Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.

Abstract: An electronic device includes a substrate, a first silicon transistor, a second silicon transistor and a first oxide semiconductor transistor. The first silicon transistor, the second silicon transistor and the first oxide semiconductor transistor are disposed on the substrate. The first silicon transistor has a first terminal electrically connected to a first voltage level, a second terminal and a control terminal. The second silicon transistor has a first terminal electrically connected to the second terminal of the first silicon transistor, a second terminal electrically connected to a second voltage level, and a control terminal electrically connected to the control terminal of the first silicon transistor. The first oxide semiconductor transistor has a first terminal electrically connected to the first terminal of the second silicon transistor. Wherein, a voltage value of the first voltage level is greater than a voltage value of the second voltage level.

Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

Abstract: According to an exemplary embodiment, a method of forming a vertical device is provided. The method includes: providing a protrusion over a substrate; forming an etch stop layer over the protrusion; laterally etching a sidewall of the etch stop layer; forming an insulating layer over the etch stop layer; forming a film layer over the insulating layer and the etch stop layer; performing chemical mechanical polishing on the film layer and exposing the etch stop layer; etching a portion of the etch stop layer to expose a top surface of the protrusion; forming an oxide layer over the protrusion and the film layer; and performing chemical mechanical polishing on the oxide layer and exposing the film layer.

Abstract: Disclosed are methods and systems for improving actuator performance by reducing tensile stresses in piezoelectric thin films. In one embodiment, a piezoelectric actuator includes a substrate, a first electrode positioned on the substrate, a piezoelectric thin film positioned on the first electrode, and a second electrode positioned on the piezoelectric thin film. The displacement capability of the actuator is enhanced by reducing the tensile stresses of the piezoelectric thin film. In some embodiments, a constant DC voltage applied to the piezoelectric actuator generates compressive in-plane stresses, which counteract the tensile in-plane stresses. As a result, the overall tensile stresses in the actuator are reduced, and the actuator displacement is improved.

Abstract: An energy-saving heat pump device includes first, second, third, and fourth pipes connected in sequence in a loop. A condenser is mounted between the first and second pipes. An expansion valve is mounted between the second and third pipes. An evaporator is mounted between the third and fourth pipes. A compressor is mounted between the first and fourth pipes. The compressor compresses and outputs a coolant mixture including at least two coolants. The coolant mixture in the first pipe has a pressure of 24-30 kg/cm2G and a temperature of 80-125° C. The coolant mixture produces heat while the coolant mixture passes through the condenser. A temperature of water outputted from the condenser is in a range of 45-98° C. The coolant mixture produces cold energy for a cooling medium of the evaporator while the coolant mixture passes through the second pipe, the expansion valve, the third pipe, and the evaporator.

Abstract: A heat recovery generator system (1) includes a boiler (11) converting water into high-pressure steam that passes through a steam pipe (12), a turbine (13), a first pipe (10), a condenser (15), and a second pipe (102) in sequence. The steam condenses into water after passing through the condenser (15). The condensed water passes through a water pump (16), a water supply pipe (17), and a heater (18) to the boiler (11). A latent heat recovery device (2) includes a compressor (21) that outputs a coolant moving along a coolant pipe (22) passing in sequence through a first heat exchanger device (23) and a second heat exchanger device (25) and then returning to the compressor (21). A third pipe (103) branches from the first pipe (101) and is connected to a fourth pipe (104) via the second heat exchanger device (25). The coolant absorbs heat from the steam via the second heat exchanger device (25). Heat recovery water absorbs the heat released from the coolant through the first heat exchanger device (23).

Abstract: A physiological signal sensing system and a physiological signal sensing method applied in any time and place are disclosed. The present invention is used by applying wireless transmitting electrocardiogram (ECG) data and contactless charging so as to achieve the purpose of sensing physiological signals without any time and place constraints.