Patents by Inventor Cheng-Chung Lai

Cheng-Chung Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11979980
    Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: May 7, 2024
    Assignee: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Patent number: 11937370
    Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: March 19, 2024
    Assignee: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Patent number: 11742610
    Abstract: The disclosure provides an electric connector, which includes a base, a cover, and an elastic member. The cover covers the base and is formed with a chamber. The cover is disposed with a key and a trough. The elastic member is disposed in the chamber and includes a lower plate, an upper plate, and a flexible arm. The lower plate is fixed on the base. The upper plate is formed above the lower plate. The flexible arm is connected between the lower plate and the upper plate. The upper plate is extended with a hook. The hook movably enters or leaves each trough. The upper plate is disposed with a pressed portion corresponding to the key in position. The pressed portion drives each hook to move out from each trough through pressing of the key so as to implement unlatching of the electric connector.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: August 29, 2023
    Assignee: JESS-LINK PRODUCTS CO., LTD.
    Inventors: Hsu-Feng Chang, Ya-Fen Kao, Cheng-Chung Lai, Siang-Ting Wang
  • Publication number: 20230155315
    Abstract: The disclosure provides an electric connector, which includes a base, a cover, and an elastic member. The cover covers the base and is formed with a chamber. The cover is disposed with a key and a trough. The elastic member is disposed in the chamber and includes a lower plate, an upper plate, and a flexible arm. The lower plate is fixed on the base. The upper plate is formed above the lower plate. The flexible arm is connected between the lower plate and the upper plate. The upper plate is extended with a hook. The hook movably enters or leaves each trough. The upper plate is disposed with a pressed portion corresponding to the key in position. The pressed portion drives each hook to move out from each trough through pressing of the key so as to implement unlatching of the electric connector.
    Type: Application
    Filed: December 20, 2021
    Publication date: May 18, 2023
    Inventors: Hsu-Feng CHANG, Ya-Fen KAO, Cheng-Chung LAI, Siang-Ting WANG
  • Patent number: 11450986
    Abstract: A connector with a pressing mechanism, and the connector includes a foundation, a latch mechanism, a release mechanism, and a cover. The foundation includes two position limiting parts and two accommodating spaces are arranged on two edges of the foundation. The latch mechanism includes a base arranged on the foundation, and the base includes a fixing part fixed in a fixing hole, and two latches are arranged in the accommodating spaces of two edges of the base. The release mechanism is assembled between the two position limiting parts, and the front end of a handle of the release mechanism is extended with a protruding part, and the bottom of the protruding part is a concave bottom. The cover is assembled on the foundation, and the cover includes an opening, and the pressing mechanism is located in the opening corresponding to the through hole and connected to the cover.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: September 20, 2022
    Assignee: JESS-LINK PRODUCTS CO., LTD.
    Inventor: Cheng-Chung Lai
  • Publication number: 20220190514
    Abstract: A connector with a pressing mechanism, and the connector includes a foundation, a latch mechanism, a release mechanism, and a cover. The foundation includes two position limiting parts and two accommodating spaces are arranged on two edges of the foundation. The latch mechanism includes a base arranged on the foundation, and the base includes a fixing part fixed in a fixing hole, and two latches are arranged in the accommodating spaces of two edges of the base. The release mechanism is assembled between the two position limiting parts, and the front end of a handle of the release mechanism is extended with a protruding part, and the bottom of the protruding part is a concave bottom. The cover is assembled on the foundation, and the cover includes an opening, and the pressing mechanism is located in the opening corresponding to the through hole and connected to the cover.
    Type: Application
    Filed: July 6, 2021
    Publication date: June 16, 2022
    Inventor: Cheng-Chung LAI
  • Publication number: 20210400805
    Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.
    Type: Application
    Filed: September 1, 2021
    Publication date: December 23, 2021
    Applicant: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Publication number: 20210385943
    Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.
