core and a magnetic structure. The first core includes two first protruding portions, a second protruding portion and two grooves, wherein the second protruding portion is located between the two first protruding portions and each of the grooves is located between one of the first protruding portions and the second protruding portion. Each of the conducting wires is disposed in one of the grooves. The second core is disposed on the first core. A first gap is formed between each of the first protruding portions and the second core and a second gap is formed between the second protruding portion and the second core. The magnetic structure is disposed between the second protruding portion and the second core and distributed symmetrically with respect to a centerline of the second protruding portion.

Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.

Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.

Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.

Abstract: A multi-layer wiring structure includes a first conductive structure, a second conductive structure and an insulating layer. To manufacturing the multi-layer wiring structure, a first conductive structure and a second conductive structure are provided. The first conductive structure and the second conductive structure include a plurality of wiring patterns. Then, the insulating layer is disposed between the first conductive structure and the second conductive structure. The insulting layer is thinner than the first conductive structure or the second conductive structure. The first conductive structure, the insulating layer and the second conductive structure are laminated to form the multi-layer wiring structure. A planar magnetic element having a compact coil manufactured by the method is also provided.

Abstract: A variable coupled inductor includes a first core, two conducting wires, a second core and a magnetic structure. The first core includes two first protruding portions, a second protruding portion and two grooves, wherein the second protruding portion is located between the two first protruding portions and each of the grooves is located between one of the first protruding portions and the second protruding portion. Each of the conducting wires is disposed in one of the grooves. The second core is disposed on the first core. A first gap is formed between each of the first protruding portions and the second core and a second gap is formed between the second protruding portion and the second core. The magnetic structure is disposed between the second protruding portion and the second core and distributed symmetrically with respect to a centerline of the second protruding portion.

Abstract: For producing an inter-layer conductive structure of a circuit board, an insulating layer, a first conductive layer, a second conductive layer and an electric contact material are provided, wherein the insulating layer includes at least a conductive hole therein. The electric contact material is inserted into the conductive hole of the insulating layer to form a conductive plug, and the first and second conductive layers are laminated to opposite surfaces of the insulating layer, respectively. After lamination, the conductive plug has two ends thereof in electric contact with the first conductive layer and the second conductive layer, respectively.

Abstract: A variable coupled inductor includes a first core, two conducting wires, a second core and a magnetic structure. The first core includes two first protruding portions, a second protruding portion and two grooves, wherein the second protruding portion is located between the two first protruding portions and each of the grooves is located between one of the first protruding portions and the second protruding portion. Each of the conducting wires is disposed in one of the grooves. The second core is disposed on the first core. A first gap is formed between each of the first protruding portions and the second core and a second gap is formed between the second protruding portion and the second core. The magnetic structure is disposed between the second protruding portion and the second core and distributed symmetrically with respect to a centerline of the second protruding portion.

Abstract: An overlapping multi-board integrated antenna device includes a load plate with grounding portion and at least two-circuit board antenna units set in the grounding portion. Each circuit board antenna unit includes a circuit board kit, at least one antenna set on the surface of the circuit board kit and a feed line electrically connected with the antenna. Each circuit board kit includes a vertical plate and an interconnected horizontal plate. The antenna for the circuit board is set on the vertical plate. Two horizontal plates abutted in different circuit board antenna units are formed into an integrated structure via the same plate, and a joint portion is formed between two horizontal plates. Thus, the integrated configuration of multiple circuit board antenna units can be minimized to reduce the component amount and cost, so as to meet multi-function demands of antenna with better applicability and industrial and economic benefits.

Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.

Abstract: An electrical component is disclosed, wherein the electrical component comprises: a body and an electrode structure disposed on a first surface of the body, wherein the electrode structure comprises an inner metal layer and an outer metal layer, wherein a terminal of a conductive element of the electrical component is disposed between the inner metal layer and the outer metal layer, wherein the terminal of the conductive element of the electrical component is electrically connected to the inner metal layer and the outer metal layer for electrically connecting with an external circuit.

Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.