Abstract: A control system of a travelling system includes a directional controller, a first sensor, a second sensor, an image-capturing module and a preprocessor. The first sensor is disposed on a reference position. The second sensor and the image-capturing module are disposed on the directional controller. The preprocessor compares a first directional data from the first sensor and a second directional data from the second sensor to obtain a difference value, and provides a photographing parameter to the image-capturing module.

Abstract: Systems, methods, and devices are described herein for integrated circuit (IC) layout validation. A plurality of IC patterns are collected which include a first set of patterns capable of being manufactured and a second set of patterns incapable of being manufactured. A machine learning model is trained using the plurality of IC patterns. The machine learning model generates a prediction model for validating IC layouts. The prediction model receives data including a set of test patterns comprising scanning electron microscope (SEM) images of IC patterns. Design violations associated with an IC layout are determined based on the SEM images and the plurality of IC patterns. A summary of the design violations is provided for further characterization of the IC layout.

Abstract: A control system of a travelling system includes a directional controller, a first sensor, a second sensor, an image-capturing module and a preprocessor. The first sensor is disposed on a reference position. The second sensor and the image-capturing module are disposed on the directional controller. The preprocessor compares a first directional data from the first sensor and a second directional data from the second sensor to obtain a difference value, and provides a photographing parameter to the image-capturing module.

Abstract: An image capturing apparatus includes a first lens module, a second lens module and an operation module which divides a first left block, a second right block of the first image and a second right block, a second left block of the second image into a plurality of first right sub-blocks, first left sub-blocks, second right sub-blocks and second left sub-blocks respectively, compares a first parameter, a second parameter and/or a third parameter of the first left sub-blocks, the first right sub-blocks, the second left sub-blocks and the second right sub-blocks, obtains a plurality of first difference values, a plurality of second difference values and/or a plurality of third difference values, obtains a total weighting value according to the first difference values, the second difference values and/or the third difference values, and adjusts brightness of the first image and the second image with the total weighting value.

Abstract: An image capturing apparatus includes a first lens module, a second lens module and an operation module which divides a first left block, a second right block of the first image and a second right block, a second left block of the second image into a plurality of first right sub-blocks, first left sub-blocks, second right sub-blocks and second left sub-blocks respectively, compares a first parameter, a second parameter and/or a third parameter of the first left sub-blocks, the first right sub-blocks, the second left sub-blocks and the second right sub-blocks, obtains a plurality of first difference values, a plurality of second difference values and/or a plurality of third difference values, obtains a total weighting value according to the first difference values, the second difference values and/or the third difference values, and adjusts brightness of the first image and the second image with the total weighting value.

Abstract: An etching method includes forming a high density structure and a low density structure on a substrate. A first material layer is formed to cover both structures. Part of the low density structure is exposed through the first material layer. A second material layer is formed to cover the first material layer. The second material layer is etched to remove the second material layer on the high density structure and part of the second material layer on the low density structure. The first material layer on the high density structure and the second material layer on the low density structure are simultaneously etched. The first material layer is etched to expose a first portion of the high density structure and a second portion of the low density structure. Finally, the first portion and the second portion are removed.

Abstract: A method for reducing the tilt of an optical unit during manufacture of an image sensor includes the steps of: providing a semimanufacture of the image sensor, carrying out a preheating process, carrying out an adhesive application process, carrying out an optical unit mounting process, and carrying out a packaging process. Due to the preheating process, the semimanufacture will be subjected to a stabilized process environment during the adhesive application process and the optical unit mounting process, so as for the optical unit to remain highly flat once attached to the semimanufacture. The method reduces the chances of tilt and crack of the optical unit and thereby contributes to a high yield rate.

Abstract: A two-stage packaging method of image sensors is disclosed. The packaging method includes the following steps: providing a substrate, fixing an image sensor chip on the substrate, fixing a transparent board on the image sensor chip, electrically connecting the image sensor chip and the substrate, forming a first encapsulant lay, and forming a second encapsulant layer. The two-stage packaging method prevents excessive pressure from being generated by formation of the encapsulant layers during the image sensor packaging process. Such excessive pressure, if generated, may result in position shift of the image sensor chip or damage of the bonding wires. The two-stage packaging method can increase the yield of the image sensor packaging process as well as the sensitivity of image sensors, thereby improving the quality and production of image sensor packaging while lowering the manufacturing costs.

Abstract: A two-stage packaging method of image sensors is disclosed. The packaging method includes the following steps: providing a substrate, fixing an image sensor chip on the substrate, fixing a transparent board on the image sensor chip, electrically connecting the image sensor chip and the substrate, forming a first encapsulant lay, and forming a second encapsulant layer. The two-stage packaging method prevents excessive pressure from being generated by formation of the encapsulant layers during the image sensor packaging process. Such excessive pressure, if generated, may result in position shift of the image sensor chip or damage of the bonding wires. The two-stage packaging method can increase the yield of the image sensor packaging process as well as the sensitivity of image sensors, thereby improving the quality and production of image sensor packaging while lowering the manufacturing costs.

Abstract: A triaxial driving device for electrodischarge machine tools having a three-liners-axes mechanism and an electrode tool and has a connecting mount, a first axial rotator, a base, a supporting arm, a second axial rotator, a third axial rotator and an electrode holder. The connecting mount is connected securely to the three-liners-axes mechanism. The first axial rotator is mounted in the connecting mount and has a rotating head. The base is connected securely to the rotating head of the first axial rotator and has a space. The supporting arm is rotatably mounted in the space of the base and has a connecting frame. The second axial rotator is securely connected to the base and the supporting arm and has a rotating head. The third axial rotator is connected to the supporting arm and has a rotating head. The electrode holder is connected to the third axial rotator and the electrode tool.

Abstract: The present invention discloses a structure and a manufacturing method for a high-resolution camera module, wherein the method includes the following steps: providing an image sensor wafer comprising multiple image sensor chips; performing inspection and defining if each image sensor chip is a good chip; disposing an optical cover on the image sensor chip defined as the good chip, wherein the optical cover faces a sensing area and does not cover conductive contacts; cutting the image sensor wafer to obtain the discrete image sensor chip covered with the optical cover; and disposing a first surface of the divided image sensor chip on a bottom surface of a ceramic substrate. The present invention can seal the high resolution camera module during early stage of the manufacturing process to improve the yield rate of the camera module, and downsize the camera module effectively.

Abstract: The present invention discloses a structure and a manufacturing method for a high-resolution camera module, wherein the method includes the following steps: providing an image sensor wafer comprising multiple image sensor chips; performing inspection and defining if each image sensor chip is a good chip; disposing an optical cover on the image sensor chip defined as the good chip, wherein the optical cover faces a sensing area and does not cover conductive contacts; cutting the image sensor wafer to obtain the discrete image sensor chip covered with the optical cover; and disposing a first surface of the divided image sensor chip on a bottom surface of a ceramic substrate. The present invention can seal the high resolution camera module during early stage of the manufacturing process to improve the yield rate of the camera module, and downsize the camera module effectively.

Abstract: A triaxial driving device for electrodischarge machine tools having a three-liners-axes mechanism and an electrode tool and has a connecting mount, a first axial rotator, a base, a supporting arm, a second axial rotator, a third axial rotator and an electrode holder. The connecting mount is connected securely to the three-liners-axes mechanism. The first axial rotator is mounted in the connecting mount and has a rotating head. The base is connected securely to the rotating head of the first axial rotator and has a space. The supporting arm is rotatably mounted in the space of the base and has a connecting frame. The second axial rotator is securely connected to the base and the supporting arm and has a rotating head. The third axial rotator is connected to the supporting arm and has a rotating head. The electrode holder is connected to the third axial rotator and the electrode tool.

Abstract: A method of automatically calibrating a visual parameter, such as luminance or contrast, for an imaging device is disclosed. A ratio of visual parameter difference to lens position difference between two predetermined lens positions is pre-determined for a predetermined focal length. A target visual parameter is then obtained according to the pre-determined ratio, a current visual parameter and lens position difference between a current lens position and a target lens position. Finally, the current visual parameter is updated by the target visual parameter in an automatic mode.

