Patents by Inventor Cheng-Chieh Chuang

Cheng-Chieh Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11805615
    Abstract: A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface and includes a back region and at least one side region. At least one gap, a plurality of apertures and a non-conductive layer are formed on the inner surface of the metallic housing, wherein the apertures is formed on a surface of the at least one gap, part of the non-conductive layer is formed in the at least one gap and extended from the back region to the at least one side region, and part of the non-conductive layer is extended into the apertures. Part of the metallic housing is removed for exposing part of the non-conductive layer, thereby forming a plurality of non-conductive spacers located in the at least one gap.
    Type: Grant
    Filed: July 17, 2022
    Date of Patent: October 31, 2023
    Assignee: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Publication number: 20220354007
    Abstract: A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface and includes a back region and at least one side region. At least one gap, a plurality of apertures and a non-conductive layer are formed on the inner surface of the metallic housing, wherein the apertures is formed on a surface of the at least one gap, part of the non-conductive layer is formed in the at least one gap and extended from the back region to the at least one side region, and part of the non-conductive layer is extended into the apertures. Part of the metallic housing is removed for exposing part of the non-conductive layer, thereby forming a plurality of non-conductive spacers located in the at least one gap.
    Type: Application
    Filed: July 17, 2022
    Publication date: November 3, 2022
    Applicant: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Patent number: 11457535
    Abstract: A metallic housing of an electronic device including an inner surface, an outer surface and a first non-conductive spacer is provided. The outer surface is opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing having a first gap and a second gap substantially located at two opposite ends of the metallic housing and being parallel with each other. The first gap and the second gap each communicates the inner surface and the outer surface. The first non-conductive spacer is disposed the first gap of the metallic housing.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: September 27, 2022
    Assignee: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Patent number: 10952341
    Abstract: A casing of an electronic device including a metallic housing, a first non-conductive spacer and a second non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing having a first gap and a second gap substantially located at two opposite ends of the metallic housing and being parallel with each other. The first non-conductive spacer is disposed the first gap, and the second non-conductive spacer is disposed in the second gap.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: March 16, 2021
    Assignee: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Publication number: 20210076522
    Abstract: A metallic housing of an electronic device including an inner surface, an outer surface and a first non-conductive spacer is provided. The outer surface is opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing having a first gap and a second gap substantially located at two opposite ends of the metallic housing and being parallel with each other. The first gap and the second gap each communicates the inner surface and the outer surface. The first non-conductive spacer is disposed the first gap of the metallic housing.
    Type: Application
    Filed: November 17, 2020
    Publication date: March 11, 2021
    Applicant: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Publication number: 20200305297
    Abstract: A casing of an electronic device including a metallic housing, a first non-conductive spacer and a second non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing having a first gap and a second gap substantially located at two opposite ends of the metallic housing and being parallel with each other. The first non-conductive spacer is disposed the first gap, and the second non-conductive spacer is disposed in the second gap.
    Type: Application
    Filed: June 9, 2020
    Publication date: September 24, 2020
    Applicant: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Patent number: 10729026
    Abstract: A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing has a first gap communicating the inner surface and the outer surface, and the metallic housing further includes a second gap and at least one connecting terminal. The first non-conductive spacer is selectively disposed in the first gap of the metallic housing, and extends from a first side of the lateral sides of the metallic housing to the back side of the metallic housing.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: July 28, 2020
    Assignee: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Publication number: 20190281716
    Abstract: A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing has a first gap communicating the inner surface and the outer surface, and the metallic housing further includes a second gap and at least one connecting terminal. The first non-conductive spacer is selectively disposed in the first gap of the metallic housing, and extends from a first side of the lateral sides of the metallic housing to the back side of the metallic housing.