    Type: Application
    Filed: August 19, 2021
    Publication date: December 9, 2021
    Applicant: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Patent number: 11147157
    Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: October 12, 2021
    Assignee: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Patent number: 11140773
    Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: October 5, 2021
    Assignee: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Patent number: 10950961
    Abstract: A card edge connector structure includes an insulating case, a terminal assembly, a first grounding sheet and a second grounding sheet. The terminal assembly includes a first terminal set and a second terminal set and is configured in the insulating case. The first grounding sheet is configured between the insulating case and the first terminal set, and the second grounding sheet is configured between the insulating case and the second terminal set. A first arm of the first grounding sheet contacts the first grounding terminal through a first groove of a first terminal fixing component, and a second arm of the second grounding sheet contacts the second grounding terminal through a second groove of a second terminal fixing component.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: March 16, 2021
    Assignee: JESS-LINK PRODUCTS CO., LTD.
    Inventors: Cheng-Chung Lai, Ya-Fen Kao, Tung-Huan Hsieh, Chieh-Ming Cheng
  • Publication number: 20200328541
    Abstract: A card edge connector structure includes an insulating case, a terminal assembly, a first grounding sheet and a second grounding sheet. The terminal assembly includes a first terminal set and a second terminal set and is configured in the insulating case. The first grounding sheet is configured between the insulating case and the first terminal set, and the second grounding sheet is configured between the insulating case and the second terminal set. A first arm of the first grounding sheet contacts the first grounding terminal through a first groove of a first terminal fixing component, and a second arm of the second grounding sheet contacts the second grounding terminal through a second groove of a second terminal fixing component.
    Type: Application
    Filed: November 7, 2019
    Publication date: October 15, 2020
    Inventors: CHENG-CHUNG LAI, YA-FEN KAO, TUNG-HUAN HSIEH, CHIEH-MING CHENG
  • Publication number: 20200305276
    Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.
    Type: Application
    Filed: June 8, 2020
    Publication date: September 24, 2020
    Applicant: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Publication number: 20200305275
    Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.
    Type: Application
    Filed: June 8, 2020
    Publication date: September 24, 2020
    Applicant: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Patent number: 10729007
    Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: July 28, 2020
    Assignee: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Publication number: 20200205283
    Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.
    Type: Application
    Filed: April 18, 2019
    Publication date: June 25, 2020
    Applicant: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Patent number: 9331421
    Abstract: A waterproof electric connector module includes an insulated housing, an electric connector, a blocking plate, and a sealed structure. The insulated housing is formed in an elongated shape. A front entry and a rear entry are individually formed on two end sides of the insulated housing and disposed aligned with each other. A side opening is formed on a side of the insulated housing and communicates with the rear entry. The electric connector is disposed in the insulated housing and has a plurality of terminals which extend and protrude from the side opening. The blocking plate blocks the rear entry. The sealed structure fills and seals the side opening. The terminals individually penetrate through the sealed structure. The waterproof housing can be sealed through the blocking plate and the sealed structure.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: May 3, 2016
    Assignee: JESS-LINK PRODUCTS CO., LTD.
    Inventor: Cheng-Chung Lai
  • Patent number: 9325128
    Abstract: An electrical connector includes an insulation main body and a plurality of conductive terminals. The insulation main body is formed with a tongue. The tongue is formed with a first surface and a second surface opposite to the first surface. Each of the conductive terminals is installed in the tongue. Each of the conductive terminals is formed with a first contact part, a second contact part and a solder part. The first contact part is exposed on the first surface, and the second contact part is exposed on the second surface. The solder part is vertically connected to the first contact part or the second contact part and protruded out of the tongue. Accordingly, the electrical connector complying with the USB Type-C specification, allowing conductive terminals having the same definitions to be integrated and being specially used for power delivery is provided.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: April 26, 2016
    Assignee: JESS-LINK PRODUCTS CO., LTD.
    Inventors: Chun-Fu Chen, Yun-Chang Yang, Cheng-Chung Lai
  • Patent number: D986186
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: May 16, 2023
    Assignee: JESS-LINK PRODUCTS CO., LTD.
    Inventor: Cheng-Chung Lai
  • Patent number: D1081404
    Type: Grant
    Filed: December 29, 2023
    Date of Patent: July 1, 2025
    Assignee: Melnor, Inc.
    Inventors: Trenten George, Cheng-Chung Lai