Patents by Inventor Cheng Chang Tseng

Cheng Chang Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250132919
    Abstract: An identity verification-authentication system and method are used for verifying and authenticating at least a first user. The system includes a first prover for acquiring a first unique feature provided by the first user; and a verifier in communication with the first prover for generating a first proof request. The verifier sends a first variant data included in the first proof request to the first prover. The first prover generates a first to-be-compared answer data according to the first unique feature and the first variant data. The first prover or the verifier then generates a determination result according to a comparison of the first to-be-compared answer data and a first answer data included in the first proof request, and determines whether the identity verification and authentication of the first user is successfully according to the determination result.
    Type: Application
    Filed: September 6, 2022
    Publication date: April 24, 2025
    Inventors: PEI-HUA HUNG, CHENG-CHANG TSENG
  • Publication number: 20240186165
    Abstract: A wafer picking and placing apparatus includes a platform and a hooking unit. The platform is adapted to support a wafer. The hooking unit includes a driving device and a hooking structure, and the hooking structure is connected to the driving device and has at least one hooking end. The driving device is adapted to drive the hooking structure to move between a first position and a second position in a horizontal direction. The driving device is adapted to drive the hooking structure to move between the second position and a third position above the second position in a vertical direction. When the hooking structure is located at the first position, the hooking end is away from the platform. When the hooking structure is located at the second position, the hooking end inserts between a lower side of an edge of the wafer and the platform to hook the wafer.
    Type: Application
    Filed: April 11, 2023
    Publication date: June 6, 2024
    Applicant: HERMES-EPITEK CORPORATION
    Inventors: Cheng-Huang Kuo, Kuo-Meng Lo, Yu-Cheng Chang, Cheng Chang Tseng