    Type: Application
    Filed: May 29, 2019
    Publication date: September 12, 2019
    Applicant: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Patent number: 10356923
    Abstract: A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, the outer surface of the metallic housing is dyed, the inner surface is substantially a recessed structure, and the metallic housing has a first gap communicating the inner surface and the outer surface, wherein the metallic housing further comprises at least one connecting terminal. The first non-conductive spacer, disposed in the first gap of the metallic housing.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: July 16, 2019
    Assignee: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Patent number: 10264336
    Abstract: An electronic device including a conductive casing, a conductive sheet, a conductive elastic pad, a circuit board and a sound output unit is provided. The conductive casing has an inner surface and a plurality of through holes extended from the inner surface to the outside of the conductive casing to pass through the conductive casing. The conductive sheet is disposed on the inner surface and covers part of the through holes. The conductive elastic pad is disposed in the conductive casing and contacts the conductive sheet. The circuit board is disposed in the conductive casing and connected with the conductive elastic pad. The sound output unit is disposed in the conductive casing and electrically connected to the circuit board. The sound output unit is adapted to output a sound transmitted to the outside of the electronic device by another part of the through holes. A conductive structure is also provided.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: April 16, 2019
    Assignee: HTC Corporation
    Inventors: Tung-Hsin Yeh, Cheng-Chieh Chuang, Shih-Ming Lin
  • Patent number: 9655261
    Abstract: A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface. A plurality of apertures are formed on the inner surface of the metallic housing. A non-conductive layer is formed on the inner surface of the metallic housing, and part of the non-conductive layer is extended into the apertures. The outer surface of the metallic housing is dyed to form the casing of the electronic device. A casing of an electronic device is also provided.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: May 16, 2017
    Assignee: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Patent number: 9374515
    Abstract: An electronic element supporting base and an electronic device applying the same are provided. The electronic element supporting base comprises a fixing portion and a carrying part. The fixing portion is suitable for being fixed to a frame of the electronic device as a fulcrum for the electronic element supporting base. The carrying part is suitable for carrying a plurality of electronic elements, wherein a gap exists between the carrying part and the frame, and a gap exists between the carrying part and the circuit board. When the electronic device receives an impact, the suspended design of the electronic element supporting base allows the carrying part to oscillate through the gaps, and the electronic element supporting base will not be squeezed, which prevents the electronic elements on the electronic element supporting base from being shifted.
    Type: Grant
    Filed: July 4, 2014
    Date of Patent: June 21, 2016
    Assignee: HTC Corporation
    Inventors: I-Te Chen, Wei-Cheng Liu, Chun Tseng, Jia-Yuan Hsu, Jen-Cheng Lai, Cheng-Chieh Chuang, Chin-Kai Sun
  • Publication number: 20160120052
    Abstract: A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, the outer surface of the metallic housing is dyed, the inner surface is substantially a recessed structure, and the metallic housing has a first gap communicating the inner surface and the outer surface, wherein the metallic housing further comprises at least one connecting terminal. The first non-conductive spacer, disposed in the first gap of the metallic housing.
    Type: Application
    Filed: January 8, 2016
    Publication date: April 28, 2016
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Publication number: 20150249776
    Abstract: An electronic element supporting base and an electronic device applying the same are provided. The electronic element supporting base comprises a fixing portion and a carrying part. The fixing portion is suitable for being fixed to a frame of the electronic device as a fulcrum for the electronic element supporting base. The carrying part is suitable for carrying a plurality of electronic elements, wherein a gap exists between the carrying part and the frame, and a gap exists between the carrying part and the circuit board. When the electronic device receives an impact, the suspended design of the electronic element supporting base allows the carrying part to oscillate through the gaps, and the electronic element supporting base will not be squeezed, which prevents the electronic elements on the electronic element supporting base from being shifted.
    Type: Application
    Filed: July 4, 2014
    Publication date: September 3, 2015
    Inventors: I-Te Chen, Wei-Cheng Liu, Chun Tseng, Jia-Yuan Hsu, Jen-Cheng Lai, Cheng-Chieh Chuang, Chin-Kai Sun
  • Patent number: 9052306
    Abstract: A bio-measuring meter is provided. The bio-measuring meter includes a receptacle receiving a sample strip for the bio-measuring meter; and a figured piece identifying device comprising plural switches for receiving a figured piece, wherein at least one of the plural switches is switched by the figured piece to generate a current signal, and a datum of the sample strip is adjusted by a predefined respective parameter for the current signal.
