Patents by Inventor Cheng Chie Li

Cheng Chie Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Touch assembly and method of manufacturing the same
    Patent number: 12675181
    Abstract: A touch assembly includes a protective cover, a first adhesive layer, a plurality of curved wires, and a second adhesive layer. The first adhesive layer is disposed on the protective cover. A thickness of the first adhesive layer ranges from 20 ?m to 200 ?m. An initial tack of the first adhesive layer ranges from 1800 gf/in to 4000 gf/in. The curved wires are disposed on the first adhesive layer and include a first group of wires and a second group of wires. The first group of wires extend along a first direction. The second group of wires extend along a second direction and overlap the first group of wires. Each of the curved wires includes a conductive inner core and a covering layer. The second adhesive layer covers the curved wires and the first adhesive layer.
    Type: Grant
    Filed: April 2, 2025
    Date of Patent: July 7, 2026
    Assignee: TPK Glass Solutions (Xiamen) Inc.
    Inventors: Jie Lin Hung, Li Huang Tsai, Lien Hsin Lee, Liang Liu, Cheng Chie Li, Chun Ping Zhou