Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.

Abstract: The disclosure provides a method of active immunotherapy for a cancer patient, comprising administering vaccines against Globo series antigens (i.e., Globo H, SSEA-3 and SSEA-4). Specifically, the method comprises administering Globo H-CRM197 (OBI-833/821) in patients with cancer. The disclosure also provides a method of selecting a cancer patient who is suitable as treatment candidate for immunotherapy. Exemplary immune response can be characterized by reduction of the severity of disease, including but not limited to, prevention of disease, delay in onset of disease, decreased severity of symptoms, decreased morbidity and delayed mortality.

Abstract: An apparatus includes a six-axis correction stage, an auto-collimation measurement device, a light splitter, a telecentric image measurement device, and a controller. The six-axis correction stage carries a device under test; the auto-collimation measurement device is arranged above the six-axis correction stage along a measurement optical axis; the light splitter is arranged on the measurement optical axis and is interposed between the six-axis correction stage and the auto-collimation measurement device. A method controls the six-axis correction stage to correct rotation errors in at least two degrees of freedom of the device under test according to a measurement result of the auto-collimation measurement device, and controls the six-axis correction stage to correct translation and yaw errors in at least three degrees of freedom of the device under test according to a measurement result of the telecentric image measurement device by means of the controller.

Abstract: Disclosed is a method for forming a crystalline protective polysilicon layer which does not create defective voids during subsequent processes so as to provide effective protection to devices underneath. In one embodiment, a method for forming a semiconductor device, includes: depositing a protective coating on a first polysilicon layer; forming an epitaxial layer on the protective coating; and depositing a second polysilicon layer over the epitaxial layer, wherein the protective coating comprises a third polysilicon layer, wherein the third polysilicon layer is deposited at a first temperature in a range of 600-700 degree Celsius, and wherein the third polysilicon layer in the protect coating is configured to protect the first polysilicon layer when the second polysilicon layer is etched.

Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

Abstract: Retaining a closed state of an information handling system, including: determining that the information handling system is in a closed state; in response to determining that the information handling system is in the closed state: calculating a tilt of the information handling system; calculating linear motion of the information handling system; determining whether the tilt of the information handling system is greater than a tilt threshold and determining whether the linear motion of the information handling system is greater than a linear motion threshold; and in response to determining that at least one of i) the tilt of the information handling system being greater than the tilt threshold and ii) the linear motion of the information handling system being greater than the linear motion threshold: adjusting a magnetic force of an electromagnet to retain the closed state of the information handling system.

Abstract: A test strip includes a working electrode including a conductive layer and an electro-catalytic layer deposited on the conductive layer. A method for simultaneously detecting a glucose concentration and a percentage of glycated hemoglobin in a single test strip includes following steps: providing a blood sample, providing the aforementioned test strip, performing a sample injecting step, performing an initial step, performing a first detecting step, performing a second detecting step, performing a third detecting step, performing a first analyzing step, and performing a second analysis step.

Abstract: A test strip includes a working electrode including a conductive layer and an electro-catalytic layer deposited on the conductive layer. A method for simultaneously detecting a glucose concentration and a percentage of glycated hemoglobin in a single test strip includes following steps: providing a blood sample, providing the aforementioned test strip, performing a sample injecting step, performing an initial step, performing a first detecting step, performing a second detecting step, performing a third detecting step, performing a first analyzing step, and performing a second analysis step.

Abstract: A manufacturing method of a heat sink is disclosed. A board having a first width is transported to a machine tool. The board is punched to form multiple sheet bodies. A bent part is formed on a terminal end of each sheet body having a second width. A first combined part protrudes from the bent part. A second combined part is hollowly disposed on the edge of the bent part as an indentation corresponding to the first combined part. The bent part is bent to stand correspondingly to each of the sheet bodies. Each sheet body is cut to form multiple heat dissipation fins. The second width is equal to the first width. When the heat dissipation fins overlap with each other, the first combined part of one heat dissipation fin is connected to the second combined part of another dissipation fin.

Abstract: A fastening structure for a fan has a frame which includes a fastening member having a vertical portion fixed to the frame, and an extending portion extending towards the interior of the frame and having a protrusion, where when the fan is assembled with the fastening structure, the fan is rotated along an axle thereof to closely fit the protrusion in an hole of the outer frame of the fan so that the fan can be fixed on the frame.

Abstract: A heat dissipation module includes a heat sink, a two-phase heat exchange device and a supporting element. The two-phase heat exchange device is located between the supporting element and the heat sink. The supporting element receives the two-phase heat exchange device, and the supporting element has a main body including a bottom part and at least two sidewall parts. An accommodating space is formed by the bottom part and the sidewall parts of the main body of the supporting element to receive the two-phase heat exchange device, and the received two-phase heat exchange device is attached to the bottom part of the main body of the supporting element. The two-phase heat exchange device is located and sandwiched between the supporting element and the heat sink.

Abstract: A heat sink includes a plurality of heat dissipation fins. Each of the heat dissipation fins includes a sheet body, at least one bent part, and at least one first combined part. The bent part is formed from a terminal end of the sheet body. The first combined part protrudes from the bent part along a direction opposite to the bent direction of the bent part. A manufacturing method of the heat sink is also disclosed.

Abstract: A heat-dissipating fin assembly including a first fin and a second fin is provided. Each of the first fin and the second fin respectively includes a body, a bending part and a connecting part. The bending part is bent from an end of the body to form a turning portion along a predetermined direction. The connecting part, located near a turning portion of the bending part from the end of the body, extends opposite to the predetermined direction. When the first fin is connected to the second fin, the connecting part of the first fin is connected with the second fin. Also, an assembling method of the heat-dissipating fin assembly is provided.

Abstract: A fastening structure for a fan, comprising a frame which comprises a fastening member comprising a vertical portion fixed to the frame, and an extending portion extending towards the interior of the frame and comprising a protrusion, wherein when the fan is assembled with the fastening structure, the fan is rotated along an axle thereof to closely fit the protrusion in an hole of the outer frame of the fan so that the fan can be fixed on the frame.

Abstract: A composite heat dissipating apparatus includes a heat pipe and at least two heat sinks. The heat sinks are connected to each other. A space for accommodating the heat pipe therein is formed at a connection between the heat sinks. Each of the heat sinks is integrally formed as a single piece.

Abstract: A heat dissipation module includes a heat pipe and at least one thermal conductor. Each of the thermal conductors includes an opening for allowing the heat pipe to pass therethrough. A joining portion extends from an edge of the opening of each of the thermal conductors. The joining portion has a cavity for receiving a solder material. A solder material is disposed in the cavity, and the heat pipe is inserted through the openings. The heat pipe and the thermal conductors are turned over in the reflow process, such that the heat pipe and the thermal conductors are perfectly connected. An assembling method of the heat dissipation module is further provided.