Patents by Inventor Cheng-Chung Su

Cheng-Chung Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11979980
    Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: May 7, 2024
    Assignee: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Patent number: 11937370
    Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: March 19, 2024
    Assignee: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Patent number: 4677700
    Abstract: A hospital bed with a built-in toilet to be used in conjunction with disposable sanitary diaper funnels which comprises a mattress with a recess in its center portion, a ring shaped comfort cushion for sitting on while using the bathroom which fits into the recess, pipes for channeling wastes into a waste container, a water line which carries heated water from a tank to a spray nozzle which automatically cleans the anal area after defecation, an air dryer for drying the anal area after cleaning, a power switch for turning the dryer on and off, and a power switch for turning the water on and off.
    Type: Grant
    Filed: March 10, 1986
    Date of Patent: July 7, 1987
    Inventor: Cheng-Chung Su