Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes providing a substrate for an interposer, and forming a conductive interconnect structure in and on the substrate for connecting a group of selected IC dies. The method includes forming warpage-reducing trenches in non-routing regions of the interposer, wherein the warpage-reducing trenches are sized and positioned based on a warpage characteristic to reduce the warpage of the chip package structure. The method also includes depositing a warpage-relief material in the warpage-reducing trenches according to the warpage characteristic to reduce the warpage of the chip package structure, and bonding the group of selected IC dies to the interposer to form a chip package structure.

Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.

Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.

Abstract: The disclosure provides an electric connector, which includes a base, a cover, and an elastic member. The cover covers the base and is formed with a chamber. The cover is disposed with a key and a trough. The elastic member is disposed in the chamber and includes a lower plate, an upper plate, and a flexible arm. The lower plate is fixed on the base. The upper plate is formed above the lower plate. The flexible arm is connected between the lower plate and the upper plate. The upper plate is extended with a hook. The hook movably enters or leaves each trough. The upper plate is disposed with a pressed portion corresponding to the key in position. The pressed portion drives each hook to move out from each trough through pressing of the key so as to implement unlatching of the electric connector.

Abstract: The disclosure provides an electric connector, which includes a base, a cover, and an elastic member. The cover covers the base and is formed with a chamber. The cover is disposed with a key and a trough. The elastic member is disposed in the chamber and includes a lower plate, an upper plate, and a flexible arm. The lower plate is fixed on the base. The upper plate is formed above the lower plate. The flexible arm is connected between the lower plate and the upper plate. The upper plate is extended with a hook. The hook movably enters or leaves each trough. The upper plate is disposed with a pressed portion corresponding to the key in position. The pressed portion drives each hook to move out from each trough through pressing of the key so as to implement unlatching of the electric connector.

Abstract: A connector with a pressing mechanism, and the connector includes a foundation, a latch mechanism, a release mechanism, and a cover. The foundation includes two position limiting parts and two accommodating spaces are arranged on two edges of the foundation. The latch mechanism includes a base arranged on the foundation, and the base includes a fixing part fixed in a fixing hole, and two latches are arranged in the accommodating spaces of two edges of the base. The release mechanism is assembled between the two position limiting parts, and the front end of a handle of the release mechanism is extended with a protruding part, and the bottom of the protruding part is a concave bottom. The cover is assembled on the foundation, and the cover includes an opening, and the pressing mechanism is located in the opening corresponding to the through hole and connected to the cover.

Abstract: A connector with a pressing mechanism, and the connector includes a foundation, a latch mechanism, a release mechanism, and a cover. The foundation includes two position limiting parts and two accommodating spaces are arranged on two edges of the foundation. The latch mechanism includes a base arranged on the foundation, and the base includes a fixing part fixed in a fixing hole, and two latches are arranged in the accommodating spaces of two edges of the base. The release mechanism is assembled between the two position limiting parts, and the front end of a handle of the release mechanism is extended with a protruding part, and the bottom of the protruding part is a concave bottom. The cover is assembled on the foundation, and the cover includes an opening, and the pressing mechanism is located in the opening corresponding to the through hole and connected to the cover.

Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

Abstract: A card edge connector structure includes an insulating case, a terminal assembly, a first grounding sheet and a second grounding sheet. The terminal assembly includes a first terminal set and a second terminal set and is configured in the insulating case. The first grounding sheet is configured between the insulating case and the first terminal set, and the second grounding sheet is configured between the insulating case and the second terminal set. A first arm of the first grounding sheet contacts the first grounding terminal through a first groove of a first terminal fixing component, and a second arm of the second grounding sheet contacts the second grounding terminal through a second groove of a second terminal fixing component.

Abstract: A card edge connector structure includes an insulating case, a terminal assembly, a first grounding sheet and a second grounding sheet. The terminal assembly includes a first terminal set and a second terminal set and is configured in the insulating case. The first grounding sheet is configured between the insulating case and the first terminal set, and the second grounding sheet is configured between the insulating case and the second terminal set. A first arm of the first grounding sheet contacts the first grounding terminal through a first groove of a first terminal fixing component, and a second arm of the second grounding sheet contacts the second grounding terminal through a second groove of a second terminal fixing component.

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

Abstract: A waterproof electric connector module includes an insulated housing, an electric connector, a blocking plate, and a sealed structure. The insulated housing is formed in an elongated shape. A front entry and a rear entry are individually formed on two end sides of the insulated housing and disposed aligned with each other. A side opening is formed on a side of the insulated housing and communicates with the rear entry. The electric connector is disposed in the insulated housing and has a plurality of terminals which extend and protrude from the side opening. The blocking plate blocks the rear entry. The sealed structure fills and seals the side opening. The terminals individually penetrate through the sealed structure. The waterproof housing can be sealed through the blocking plate and the sealed structure.