Patents by Inventor Cheng-Chieh Chuang

Cheng-Chieh Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200168458
    Abstract: A method for patterning a metal layer includes depositing a hard mask layer on a metal layer, depositing a first patterned layer on the hard mask layer, forming a first set of sidewall spacers on sidewalls of features of the first patterned layer, forming a second set of sidewall spacers on sidewalls of the first set of sidewall spacers, removing the first set of sidewall spacers, and performing a reactive ion etching process to pattern portions of the metal layer exposed through the first patterned layer and the second set of sidewall spacers.
    Type: Application
    Filed: August 19, 2019
    Publication date: May 28, 2020
    Inventors: Yu-Chieh Liao, Cheng-Chi Chuang, Chia-Tien Wu, Tai-I Yang, Hsin-Ping Chen
  • Patent number: 10651220
    Abstract: Various embodiments of the present application are directed to a narrow band filter with high transmission and an image sensor comprising the narrow band filter. In some embodiments, the filter comprises a first distributed Bragg reflector (DBR), a second DBR, a defect layer between the first and second DBRs, and a plurality of columnar structures. The columnar structures extend through the defect layer and have a refractive index different than a refractive index of the defect layer. The first and second DBRs define a low transmission band, and the defect layer defines a high transmission band dividing the low transmission band. The columnar structures shift the high transmission band towards lower or higher wavelengths depending upon a refractive index of the columnar structures and a fill factor of the columnar structures.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: May 12, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu
  • Patent number: 10651225
    Abstract: In some embodiments, the present disclosure relates to a three-dimensional integrated chip. The three-dimensional integrated chip includes a first integrated chip (IC) die and a second IC die. The first IC die has a first image sensor element configured to generate electrical signals from electromagnetic radiation within a first range of wavelengths. The second IC die has a second image sensor element configured to generate electrical signals from electromagnetic radiation within a second range of wavelengths that is different than the first range of wavelengths. A first band-pass filter is arranged between the first IC die and the second IC die and is configured to reflect electromagnetic radiation that is within the first range of wavelengths.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: May 12, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu
  • Publication number: 20200105815
    Abstract: In some embodiments, the present disclosure relates to a three-dimensional integrated chip. The three-dimensional integrated chip includes a first integrated chip (IC) die and a second IC die. The first IC die has a first image sensor element configured to generate electrical signals from electromagnetic radiation within a first range of wavelengths. The second IC die has a second image sensor element configured to generate electrical signals from electromagnetic radiation within a second range of wavelengths that is different than the first range of wavelengths. A first band-pass filter is arranged between the first IC die and the second IC die and is configured to reflect electromagnetic radiation that is within the first range of wavelengths.
    Type: Application
    Filed: October 18, 2018
    Publication date: April 2, 2020
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu
  • Publication number: 20200098808
    Abstract: An image sensor package is provided. The image sensor package comprises a package substrate, and an image sensor chip arranged over the package substrate. The integrated circuit device further comprises a protection layer overlying the image sensor chip having a planar top surface and a bottom surface lining and contacting structures under the protection layer, and an on-wafer shield structure spaced around a periphery of the image sensor chip. The height of the image sensor package can be reduced since a discrete cover glass or an infrared filter and corresponding intervening materials are no longer needed since being replaced by the build in protection layer. The size of the image sensor package can be reduced since a discrete light shield and corresponding intervening materials are no longer needed since being replaced by the build in on wafer light shield structure.
    Type: Application
    Filed: December 20, 2018
    Publication date: March 26, 2020
    Inventors: Wen-Hau Wu, Chun-Hao Chuang, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Cheng Yu Huang
  • Publication number: 20200098813
    Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.
    Type: Application
    Filed: May 20, 2019
    Publication date: March 26, 2020
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Chien Yu, Ting-Cheng Chang, Wen-Hau Wu, Chih-Kung Chang
  • Publication number: 20200098801
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip has an image sensor within a substrate. A first dielectric has an upper surface that extends over a first side of the substrate and over one or more trenches within the first side of the substrate. The one or more trenches laterally surround the image sensor. An internal reflection structure arranged over the upper surface of the first dielectric. The internal reflection structure is configured to reflect radiation exiting from the substrate back into the substrate.
    Type: Application
    Filed: November 26, 2019
    Publication date: March 26, 2020
    Inventors: Keng-Yu Chou, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Wei-Chieh Chiang, Cheng Yu Huang, Wen-Hau Wu, Chih-Kung Chang, Jhy-Jyi Sze
  • Publication number: 20200052159
    Abstract: The invention provides an LED including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, a Bragg reflector structure, a conductive layer and insulation patterns. The first electrode and the second electrode are located on the same side of the Bragg reflector structure. The conductive layer is disposed between the Bragg reflector structure and the second-type semiconductor layer. The insulation patterns are disposed between the conductive layer and the second-type semiconductor layer. Each insulating layer has a first surface facing toward the second-type semiconductor layer, a second surface facing away from the second-type semiconductor layer, and an inclined surface. The inclined surface connects the first surface and the second surface and is inclined with respect to the first surface and the second surface.
