Patents by Inventor Cheng-Chien Ou

Cheng-Chien Ou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220352448
    Abstract: Provided is a light emitting module, including multiple light emitting units and a multi-layer board. Each light emitting unit includes multiple light emitting elements and side connectors. Each light emitting element includes first and second ends. The light emitting units are disposed on the multi-layer board. The first and second ends of each light emitting element are connected to the side connectors through multiple through holes of the multi-layer board. The first ends of the light emitting elements of first and second light emitting units are electrically connected to each other. The first ends of the light emitting elements of third and fourth light emitting units are electrically connected to each other. The display device using the light emitting module of the disclosure may conduct the adjacent light emitting units to each other through the side connectors, increasing repair possibility and reducing the scrap uncontrolled rate of the display device.
    Type: Application
    Filed: April 11, 2022
    Publication date: November 3, 2022
    Applicant: Optoma Corporation
    Inventors: Cheng-Chien Ou, Chia Yu Li, Shih-Hung Hsu, Kuo-Yuan Hung
  • Publication number: 20220352127
    Abstract: A light-emitting module including multiple light-emitting units and a display device are provided. Each of the light-emitting units includes multiple light-emitting elements. Each of the light-emitting elements includes a first end and a second end. The first ends of the light-emitting elements of a first light-emitting unit and a second light-emitting unit among the light-emitting units are electrically interconnected. The first ends of the light-emitting elements of a third light-emitting unit and a fourth light-emitting unit among the light-emitting units are electrically interconnected. The second end of one of the light-emitting elements of the first light-emitting unit and the second end of one of the light-emitting elements of the corresponding third light-emitting unit are electrically interconnected.
    Type: Application
    Filed: April 7, 2022
    Publication date: November 3, 2022
    Applicant: Optoma Corporation
    Inventors: Cheng-Chien Ou, Chia Yu Li, Shih-Hung Hsu, Kuo-Yuan Hung
  • Publication number: 20200263839
    Abstract: Disclosed is a light emitting diode structure including a substrate, an LED chip and an adhesive material. The LED chip is installed on the substrate, and the adhesive material covers the LED chip to fix the LED chip. A light of the LED chip is emitted to the outside through the adhesive material to form a rectangular light pattern, so that when the light source is lit, a specific rectangular illumination light pattern is formed.
    Type: Application
    Filed: April 28, 2020
    Publication date: August 20, 2020
    Inventors: CHING-HUEI WU, YUNG-CHING HU, CHENG-CHIEN OU, WEI-CHUNG LIN
  • Publication number: 20190093842
    Abstract: Disclosed is a primary optics light source with a rectangular light pattern including a substrate, an LED chip and an encapsulated package. The LED chip is installed on the substrate, and the encapsulated package covers the LED chip to fix the LED chip. A light of the LED chip is emitted to the outside through the encapsulated package to form a rectangular light pattern, so that when the light source is lit, a specific rectangular illumination light pattern is formed.
    Type: Application
    Filed: November 26, 2018
    Publication date: March 28, 2019
    Inventors: Ching-Huei Wu, Yung-Ching Hu, Cheng-Chien Ou, Wei-Chung Lin
  • Publication number: 20170370544
    Abstract: Disclosed is a primary optics light source with a rectangular light pattern including a substrate, an LED chip and an encapsulated package. The LED chip is installed on the substrate, and the encapsulated package covers the LED chip to fix the LED chip. A light of the LED chip is emitted to the outside through the encapsulated package to form a rectangular light pattern, so that when the light source is lit, a specific rectangular illumination light pattern is formed.
    Type: Application
    Filed: November 3, 2016
    Publication date: December 28, 2017
    Inventors: CHING-HUEI WU, YUNG-CHING HU, CHENG-CHIEN OU, WEI-CHUNG LIN
  • Patent number: D786460
    Type: Grant
    Filed: January 14, 2016
    Date of Patent: May 9, 2017
    Assignee: Unity Opto Technology Co., Ltd.
    Inventors: Ching-Huei Wu, Wei-Chung Lin, Yung-Ching Hu, Cheng-Chien Ou
  • Patent number: D787712
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: May 23, 2017
    Assignee: Unity Opto Technology Co., Ltd.
    Inventors: Ching-Huei Wu, Wei-Chung Lin, Yung-Ching Hu, Cheng-Chien Ou