Abstract: An image adjustment method is applied to an image displaying apparatus and includes analyzing an image stream with a plurality of received frames, determining whether a region of one of the received frames conforms to an execution requirement of a non-partial update function, and applying the non-partial update function or a partial update function for the received frame in accordance with a determination result.

Abstract: A method includes the following steps. A wafer table is cleaned by using a cleaning scrubber. After cleaning the wafer table, a semiconductor wafer is loaded onto the wafer table. After loading the semiconductor wafer onto the wafer table, a photolithography process is performed on the semiconductor wafer. The cleaning scrubber has microstructures protruding from a surface of the cleaning scrubber. The microstructures are spaced apart from each other and have a tapered width. The microstructures are diamond microstructures. The surface of the cleaning scrubber includes an inner annular region and an outer annular region around the inner annular region. first ones of the plurality of microstructures within the outer annular region have a height different from a height of second ones of the plurality of microstructure within the inner annular region.

Abstract: An exposure module includes a light source, a photomask situated optically downstream of the light source, and a wafer table situated optically downstream of the photomask. The wafer table includes a plurality of silicon carbide (SiC) crystalline structures separated from each other by trenches. The exposure module further includes a cleaning scrubber operative to clean the wafer table. The cleaning scrubber includes a circular surface and a plurality of microstructures extending from the circular surface. The microstructures are tapered from a first width to a second width in a direction away from the circular surface. The second width is less than a width of the plurality of trenches between the SiC crystalline structures of the wafer table.

Abstract: A portable handheld cleaning device is provided capable of cleaning the surface of the substrate table without damaging the surface. The portable handheld cleaning device in accordance with the present disclosure includes a base having a first side and a second side (the first side and the second side overlapping each other), a hollow structure on the first side of the base, and a weight holding space within the hollow structure. A grinding pad is provided on the second side of the base. The grinding pad includes a cleaning surface, the cleaning surface having a plurality of substantial pyramid shaped grits.

Abstract: A portable handheld cleaning device is provided capable of cleaning the surface of the substrate table without damaging the surface. The portable handheld cleaning device in accordance with the present disclosure includes a base having a first side and a second side (the first side and the second side overlapping each other), a hollow structure on the first side of the base, and a weight holding space within the hollow structure. A grinding pad is provided on the second side of the base. The grinding pad includes a cleaning surface, the cleaning surface having a plurality of substantial pyramid shaped grits.

Abstract: A method for forming a layer includes following operations. A workpiece is received in an apparatus for deposition. The apparatus for deposition includes a chamber, a pedestal disposed in the chamber to accommodate the workpiece, and a ring disposed on the pedestal. The ring includes a ring body having a first top surface and a second top surface and a barrier structure disposed between the first top surface and the second top surface. A vertical distance is defined by a top surface of the barrier structure and a top surface of the workpiece. The vertical distance is between approximately 0 mm and approximately 50 mm. A target disposed in the apparatus for deposition is sputtered. A sputtered material is deposited onto a top surface of the workpiece to form a layer. The barrier structure alters an electrical density distribution during the depositing the sputter material.

Abstract: A lithography system includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket, a rail guide, and a first protective film. The first sliding member is coupled to the wafer stage. The second sliding member is coupled to an edge of the table body, in which the first sliding member is coupled to a track of the second sliding member. The first bracket fixes the first cable, the first bracket being coupled to a roller structure, in which the roller structure includes a body and a wheel coupled to the body. The rail guide confines a movement of the wheel of the roller structure. The first protective film is adhered to a surface of the rail guide, in which the roller structure is moveable along the first protective film on the surface of the rail guide.

Abstract: A hypochlorous acid preparation system is provided. The hypochlorous acid preparation system includes: a hypochlorous acid preparation apparatus comprising: a first inlet, wherein sulfuric acid collected from a clean room located in a semiconductor fabrication plant enters the hypochlorous acid preparation apparatus through the first inlet; a second inlet, wherein sodium hypochlorite solution enters the hypochlorous acid preparation apparatus through the second inlet; a third inlet, wherein deionized water enters the hypochlorous acid preparation apparatus through the third inlet; and an outlet, wherein hypochlorous acid is produced in situ by mixing the sulfuric acid, the sodium hypochlorite solution, and the deionized water and exits the hypochlorous acid preparation apparatus through the outlet.

Abstract: An apparatus for PVD is provided. The apparatus includes a chamber, a pedestal disposed in the chamber to accommodate a wafer, and a ring. The ring includes a ring body having a first top surface and a second top surface, and a barrier structure disposed between the first top surface and the second top surface. The barrier structure can further include at least a first portion and a second portion separated from each other. The second vertical distance is equal to or greater than the first vertical distance.

Abstract: A portable handheld cleaning device is provided capable of cleaning the surface of the substrate table without damaging the surface. The portable handheld cleaning device in accordance with the present disclosure includes a base having a first side and a second side (the first side and the second side overlapping each other), a hollow structure on the first side of the base, and a weight holding space within the hollow structure. A grinding pad is provided on the second side of the base. The grinding pad includes a cleaning surface, the cleaning surface having a plurality of substantial pyramid shaped grits.

Abstract: A method includes performing a cleaning operation on a supporting surface of a wafer table by using a cleaning scrubber having a plurality of microstructures, the plurality of microstructures being spaced apart from each other and having a tapered width; placing a semiconductor wafer on the supporting surface of the wafer table; and performing a photolithography process on the semiconductor wafer.

Abstract: An exposure module includes a light source, a photomask situated optically downstream of the light source, and a wafer table situated optically downstream of the photomask. The wafer table includes a plurality of silicon carbide (SiC) crystalline structures separated from each other by trenches. The exposure module further includes a cleaning scrubber operative to clean the wafer table. The cleaning scrubber includes a circular surface and a plurality of microstructures extending from the circular surface. The microstructures are tapered from a first width to a second width in a direction away from the circular surface. The second width is less than a width of the plurality of trenches between the SiC crystalline structures of the wafer table.

Abstract: A lithography system includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket, a rail guide, and a first protective film. The first sliding member is coupled to the wafer stage. The second sliding member is coupled to an edge of the table body, in which the first sliding member is coupled to a track of the second sliding member. The first bracket fixes the first cable, the first bracket being coupled to a roller structure, in which the roller structure includes a body and a wheel coupled to the body. The rail guide confines a movement of the wheel of the roller structure. The first protective film is adhered to a surface of the rail guide, in which the roller structure is moveable along the first protective film on the surface of the rail guide.

Abstract: A lithography system includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket, a rail guide, and a first protective film. The first sliding member is coupled to the wafer stage. The second sliding member is coupled to an edge of the table body, in which the first sliding member is coupled to a track of the second sliding member. The first bracket fixes the first cable, the first bracket being coupled to a roller structure, in which the roller structure includes a body and a wheel coupled to the body. The rail guide confines a movement of the wheel of the roller structure. The first protective film is adhered to a surface of the rail guide, in which the roller structure is moveable along the first protective film on the surface of the rail guide.

Abstract: A method includes transferring a wafer over a wafer stage on a wafer table. The wafer table includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket and a second bracket, and a stopper. The second sliding member is movable along a first direction, in which the first sliding member is coupled to a track of the second sliding member, the first sliding member being movable along a second direction vertical to the first direction. The first bracket and the second bracket are connected by a leaf spring. The method includes moving the wafer stage toward the edge of the table body, such that the wafer stage pushes the first cable outwardly, such that the leaf spring is moved toward a first protective film on a surface of the stopper facing the leaf spring.

Abstract: A lithography system includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket, a rail guide, and a first protective film. The first sliding member is coupled to the wafer stage. The second sliding member is coupled to an edge of the table body, in which the first sliding member is coupled to a track of the second sliding member. The first bracket fixes the first cable, the first bracket being coupled to a roller structure, in which the roller structure includes a body and a wheel coupled to the body. The rail guide confines a movement of the wheel of the roller structure. The first protective film is adhered to a surface of the rail guide, in which the roller structure is moveable along the first protective film on the surface of the rail guide.

Abstract: A method for forming a layer includes following operations. A workpiece is received in an apparatus for deposition. The apparatus for deposition includes a chamber, a pedestal disposed in the chamber to accommodate the workpiece, and a ring disposed on the pedestal. The ring includes a ring body having a first top surface and a second top surface and a barrier structure disposed between the first top surface and the second top surface. A vertical distance is defined by a top surface of the barrier structure and a top surface of the workpiece. The vertical distance is between approximately 0 mm and approximately 50 mm. A target disposed in the apparatus for deposition is sputtered. A sputtered material is deposited onto a top surface of the workpiece to form a layer. The barrier structure alters an electrical density distribution during the depositing the sputter material.

Abstract: A method includes transferring a wafer over a wafer stage on a wafer table. The wafer table includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket and a second bracket, and a stopper. The second sliding member is movable along a first direction, in which the first sliding member is coupled to a track of the second sliding member, the first sliding member being movable along a second direction vertical to the first direction. The first bracket and the second bracket are connected by a leaf spring. The method includes moving the wafer stage toward the edge of the table body, such that the wafer stage pushes the first cable outwardly, such that the leaf spring is moved toward a first protective film on a surface of the stopper facing the leaf spring.

Abstract: In a method of diagnosing an RF generator of a laser produced plasma extreme ultra violet (LPP EUV) radiation source apparatus, a testing system is connected to the RF generator of the LPP EUV radiation source apparatus. An output power is measured by the testing system with changing an input power of the RF generator. Using a computer system, the measured output power is analyzed. Based on the analyzed measured output power, whether the RF generator is operating properly is determined.

Abstract: A method, a system, and non-transitory computer readable medium for level package routing are provided. The method includes performing triangulation on a set of nets to generate a routing resource graph. The objects of the set of nets are represented by a respective center point during triangulation. The method also includes generating a route between the objects of the set of nets based on at least a total cost. The total cost is determined based on at least the routing resource graph. The method also includes altering the route based on a determination that a constraint rule is unmet and outputting routing information comprising the route for the set of nets.