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: June 9, 2015
    Assignee: BIONIME CORPORATION
    Inventors: Chun-Mu Huang, Mao-Sung Huang, Cheng-Chieh Chuang
  • Publication number: 20140284096
    Abstract: A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface. A plurality of apertures are formed on the inner surface of the metallic housing. A non-conductive layer is formed on the inner surface of the metallic housing, and part of the non-conductive layer is extended into the apertures. The outer surface of the metallic housing is dyed to form the casing of the electronic device. A casing of an electronic device is also provided.
    Type: Application
    Filed: February 19, 2014
    Publication date: September 25, 2014
    Applicant: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Publication number: 20140286523
    Abstract: An electronic device including a conductive casing, a conductive sheet, a conductive elastic pad, a circuit board and a sound output unit is provided. The conductive casing has an inner surface and a plurality of through holes extended from the inner surface to the outside of the conductive casing to pass through the conductive casing. The conductive sheet is disposed on the inner surface and covers part of the through holes. The conductive elastic pad is disposed in the conductive casing and contacts the conductive sheet. The circuit board is disposed in the conductive casing and connected with the conductive elastic pad. The sound output unit is disposed in the conductive casing and electrically connected to the circuit board. The sound output unit is adapted to output a sound transmitted to the outside of the electronic device by another part of the through holes. A conductive structure is also provided.
    Type: Application
    Filed: December 5, 2013
    Publication date: September 25, 2014
    Applicant: HTC Corporation
    Inventors: Tung-Hsin Yeh, Cheng-Chieh Chuang, Shih-Ming Lin
  • Patent number: 8739053
    Abstract: An electronic device includes a housing, a first display unit, a second display unit, a sensing input unit and a processor. The first display unit and the second display unit are both disposed on the housing. The sensing input unit is coupled to the first display unit and the second display unit, and is used for sensing and receiving a user input. The user input enables a transferring behavior of displaying a second object in the second display unit according to a first object displayed in the first display unit. The processor is coupled to the first display unit, the second display unit and the sensing input unit, and is used for controlling the second display unit according to the user input to display the second object.
    Type: Grant
    Filed: October 27, 2008
    Date of Patent: May 27, 2014
    Assignee: HTC Corporation
    Inventors: Ming-Yu Chen, Chao-Yi Chen, Cheng-Chieh Chuang, Chi-Nien Chen
  • Patent number: 8717201
    Abstract: The application provides an electronic device. The electronic device includes a main body and a cover. The main body has a sheet and the sheet includes a first key set and a second key set. The cover, slidably disposed on the main body between a first configuration and a second configuration, includes a first portion and a second portion connected thereto. The first key set is visible through the first portion and the second portion covers the second key set when the cover is in the first configuration, and the second key set is visible through the first portion and the second portion covers the first key set when the cover is in the second configuration.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: May 6, 2014
    Assignee: HTC Corporation
    Inventors: Chih-Wei Tai, Yi-Ching Liu, Cheng-Chieh Chuang, I-Fang Li
  • Patent number: 8508476
    Abstract: Touch-sensitive control systems and methods are provided. The touch-sensitive control system includes a touch interface and a sensor. The touch interface includes a first zone and a second zone having an icon corresponding to a function. The sensor is disposed under the touch interface for detecting contacts on the physical interface. When a contact on the icon of the second zone is detected by the sensor, the corresponding function is activated. When a movement on the first zone is detected by the sensor, an operation corresponding to the function is performed according to the movement.
    Type: Grant
    Filed: July 10, 2009
    Date of Patent: August 13, 2013
    Assignee: HTC Corporation
    Inventors: Yi-Shen Wang, Cheng-Chieh Chuang