Patents by Inventor Cheng-Chia Kuo

Cheng-Chia Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240405005
    Abstract: A package includes a first package and a second package over and bonded to the first package. The first package includes a first device die, and a first encapsulant encapsulating the first device die therein. The second package includes an Independent Passive Device (IPD) die, and a second encapsulant encapsulating the IPD die therein. The package further includes a power module over and bonded to the second package.
    Type: Application
    Filed: July 25, 2024
    Publication date: December 5, 2024
    Inventors: Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Patent number: 9368427
    Abstract: An integrated circuit film and a method of manufacturing the same are disclosed. The integrated circuit film includes a circuit board containing a circuit route; a first set of pads located on a first surface of the circuit board and configured to be applicable to ISO 7816 standard; and a semiconductor device mounted on the circuit board for communicating with at least one of the first set of pads. The first set of pads are arranged in two rows and the semiconductor device is mounted on the circuit board in a space between the two rows of pads.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: June 14, 2016
    Assignee: MXTRAN INC.
    Inventors: Chin-Sheng Lin, Cheng-Chia Kuo, Chih-Cheng Lin
  • Patent number: 9292781
    Abstract: An installation card for a smart SIM Overlay and an installation method using the same are provided. The installation card comprises a carrier plate, a first adhesive layer, a smart overlay and a second adhesive layer. The carrier plate has a notch and a surface. The first adhesive layer adheres to the surface of the carrier plate. The smart overlay is adheres to the first adhesive layer, and the smart overlay is positioned corresponding to the notch. The second adhesive layer is adhered to the smart overlay.
    Type: Grant
    Filed: March 26, 2014
    Date of Patent: March 22, 2016
    Assignee: MXTRAN INC.
    Inventors: Chin-Sheng Lin, Cheng-Chia Kuo, Chih-Cheng Lin
  • Publication number: 20150186767
    Abstract: An installation card for a smart SIM Overlay and an installation method using the same are provided. The installation card comprises a carrier plate, a first adhesive layer, a smart overlay and a second adhesive layer. The carrier plate has a notch and a surface. The first adhesive layer adheres to the surface of the carrier plate. The smart overlay is adheres to the first adhesive layer, and the smart overlay is positioned corresponding to the notch. The second adhesive layer is adhered to the smart overlay.
    Type: Application
    Filed: March 26, 2014
    Publication date: July 2, 2015
    Applicant: MXTRAN INC.
    Inventors: Chin-Sheng Lin, Cheng-Chia Kuo, Chih-Cheng Lin
  • Publication number: 20140217614
    Abstract: An integrated circuit film and a method of manufacturing the same are disclosed. The integrated circuit film includes a circuit board containing a circuit route; a first set of pads located on a first surface of the circuit board and configured to be applicable to ISO 7816 standard; and a semiconductor device mounted on the circuit board for communicating with at least one of the first set of pads. The first set of pads are arranged in two rows and the semiconductor device is mounted on the circuit board in a space between the two rows of pads.
    Type: Application
    Filed: August 8, 2013
    Publication date: August 7, 2014
    Applicant: Mxtran Inc.
    Inventors: Chin-Sheng Lin, Cheng-Chia Kuo, Chih-Cheng Lin
  • Patent number: 6851168
    Abstract: A clamp for quickly, effectively and safely removing a cathode collar from an HDP deposition chamber for routine maintenance, cleaning or replacement of the collar. The clamp includes a pair of clamp plates which are capable of pivoting movement on respective ends of a connecting rod. A clamp shoe for gripping a corresponding edge of the annular collar is provided on the bottom end of each clamp plate, and a turnbuckle is fitted with a pair of threaded shafts which engage the upper end portions of the respective clamp plates. By rotating the turnbuckle, the threaded shafts are advanced away from each other against the clamp plates, which pivot on the connecting rod and cause the clamp shoes to tightly engage respective edges of the collar. The clamp is grasped to lift the collar from the chamber and replace the collar in the chamber after cleaning or maintenance.
    Type: Grant
    Filed: June 19, 2002
    Date of Patent: February 8, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Wen-Shan Chang, Jung-Chang Chen, Shih-Chang Hsu, Li-Chung Wang, Cheng-Chia Kuo, Jong-Min Lin, Kuo-Ming Yu, Da-Hsiang Chou, Kuo-Chuan Chen, Ming-Te Chen
  • Publication number: 20030233746
    Abstract: A clamp for quickly, effectively and safely removing a cathode collar from an HDP deposition chamber for routine maintenance, cleaning or replacement of the collar. The clamp includes a pair of clamp plates which are capable of pivoting movement on respective ends of a connecting rod. A clamp shoe for gripping a corresponding edge of the annular collar is provided on the bottom end of each clamp plate, and a turnbuckle is fitted with a pair of threaded shafts which engage the upper end portions of the respective clamp plates. By rotating the turnbuckle, the threaded shafts are advanced away from each other against the clamp plates, which pivot on the connecting rod and cause the clamp shoes to tightly engage respective edges of the collar. The clamp is grasped to lift the collar from the chamber and replace the collar in the chamber after cleaning or maintenance.
    Type: Application
    Filed: June 19, 2002
    Publication date: December 25, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Shan Chang, Jung-Chang Chen, Shih-Chang Hsu, Li-Chung Wang, Cheng-Chia Kuo, Jong-Min Lin, Kuo-Ming Yu, Da-Hsiang Chou, Kuo-Chuan Chen, Ming-Te Chen