Patents by Inventor Cheng-Che Sage Kung

Cheng-Che Sage Kung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal-binding motif compositions and methods
    Patent number: 7659362
    Abstract: Disclosed herein are recombinant copper or zinc binding polypeptides containing at least one copper or zinc binding motif and a sequence heterologous to it. Also disclosed is a method to reduce the concentration of a free copper or zinc ion in a substrate by contacting it with a recombinant polypeptide containing a copper or zinc binding motif. A further method relates to reducing the concentration of a free copper or zinc ion in a substrate by contacting it with a host cell that expresses a recombinant polypeptide containing a copper or zinc binding motif.
    Type: Grant
    Filed: May 30, 2006
    Date of Patent: February 9, 2010
    Assignee: Academia Sinica
    Inventors: Kuo-Chen Yeh, Cheng-Che Sage Kung
  • METAL-BINDING MOTIF COMPOSITIONS AND METHODS
    Publication number: 20070281333
    Abstract: Disclosed herein are recombinant copper or zinc binding polypeptides containing at least one copper or zinc binding motif and a sequence heterologous to it. Also disclosed is a method to reduce the concentration of a free copper or zinc ion in a substrate by contacting it with a recombinant polypeptide containing a copper or zinc binding motif. A further method relates to reducing the concentration of a free copper or zinc ion in a substrate by contacting it with a host cell that expresses a recombinant polypeptide containing a copper or zinc binding motif.
    Type: Application
    Filed: May 30, 2006
    Publication date: December 6, 2007
    Inventors: Kuo-Chen Yeh, Cheng-Che Sage Kung