Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: An interactive exercise apparatus for guiding a user to perform an exercise includes a display device and a detecting device. The display device is configured to display video imagery which shows an instructor image and at least one motion check image. The motion check image corresponds to a predetermined one of a plurality of body parts of the user, which has a motion guide track and a motion achievement evaluation. The detecting device is configured to detect displacement of the body parts. The motion guide track is displayed on a predetermined position of the video imagery with a predetermined track pattern, corresponding to a movement path of the predetermined body part when the user follows movements demonstrated by the instructor image to perform the exercise. The motion achievement evaluation indicates a matching degree determined according to the displacement of the predetermined body part detected by the detecting device.

Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.

Abstract: A configurable lock device is disclosed. The configurable lock device includes a first latch base, which includes at least two receiving spaces. The two receiving spaces are configured to receive a latch device to secure a computer expansion card. The configurable lock device also includes a connecting element separating the at least two receiving spaces.

Abstract: A tiered locking mechanism secures a component card to a printed circuit board and includes a base, a top slider structure, and a biasing element. The base includes a first-tier side wall and a coupling structure configured to engage the PCB. The top slider structure includes a second-tier side wall along with protrusions having a beveled edge. The top slider structure is slidable between locked and unlocked positions. The unlocked position includes the protrusions being displaced away from a component card engagement side relative to the locked position. A bottom one of the protrusions and the first-tier side wall form a first receiving slot in the locked position. Atop one of the plurality of protrusions and the second-tier wall form a second receiving slot. The biasing element is configured to urge the top slider structure toward the locked position and to compress as the top slider structure moves away from the component card engagement side.

Abstract: A tiered locking mechanism secures a component card to a printed circuit board and includes a base, a top slider structure, and a biasing element. The base includes a first-tier side wall and a coupling structure configured to engage the PCB. The top slider structure includes a second-tier side wall along with protrusions having a beveled edge. The top slider structure is slidable between locked and unlocked positions. The unlocked position includes the protrusions being displaced away from a component card engagement side relative to the locked position. A bottom one of the protrusions and the first-tier side wall form a first receiving slot in the locked position. Atop one of the plurality of protrusions and the second-tier wall form a second receiving slot. The biasing element is configured to urge the top slider structure toward the locked position and to compress as the top slider structure moves away from the component card engagement side.

Abstract: A configurable lock device is disclosed. The configurable lock device includes a first latch base, which includes at least two receiving spaces. The two receiving spaces are configured to receive a latch device to secure a computer expansion card. The configurable lock device also includes a connecting element separating the at least two receiving spaces.

Abstract: A fan guard connector is provided. The fan guard connector includes a fan guard structure configured to be secured to a cooling system. The fan guard connector also includes a lever structure connected to the fan guard structure by a pivot element. The lever structure is configured to rotate between an engaged and a disengaged position. The fan guard connector also includes a connector member configured to secure the lever structure to the fan guard structure in the engaged position.

Abstract: The present disclosure provides for a partition in a chassis, which can transition between at least two positions to receive more than one configuration of modules. The partition can include a first end and a second end, each of which has resting positions adjacent to the chassis body. The partition can further include a middle portion, which is in a raised position above the floor of the chassis body, but can bend flexibly towards the floor. In a first configuration of the chassis, a single, larger module can slide over the partition. In a second configuration of the chassis, two smaller modules can slide into adjacent positions in the chassis body, separated by the partition.

Abstract: The present disclosure is directed to a removable cable arm bracket for attachment to an inner rail of a computer system. The cable arm bracket includes a spring sheet that can be biased for securing and removing the cable arm bracket from the inner rail. The spring sheet secures a projection from the inner rail within an aperture of the cable arm bracket to secure the cable arm bracket to the inner rail. Biasing of the spring sheet allows the projection to be removed from the aperture.

Abstract: A latch having a support bracket having a guide slot formed in a bottom surface. A linkage at least partially received within the guide slot and a handle coupled to the linkage transitionable between an open position and a closed position. A pin releasably coupled to the linkage such that when the handle is in the closed position the pin is coupled to the linkage and in the open position the pin is removable from the linkage. As the handle transitions from the open position to the closed position, the linkage moves within the guide slot.

Abstract: A fan guard connector is provided. The fan guard connector includes a fan guard structure configured to be secured to a cooling system. The fan guard connector also includes a lever structure connected to the fan guard structure by a pivot element. The lever structure is configured to rotate between an engaged and a disengaged position. The fan guard connector also includes a connector member configured to secure the lever structure to the fan guard structure in the engaged position.

Abstract: An assembly bracket coupled to a component for locking and releasing the component with a latch of a component receiving module on a component board. The assembly bracket having a rotary hinge connected to a support bracket, a handle rotatable about the rotatory hinge between a retracted position and a deployed position, a linkage rotatably coupled to the handle, and a support lever coupled to the linkage and having an engagement member to engage the latch. When the handle is in the retracted position, the engagement member is engaged with the latch, thereby securing the component in the component receiving module. When the handle transitions from the retracted position to the deployed position, the support lever applies a force away from the component receiving module to thereby decouple the component from the component receiving module.

Abstract: An assembly bracket coupled to a component for locking and releasing the component with a latch of a component receiving module on a component board. The assembly bracket having a rotary hinge connected to a support bracket, a handle rotatable about the rotatory hinge between a retracted position and a deployed position, a linkage rotatably coupled to the handle, and a support lever coupled to the linkage and having an engagement member to engage the latch. When the handle is in the retracted position, the engagement member is engaged with the latch, thereby securing the component in the component receiving module. When the handle transitions from the retracted position to the deployed position, the support lever applies a force away from the component receiving module to thereby decouple the component from the component receiving module.

Abstract: A latch having a support bracket having a guide slot formed in a bottom surface. A linkage at least partially received within the guide slot and a handle coupled to the linkage transitionable between an open position and a closed position. A pin releasably coupled to the linkage such that when the handle is in the closed position the pin is coupled to the linkage and in the open position the pin is removable from the linkage. As the handle transitions from the open position to the closed position, the linkage moves within the guide slot.

Abstract: A slide rail assembly includes a first rail, a second rail, a third rail, and an extension rail. The second rail can be longitudinally displaced relative to the first rail. The second rail includes a first section and a second section. The third rail is movably connected to the first section of the second rail and can be longitudinally displaced relative to the first rail by the second rail. The extension rail is located at the second section of the second rail.

Abstract: A slide rail assembly includes a first rail, a second rail, a third rail, and an extension rail. The second rail can be longitudinally displaced relative to the first rail. The second rail includes a first section and a second section. The third rail is movably connected to the first section of the second rail and can be longitudinally displaced relative to the first rail by the second rail. The extension rail is located at the second section of the second rail.

Abstract: A cable management device applicable to a rack server includes first and second support arms and a connecting member. The first support arm includes front and rear portions and a first guiding portion located at the front portion of the first support arm. The second support arm includes front and rear portions and a first guiding portion located at the front portion of the second support arm. The connecting member, movably connected between the first and second support arms, includes front and rear guiding portions. The first guiding portion of the first support arm and the first guiding portion of the second support arm are movable along and relative to the front and rear guiding portions of the connecting member respectively.