    Type: Application
    Filed: October 21, 2019
    Publication date: February 13, 2020
    Applicant: Genesis Photonics Inc.
    Inventors: Yi-Ru Huang, Tung-Lin Chuang, Yan-Ting Lan, Sheng-Tsung Hsu, Chih-Ming Shen, Jing-En Huang, Teng-Hsien Lai, Hung-Chuan Mai, Kuan-Chieh Huang, Shao-Ying Ting, Cheng-Pin Chen, Wei-Chen Chien, Chih-Chin Cheng, Chih-Hung Tseng
  • Publication number: 20200035733
    Abstract: Various embodiments of the present application are directed to a narrow band filter with high transmission and an image sensor comprising the narrow band filter. In some embodiments, the filter comprises a first distributed Bragg reflector (DBR), a second DBR, a defect layer between the first and second DBRs, and a plurality of columnar structures. The columnar structures extend through the defect layer and have a refractive index different than a refractive index of the defect layer. The first and second DBRs define a low transmission band, and the defect layer defines a high transmission band dividing the low transmission band. The columnar structures shift the high transmission band towards lower or higher wavelengths depending upon a refractive index of the columnar structures and a fill factor of the columnar structures.
    Type: Application
    Filed: October 10, 2018
    Publication date: January 30, 2020
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Hau Wu
  • Patent number: 10510795
    Abstract: In some embodiments, the present disclosure relates to an image sensor integrated chip. The integrated chip has an image sensing element arranged within a substrate. A first dielectric is disposed in one or more trenches within a first side of the substrate. The one or more trenches laterally surround the image sensing element. The substrate includes a recessed portion arranged along the first side of the substrate and defined by second sidewalls of the substrate directly over the image sensing element. The second sidewalls of the substrate are angled to meet at a point disposed along a horizontal plane that intersects the first dielectric within the one or more trenches.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Keng-Yu Chou, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Wei-Chieh Chiang, Cheng Yu Huang, Wen-Hau Wu, Chih-Kung Chang, Jhy-Jyi Sze
  • Publication number: 20190378863
    Abstract: In some embodiments, the present disclosure relates to an image sensor integrated chip. The integrated chip has an image sensing element arranged within a substrate. A first dielectric is disposed in one or more trenches within a first side of the substrate. The one or more trenches laterally surround the image sensing element. The substrate includes a recessed portion arranged along the first side of the substrate and defined by second sidewalls of the substrate directly over the image sensing element. The second sidewalls of the substrate are angled to meet at a point disposed along a horizontal plane that intersects the first dielectric within the one or more trenches.
    Type: Application
    Filed: July 19, 2019
    Publication date: December 12, 2019
    Inventors: Keng-Yu Chou, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Wei-Chieh Chiang, Cheng Yu Huang, Wen-Hau Wu, Chih-Kung Chang, Jhy-Jyi Sze
  • Patent number: 10451659
    Abstract: A detection circuit of an electronic device includes a resistance detecting circuit and a voltage supplying circuit, wherein the detecting circuit is coupled to an input circuit which is coupled to the electronic device and comprises a plurality of resistors respectively coupled to a plurality of switches, wherein the resistance detecting circuit is arranged to detect whether the input circuit has a resistance variation and generate a detecting signal indicative of the resistance variation; and the voltage supplying circuit is coupled to the resistance detecting circuit to supply a first voltage signal, wherein the voltage supplying circuit receives the detecting signal, and selectively switches the first voltage signal to a second voltage signal according to the detecting signal; wherein the resistance detecting circuit determines whether at least one of the plurality of switches is closed according to the second voltage signal.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: October 22, 2019
    Assignee: Realtek Semiconductor Corp.
    Inventors: Cheng-Pin Chang, Tsung-Peng Chuang, Wei-Chieh Wang
  • Patent number: 10453999
    Abstract: The invention provides an LED including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, a Bragg reflector structure, a conductive layer and insulation patterns. The first electrode and the second electrode are located on the same side of the Bragg reflector structure. The conductive layer is disposed between the Bragg reflector structure and the second-type semiconductor layer. The insulation patterns are disposed between the conductive layer and the second-type semiconductor layer. Each insulating layer has a first surface facing toward the second-type semiconductor layer, a second surface facing away from the second-type semiconductor layer, and an inclined surface. The inclined surface connects the first surface and the second surface and is inclined with respect to the first surface and the second surface.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: October 22, 2019
    Assignee: Genesis Photonics Inc.
