Patents by Inventor CHENG CHE CHIANG

CHENG CHE CHIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100325162
    Abstract: A method for analyzing development data of an airport city is provided. First, a construct collecting database including a plurality of construct classes is provided, wherein each of the construct classes is corresponding to at least one keyword. Then, a text analysis is executed to the development data of the airport city to divide the development data into a building phase and an operating phase, and a plurality of construct messages is respectively captured from the development data of the building phase and the development data of the operating phase according to the keywords in the construct collecting database. Next, each of the construct messages is linked to a corresponding object according to the corresponding construct class and an occurrence time of the construct message. Finally, relations between the objects are established according to a construct relation data.
    Type: Application
    Filed: September 30, 2009
    Publication date: December 23, 2010
    Applicant: National Taiwan University of Science and Technology
    Inventors: Kung-Jeng Wang, Wan-Chung Hong, Shin-Hua Chen, Shih-Min Wang, Cheng-Che Chiang, Liany-Quan Chen, Ya-Chi Huang
  • Publication number: 20100098855
    Abstract: A furnace temperature control method for thermal budget balance includes the steps of: placing a plurality of batches of wafers in the furnace; processing the wafers in the furnace via a heat deposition process; adjusting temperature in the furnace during the heat deposition process so that the temperature in the furnace has a temperature gradient; and controlling and inverting the temperature gradient so that the wafers in the furnace have the same thermal budget, whereby the electric parameters of the processed wafers tend to become uniform. Accordingly, considering the influence of the thermal budget, the present invention adjusts the temperature in the furnace and balances the thermal budget of the wafers in the furnace to avoid that the electric parameters of the processed wafers have extreme values, thereby improving the yield rate.
    Type: Application
    Filed: May 1, 2009
    Publication date: April 22, 2010
    Applicant: INOTERA MEMORIES, INC.
    Inventors: CHENG CHE CHIANG, CHEN YEN KUO, YIN KUEI YU