Abstract: The present invention is directed to a flashing control method for a digital camera. Indices respectively corresponding to sensitivity values are firstly determined. Subsequently, main-flash intensities are respectively obtained with respect to the sensitivity values such that their target brightness values are substantially the same after exposure, thereby constructing an energy table. Further, a predetermined preflash is fired to obtain a corresponding preflash brightness value with respect to each distinct distance. Main-flash indices are then respectively obtained according to maximum main-flash intensity and the energy table with respect to the distinct distances such that the target brightness values are substantially the same after exposure, thereby constructing a preflash table. During picture capturing, the main-flash intensity is obtained according to the preflash brightness value and the preflash table.

Abstract: The present invention is directed to a flashing control method for a digital camera. Indices respectively corresponding to sensitivity values are firstly determined. Subsequently, main-flash intensities are respectively obtained with respect to the sensitivity values such that their target brightness values are substantially the same after exposure, thereby constructing an energy table. Further, a predetermined preflash is fired to obtain a corresponding preflash brightness value with respect to each distinct distance. Main-flash indices are then respectively obtained according to maximum main-flash intensity and the energy table with respect to the distinct distances such that the target brightness values are substantially the same after exposure, thereby constructing a preflash table. During picture capturing, the main-flash intensity is obtained according to the preflash brightness value and the preflash table.

Abstract: A method of automatically calibrating a visual parameter, such as luminance or contrast, for an imaging device is disclosed. A ratio of visual parameter difference to lens position difference between two predetermined lens positions is pre-determined for a predetermined focal length. A target visual parameter is then obtained according to the pre-determined ratio, a current visual parameter and lens position difference between a current lens position and a target lens position. Finally, the current visual parameter is updated by the target visual parameter in an automatic mode.

Abstract: A method of manufacturing super-absorbent polymer (SAP) which is powdery, insoluble in water, and able to absorb water, blood and urine with slight soluble substances. The method includes at least the following steps: mixing a monomer solution having at least 50 mol % of neutralized acrylic acid with polymerization initiators to synthesize a sticky precursor, wherein the monomer can be selected from acrylic acid, methacrylic acid, 2-acrylamido-2-methyl-propane sulfonic acid, or the mixtures thereof; mixing high hydrophilic epoxy compounds and polymerization initiators with the precursor and producing a gel via UV cross-linking; drying the gel at temperature of 100 to 250° C. to obtain a polymer; grinding and screening the polymer into constant particle size; coating the polymer with surface cross-linking agents; heating the polymer at temperature of 80 to 230° C.; and adding powdery inert inorganic salts into the polymer.

Abstract: A method of manufacturing super-absorbent polymer (SAP) which is powdery, insoluble in water, and able to absorb water, blood and urine with slight soluble substances. The method includes at least the following steps: mixing a monomer solution having at least 50 mol % of neutralized acrylic acid with polymerization initiators to synthesize a sticky precursor, wherein the monomer can be selected from acrylic acid, methacrylic acid, 2-acrylamido-2-methyl-propane sulfonic acid, or the mixtures thereof; mixing high hydrophilic epoxy compounds and polymerization initiators with the precursor and producing a gel via UV cross-linking; drying the gel at temperature of 100 to 250° C. to obtain a polymer; grinding and screening the polymer into constant particle size; coating the polymer with surface cross-linking agents; heating the polymer at temperature of 80 to 230° C.; and adding powdery inert inorganic salts into the polymer.

Abstract: A thin film etching method is provided, which is used for manufacturing semiconductor device or thin film transistor (TFT) array and through which no undercut may be presented or a good after-etching shape may be achieved with respect to a thin film thus etched. The thin film etching method is performed in a two-stage manner by an etchant and between the two stages a photoresist removing process is inserted where another etchant is used. With execution of the photoresist removing process, the thin film may have an increased contact area with the etchant. As such, any undercut or undesired after-etching shape existed in the thin film etched by the prior art may be eliminated or improved.