    Inventors: Yi-Ru Huang, Tung-Lin Chuang, Yan-Ting Lan, Sheng-Tsung Hsu, Chih-Ming Shen, Jing-En Huang, Teng-Hsien Lai, Hung-Chuan Mai, Kuan-Chieh Huang, Shao-Ying Ting, Cheng-Pin Chen, Wei-Chen Chien, Chih-Chin Cheng, Chih-Hung Tseng
  • Patent number: 10414852
    Abstract: A biomass-based thermoplastic polyurethane is provided. The biomass-based thermoplastic polyurethane is a reaction product of a composition. The composition includes 1-50 parts by weight of a modified lignin, 50-99 parts by weight of a first polyol, and 40-60 parts by weight of a diisocyanate. The modified lignin has an OH value of less than 3.0 mmol/g. The sum of the modified lignin and the first polyol is 100 parts by weight.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: September 17, 2019
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Pin Chuang, Yi-Che Su, Yun-Ya Huang, Chao-Chieh Chiang, Cheng-Han Hsieh
  • Publication number: 20190281716
    Abstract: A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing has a first gap communicating the inner surface and the outer surface, and the metallic housing further includes a second gap and at least one connecting terminal. The first non-conductive spacer is selectively disposed in the first gap of the metallic housing, and extends from a first side of the lateral sides of the metallic housing to the back side of the metallic housing.
    Type: Application
    Filed: May 29, 2019
    Publication date: September 12, 2019
    Applicant: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Patent number: 10367023
    Abstract: In some embodiments, the present disclosure relates to an image sensor integrated chip. The integrated chip has an image sensing element arranged within a pixel region of a substrate. A first dielectric is disposed in trenches within a first side of the substrate. The trenches are defined by first sidewalls disposed on opposing sides of the pixel region. An internal reflection enhancement structure is arranged along the first side of the substrate and is configured to reflect radiation exiting from the substrate back into the substrate.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: July 30, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Keng-Yu Chou, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Wei-Chieh Chiang, Cheng Yu Huang, Wen-Hau Wu, Chih-Kung Chang, Jhy-Jyi Sze
  • Patent number: 10356923
    Abstract: A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, the outer surface of the metallic housing is dyed, the inner surface is substantially a recessed structure, and the metallic housing has a first gap communicating the inner surface and the outer surface, wherein the metallic housing further comprises at least one connecting terminal. The first non-conductive spacer, disposed in the first gap of the metallic housing.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: July 16, 2019
    Assignee: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Publication number: 20190202971
    Abstract: A biomass-based thermoplastic polyurethane is provided. The biomass-based thermoplastic polyurethane is a reaction product of a composition. The composition includes 1-50 parts by weight of a modified lignin, 50-99 parts by weight of a first polyol, and 40-60 parts by weight of a diisocyanate. The modified lignin has an OH value of less than 3.0 mmol/g. The sum of the modified lignin and the first polyol is 100 parts by weight.
    Type: Application
    Filed: December 28, 2017
    Publication date: July 4, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Pin CHUANG, Yi-Che SU, Yun-Ya HUANG, Chao-Chieh CHIANG, Cheng-Han HSIEH
  • Patent number: 10264336
    Abstract: An electronic device including a conductive casing, a conductive sheet, a conductive elastic pad, a circuit board and a sound output unit is provided. The conductive casing has an inner surface and a plurality of through holes extended from the inner surface to the outside of the conductive casing to pass through the conductive casing. The conductive sheet is disposed on the inner surface and covers part of the through holes. The conductive elastic pad is disposed in the conductive casing and contacts the conductive sheet. The circuit board is disposed in the conductive casing and connected with the conductive elastic pad. The sound output unit is disposed in the conductive casing and electrically connected to the circuit board. The sound output unit is adapted to output a sound transmitted to the outside of the electronic device by another part of the through holes. A conductive structure is also provided.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: April 16, 2019
    Assignee: HTC Corporation
    Inventors: Tung-Hsin Yeh, Cheng-Chieh Chuang, Shih-Ming Lin
  • Patent number: 9655261
    Abstract: A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface. A plurality of apertures are formed on the inner surface of the metallic housing. A non-conductive layer is formed on the inner surface of the metallic housing, and part of the non-conductive layer is extended into the apertures. The outer surface of the metallic housing is dyed to form the casing of the electronic device. A casing of an electronic device is also provided.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: May 16, 2017
    Assignee: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin