Abstract: A heat dissipation system of an electronic device including a body, a plurality of heat sources disposed in the body, and at least one centrifugal heat dissipation fan disposed in the body is provided. The centrifugal heat dissipation fan includes a housing and an impeller disposed in the housing on an axis. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions, and the plurality of outlets respectively correspond to the plurality of heat sources.

Abstract: In examples, an electronic device comprises a camera to capture an image of a space and a processor coupled to the camera. The processor is to receive the image of the space from the camera; identify a person in the image and a presentation device in the image; identify a head position of the person based on the image; determine whether the person is viewing the presentation device based on the head position; and perform an action relating to the presentation device based on the determination.

Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.

Abstract: In some embodiments, the present disclosure relates to an integrated chip. The integrated chip may comprise a first metal line disposed over a substrate. A via may be disposed directly over a top of the first metal line and the via may comprise a first lower surface and a second lower surface above the first lower surface. A first dielectric structure may be disposed laterally adjacent to the first metal line and may be disposed along a sidewall of the first metal line. A first protective etch-stop structure may be disposed directly over a top of the first dielectric structure and the first protective etch-stop structure may vertically separate the second lower surface of the via from the top of the first dielectric structure.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.

Abstract: Examples of an integrated circuit with an interconnect structure and a method for forming the integrated circuit are provided herein. In some examples, the method includes receiving a workpiece that includes a substrate and an interconnect structure. The interconnect structure includes a first conductive feature disposed within a first inter-level dielectric layer. A blocking layer is selectively formed on the first conductive feature without forming the blocking layer on the first inter-level dielectric layer. An alignment feature is selectively formed on the first inter-level dielectric layer without forming the alignment feature on the blocking layer. The blocking layer is removed from the first conductive feature, and a second inter-level dielectric layer is formed on the alignment feature and on the first conductive feature. The second inter-level dielectric layer is patterned to define a recess for a second conductive feature, and the second conductive feature is formed within the recess.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller disposed in the housing on an axis is provided. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions. A heat dissipation system of an electronic device is also provided.

Abstract: A robotic arm includes a first driving source and a second driving source mounted on a base frame, a first transmission link driven by the first driving source to turn around a first axis, a second transmission link driven by the second driving source to turn around a second axis that is parallel to the first axis, a third transmission link pivoted to the first transmission link, a first driven link pivoted to the second transmission link, a second driven link pivotally coupled between the first driven link and the base frame, a third driven link pivotally connected with the first and second driven link, and a fourth driven link pivotally coupled between the third driven link and the third transmission link. Thus, the robotic arm of the invention has a compact size and can achieve multi-degree of freedom motion.

Abstract: A method for load estimation and gravity compensation on a robotic arm including a joint is provided, and includes: receiving a first torque signal and a first joint angle when the arm is at a first position and subjected to a current load; generating a first torque value, correction parameters, and no-load and maximum-load torque values; changing the load applied to the arm to an unknown load; receiving a second torque signal and generating a second torque value; estimating an estimated load value of the unknown load; moving the arm to a second position; receiving a second joint angle; and generating a compensating torque value and outputting the compensating torque value to a driver module of the arm.

Abstract: A robotic arm includes a first driving source and a second driving source mounted on a base frame, a first transmission link driven by the first driving source to turn around a first axis, a second transmission link driven by the second driving source to turn around a second axis that is parallel to the first axis, a third transmission link pivoted to the first transmission link, a first driven link pivoted to the second transmission link, a second driven link pivotally coupled between the first driven link and the base frame, a third driven link pivotally connected with the first and second driven link, and a fourth driven link pivotally coupled between the third driven link and the third transmission link. Thus, the robotic arm of the invention has a compact size and can achieve multi-degree of freedom motion.

Abstract: A method for load estimation and gravity compensation on a robotic arm including a joint is provided, and includes: receiving a first torque signal and a first joint angle when the arm is at a first position and subjected to a current load; generating a first torque value, correction parameters, and no-load and maximum-load torque values; changing the load applied to the arm to an unknown load; receiving a second torque signal and generating a second torque value; estimating an estimated load value of the unknown load; moving the arm to a second position; receiving a second joint angle; and generating a compensating torque value and outputting the compensating torque value to a driver module of the arm.

Abstract: A headset test device includes a supporting frame, a drive adjusting system, a head model mechanism and a sensing system. The supporting frame includes a transverse adjusting supporter assembly and a vertical adjusting supporter assembly. The drive adjusting system includes a first motor and a second motor. The transverse adjusting supporter assembly and the vertical adjusting supporter assembly are connected with and are driven by the first motor and the second motor, respectively. The head model mechanism includes a parietal region driven by the second motor to vertically move, and two aural regions driven by the first motor to move close to or away from each other for increasing or reducing a distance between the two aural regions. Each of the two aural regions is equipped with an artificial ear. The sensing system includes a force sensing unit, a pressure sensing unit and a temperature sensing unit.

Abstract: An image forming apparatus includes a photoconductor, a transfer roller, and a power supply for providing a voltage signal for the transfer roller to transfer surface attachments on the transfer roller to the photoconductor. Moreover, before providing the voltage signal for the transfer roller, a surface voltage level of the photoconductor can be adjusted according to the voltage signal in order to ensure that the surface voltage level of the photo conductor can be kept in a safe charging range. Therefore, the transferring efficiency of the transfer roller is ensured and damage to the photo conductor is prevented.