Abstract: A vehicular radar auxiliary jig includes a transverse extensible bar, two longitudinal extensible bars and two upright bars. The longitudinal extensible bars are perpendicularly connected to two ends of the transverse extensible bar, respectively. One end of each longitudinal extensible bar is positioned distal to the transverse extensible bar and provided with a tire securing portion. The upright bars are perpendicularly connected to two ends of the transverse extensible bar and are perpendicular to the longitudinal extensible bars, respectively. One end of each upright bar is positioned distal to the transverse extensible bar and provided with a mounting portion, thereby connecting to an electromagnetic wave component. A vehicular radar mounting method and vehicular radar detecting method, each using the vehicular radar auxiliary jig, are provided.

Abstract: A recycle apparatus includes a conveyor, a flattening device, and a cutting tool. The conveyor includes a first roller and a second roller opposite to each other. The flattening device is located aside the first roller and the second roller. The cutting tool is located aside the flattening device. The flattening device is located between the first roller and the second roller of the conveyor and the cutting tool. The first roller and the second roller is configured to press and feed the photovoltaic module to the flattening device for allowing the photovoltaic module to be flattened by the flattening device, and then the flattened photovoltaic module is fed to the cutting tool by the first roller and the second roller for allowing the back sheet to be separated from the glass sheet assembly by the cutting tool.

Abstract: A vehicular radar auxiliary jig includes a transverse extensible bar, two longitudinal extensible bars and two upright bars. The longitudinal extensible bars are perpendicularly connected to two ends of the transverse extensible bar, respectively. One end of each longitudinal extensible bar is positioned distal to the transverse extensible bar and provided with a tire securing portion. The upright bars are perpendicularly connected to two ends of the transverse extensible bar and are perpendicular to the longitudinal extensible bars, respectively. One end of each upright bar is positioned distal to the transverse extensible bar and provided with a mounting portion, thereby connecting to an electromagnetic wave component. A vehicular radar mounting method and vehicular radar detecting method, each using the vehicular radar auxiliary jig, are provided.

Abstract: The disclosure provides a recycle apparatus. The recycle apparatus is configured to separate a back sheet and a glass sheet assembly of a photovoltaic module. The recycle apparatus includes a conveyor, a flattening device, and a cutting tool. The conveyor includes a first roller and a second roller opposite to each other. The flattening device is located aside the first roller and the second roller. The cutting tool is located aside the flattening device. The flattening device is located between the first roller and the second roller of the conveyor and the cutting tool. The first roller and the second roller is configured to clamp the photovoltaic module and to feed the photovoltaic module to the flattening device configured to flatten the photovoltaic module and to the cutting tool configured to separate the back sheet from the glass sheet assembly.

Abstract: An electric conduction heat dissipation substrate includes a ceramic substrate, and a seed layer, and a buffering material layer and a copper circuit layer formed thereon in order. The buffering material layer has a coefficient of thermal expansion between those of the ceramic substrate and the copper circuit layer. Moreover, the buffering material layer is composed of alloy material and ceramic material or composed of metal material and ceramic material.

Abstract: An electric conduction heat dissipation substrate includes a ceramic substrate, and a seed layer, and a buffering material layer and a copper circuit layer formed thereon in order. The buffering material layer has a coefficient of thermal expansion between those of the ceramic substrate and the copper circuit layer. Moreover, the buffering material layer is composed of alloy material and ceramic material or composed of metal material and ceramic material.

Abstract: A heat sinking element and a method of treating a heat sinking element are provided. The heat sinking element includes a metal substrate. The metal substrate is mainly composed of aluminium. A surface of the metal substrate has a plurality of micro-nano holes and a diameter of the micro-nano holes is smaller than 300 nm. The method of treating a heat sinking element includes performing an oxidation process and an etching process on the metal substrate so as to form the plurality of micro-nano holes.

Abstract: A thermoelectric module includes a first and a second substrates, plural thermoelectric elements, plural first and second metal electrodes, plural first and second solder layers, and spacers. The thermoelectric elements are disposed between the first and second substrates, and each pair includes a P-type and an N-type thermoelectric elements. An N-type thermoelectric element is electrically connected to the other P-type thermoelectric element of the adjacent pair of thermoelectric element by the second metal electrode. The first metal electrodes and the lower end surfaces of the P/N type thermoelectric elements are jointed by the first solder layers. The second metal electrodes and the upper end surfaces of the P/N type thermoelectric elements are jointed by the second solder layers. The spacers are positioned at one of the first and second solder layers. The melting point of the spacer is higher than the liquidus temperatures of the first and second solder layers.

Abstract: A heat sinking element and a method of treating a heat sinking element are provided. The heat sinking element includes a metal substrate. The metal substrate is mainly composed of aluminium. A surface of the metal substrate has a plurality of micro-nano holes and a diameter of the micro-nano holes is smaller than 300 nm. The method of treating a heat sinking element includes performing an oxidation process and an etching process on the metal substrate so as to form the plurality of micro-nano holes.