Patents by Inventor Cheng-Chih Yuan

Cheng-Chih Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11993066
    Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: May 28, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Jie Huang, Yu-Ching Lo, Ching-Pin Yuan, Wen-Chih Lin, Cheng-Yu Kuo, Yi-Yang Lei, Ching-Hua Hsieh
  • Publication number: 20080094246
    Abstract: An auto turn-on module at least includes a timer, a logic unit and a memory unit. The timer provides real time data. The logic unit is electronically connected with the timer and has a register, wherein the register stores a state indicator data therein. The memory unit is electronically connected with the logic unit and stores therein a turn-on schedule data. If the real time data and the turn-on schedule data are the same after being compared, a turn-on signal is generated from the logic unit, and the state indicator data stored in the register is changed according to the turn-on schedule data.
    Type: Application
    Filed: November 27, 2006
    Publication date: April 24, 2008
    Applicant: VIA TECHNOLOGIES, INC.
    Inventor: Cheng-Chih Yuan