Patents by Inventor Cheng-Chang Shen

Cheng-Chang Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package structure and encapsulating module for molding the same
    Patent number: 8198740
    Abstract: A semiconductor package structure and encapsulating module for molding the same and an encapsulating mold for molding the same are provided. The encapsulating mold is used for packaging a substrate having a chip so as to mold the substrate having the chip as a package structure. The encapsulating mold has a pressing surface, a smooth surface and a cavity. The smooth surface having a curvature radius is connected with the pressing surface and disposed at a mouth of the cavity. When the encapsulating mold and an encapsulating lower mold are jointed to hold the substrate, the pressing surface contacts and presses the substrate.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: June 12, 2012
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Chang Shen, Chen-Tsung Chang, Chih-Yuan Lin
  • SEMICONDUCTOR PACKAGE STRUCTURE AND ENCAPSULATING MODULE FOR MOLDING THE SAME
    Publication number: 20100258957
    Abstract: A semiconductor package structure and encapsulating module for molding the same and an encapsulating mold for molding the same are provided. The encapsulating mold is used for packaging a substrate having a chip so as to mold the substrate having the chip as a package structure. The encapsulating mold has a pressing surface, a smooth surface and a cavity. The smooth surface having a curvature radius is connected with the pressing surface and disposed at a mouth of the cavity. When the encapsulating mold and an encapsulating lower mold are jointed to hold the substrate, the pressing surface contacts and presses the substrate.
    Type: Application
    Filed: October 14, 2009
    Publication date: October 14, 2010
    Inventors: Cheng-Chang Shen, Chen-Tsung Chang, Chih-Yuan Lin